Abstract: A signal processing system for a sensor. The system comprises a digital signal processing system configured to set a drive signal frequency for the primary drive transducer, a voltage controlled oscillator configured to receive an input indicative of the resonant frequency and to generate a first periodic signal at a first multiple of the resonant frequency, and a first phase locked loop, configured to receive the first periodic signal, and to generate a second periodic signal at a second multiple of the resonant frequency. The first and second periodic signals are used to control the operation of an analog-to-digital converter (ADC) configured to sample the primary pick off signal and a digital-to-analog converter (DAC) configured to generate a drive signal waveform applied to the primary drive transducer.

Abstract: A signal processing system for a sensor. The system comprises a digital signal processing system configured to set a drive signal frequency for the primary drive transducer, a voltage controlled oscillator configured to receive an input indicative of the resonant frequency and to generate a first periodic signal at a first multiple of the resonant frequency, and a first phase locked loop, configured to receive the first periodic signal, and to generate a second periodic signal at a second multiple of the resonant frequency. The first and second periodic signals are used to control the operation of an analog-to-digital converter (ADC) configured to sample the primary pick off signal and a digital-to-analog converter (DAC) configured to generate a drive signal waveform applied to the primary drive transducer.

Abstract: A vibrating structure angular rate sensor includes a mount, a planar vibrating structure and a plurality of compliant supports extending between the mount and the planar vibrating structure to support the vibrating structure thereby allowing the planar vibrating structure to oscillate in its plane relative to the mount in response to an electrical excitation. A first set of transducers is arranged on the planar vibrating structure to apply, in use, an electrical excitation to the planar vibrating structure and to sense, in use, motion resulting from oscillation of the planar vibrating structure in its plane. A plurality of capacitive regions is fixed at a distance from the planar vibrating structure in its plane. The capacitive regions form a second set of transducers configured to apply, in use, an electrostatic force to the planar vibrating structure which induces a change in the frequency of oscillation of the planar vibrating structure.

Abstract: A method for closed loop operation of a capacitive accelerometer includes applying a first drive signal V1 to a first fixed capacitive electrode and a second drive signal V2 to a second fixed capacitive electrode the first and second drive signals each having a periodic waveform varying in amplitude between zero and a maximum value Vref and sensing a displacement of the proof mass and applying pulse width modulation to the first and second drive signals with a constant frequency fmod and a variable mark/space ratio. The method also includes applying a voltage offset Vref/2 to the proof mass and applying the pulse width modulation such that the first and second drive signals have a waveform that varies so that when either one of the first and second drive signals is at Vref or zero the other drive voltage is at Vref/2.

Abstract: A method of manufacturing an inertial measurement unit (IMU) comprises fabricating a plurality of individual MEMS inertial sensor packages at a package level as sealed packages containing a MEMS inertial sensor chip and an integrated circuit electrically connected together. Fabricating the individual MEMS inertial sensor packages comprises forming mechanical interconnect features in each package and assembling the IMU by mechanically interconnecting each individual MEMS inertial sensor package with another individual MEMS inertial sensor package in a mutually orthogonal orientation.

Abstract: An micro electro mechanical sensor comprising: a substrate; and a sensor element movably mounted to a first side of said substrate; wherein a second side of said substrate has a pattern formed in relief thereon. The pattern formed in relief on the second side of the substrate provides a reduced surface area for contact with the die bond layer. The reduced surface area reduces the amount of stress that is transmitted from the die bond layer to the substrate (and hence reduces the amount of transmitted stress reaching the MEMS sensor element). Because the substrate relief pattern provides a certain amount of stress decoupling, the die bond layer does not need to decouple the stress to the same extent as in previous designs. Therefore a thinner die bond layer can be used, which in turn allows the whole package to be slightly thinner.

Abstract: A method for closed loop operation of a capacitive accelerometer includes applying a first drive signal V1 to a first fixed capacitive electrode and a second drive signal V2 to a second fixed capacitive electrode the first and second drive signals each having a periodic waveform varying in amplitude between zero and a maximum value Vref and sensing a displacement of the proof mass and applying pulse width modulation to the first and second drive signals with a constant frequency fmod and a variable mark/space ratio. The method also includes applying a voltage offset Vref/2 to the proof mass and applying the pulse width modulation such that the first and second drive signals have a waveform that varies so that when either one of the first and second drive signals is at Vref or zero the other drive voltage is at Vref/2.

Abstract: A vibrating structure angular rate sensor is provided which comprises a substrate; a plurality of flexible supporting structures fixed to the substrate; an annular member which is flexibly supported by the plurality of supporting structures to move elastically relative to the substrate; and an electrical drive system configured to drive the annular member to oscillate in a primary mode of oscillation with a resonant frequency f1. The plurality of supporting structures comprises at least one active supporting structure which carries an active electrical connection from the annular member to the drive system; and at least one passive supporting structure which does not carry an active electrical connection from the annular member to the drive system.

Abstract: A method for closed loop operation of a capacitive accelerometer uses a single current source (62) and a single current sink (64) to apply an in-phase drive signal V1? to a first set of fixed capacitive electrode fingers and a corresponding anti-phase drive signal V2? to a second set of fixed capacitive electrode fingers. This provides a net electrostatic restoring force on the proof mass for balancing the inertial force of the applied acceleration and maintains the proof mass at a null position.

Abstract: There is provided a method of sensing a rotation rate using a vibrating structure gyroscope, said gyroscope comprising an electronic control system comprising one or more control loops, wherein at least one of said control loops comprises a filter having a variable time constant, said method comprising the steps of: determining or estimating a characteristic of the vibrating structure of said gyroscope; and adapting or varying said time constant of said filter with the determined or estimated characteristic of said vibrating structure.

Abstract: A digitally controlled voltage controlled oscillator comprising an Nbit digital to analogue convertor arranged to receive a frequency change demand signal as a digital Nbit word, and having an output provided via an integrator to a voltage controlled oscillator configured to provide a frequency output.

Abstract: A vibrating structure gyroscope includes an annular resonator arranged to vibrate in a plane in response to electrostatic driving forces and a set of capacitive drive electrodes arranged to apply a voltage creating an electrostatic driving force to excite a primary cos n? resonance along a primary axis at a primary frequency fP, such that Coriolis forces, resulting from an angular rate applied about an out-of-plane axis, induce a secondary cos n? resonance along a secondary axis at a secondary frequency fS. The gyroscope also includes digitally-controlled first and second sets to creating a static electrostatic balancing.

Abstract: In a method for open loop operation of a capacitive accelerometer, a first mode of operation comprises electrically measuring a deflection of a proof mass (204) from the null position under an applied acceleration using a pickoff amplifier (206) set to a reference voltage Vcm. A second mode of operation comprises applying electrostatic forces in order to cause the proof mass (204) to deflect from the null position, and electrically measuring the forced deflection so caused. In the second mode of operation the pickoff amplifier (206) has its input (211) switched from Vcm to Vss, using a reference control circuit (209), so that drive amplifiers (210) can apply different voltages Vdd to the proof mass (204) and associated fixed electrodes (202).

Abstract: A method for closed loop operation of a capacitive accelerometer uses a single current source and a single current sink to apply an in-phase drive signal V1? to a first set of fixed capacitive electrode fingers and a corresponding anti-phase drive signal V2? to a second set of fixed capacitive electrode fingers. This provides a net electrostatic restoring force on the proof mass for balancing the inertial force of the applied acceleration and maintains the proof mass at a null position.

Abstract: A method of manufacturing an inertial measurement unit (IMU) comprises fabricating a plurality of individual MEMS inertial sensor packages at a package level as sealed packages containing a MEMS inertial sensor chip and an integrated circuit electrically connected together. Fabricating the individual MEMS inertial sensor packages comprises forming mechanical interconnect features in each package and assembling the IMU by mechanically interconnecting each individual MEMS inertial sensor package with another individual MEMS inertial sensor package in a mutually orthogonal orientation.

Abstract: A vibrating structure angular rate sensor is provided which comprises a substrate; a plurality of flexible supporting structures fixed to the substrate; an annular member which is flexibly supported by the plurality of supporting structures to move elastically relative to the substrate; and an electrical drive system configured to drive the annular member to oscillate in a primary mode of oscillation with a resonant frequency f1. The plurality of supporting structures comprises at least one active supporting structure which carries an active electrical connection from the annular member to the drive system; and at least one passive supporting structure which does not carry an active electrical connection from the annular member to the drive system.

Abstract: A vibrating structure gyroscope includes an annular resonator arranged to vibrate in a plane in response to electrostatic driving forces and a set of capacitive drive electrodes arranged to apply a voltage creating an electrostatic driving force to excite a primary cos n? resonance along a primary axis at a primary frequency fP, such that Coriolis forces, resulting from an angular rate applied about an out-of-plane axis, induce a secondary cos n? resonance along a secondary axis at a secondary frequency fS. The gyroscope also includes digitally-controlled first and second sets to creating a static electrostatic balancing.

Abstract: A method for closed loop operation of a capacitive accelerometer comprising: a proof mass; first and second sets of both fixed and moveable capacitive electrode fingers, interdigitated with each other; the method comprising: applying PWM drive signals to the fixed fingers; sensing displacement of the proof mass and changing the mark:space ratio of the PWM drive signals, to provide a restoring force on the proof mass that balances the inertial force of the applied acceleration and maintains the proof mass at a null position; detecting when the mark:space ratio for the null position is beyond a predetermined upper or lower threshold; and further modulating the PWM drive signals by extending or reducing x pulses in every y cycles, where x>1 and y>1, to provide an average mark:space ratio beyond the upper or lower threshold without further increasing or decreasing the mark length of the other pulses.

Abstract: A successive approximation Analog to Digital Converter (ADC), comprising: a sample and hold device arranged to sample and hold an input signal at the beginning of a conversion cycle; a successive approximation register that sequentially builds up a digital output from its most significant bit to its least significant bit; a digital to analog converter that outputs a signal based on the output of the successive approximation register; a comparator that compares the output of the digital to analog converter with an output of the sample and hold device and supplies its output to the successive approximation register; and a residual signal storage device arranged to store the residual signal at the end of a conversion cycle; and wherein the successive approximation ADC is arranged to add the stored residual signal from the residual signal storage device to the input signal stored on the sample and hold device at the start of each conversion cycle.

Abstract: An micro electro mechanical sensor comprising: a substrate; and a sensor element movably mounted to a first side of said substrate; wherein a second side of said substrate has a pattern formed in relief thereon. The pattern formed in relief on the second side of the substrate provides a reduced surface area for contact with the die bond layer. The reduced surface area reduces the amount of stress that is transmitted from the die bond layer to the substrate (and hence reduces the amount of transmitted stress reaching the MEMS sensor element). Because the substrate relief pattern provides a certain amount of stress decoupling, the die bond layer does not need to decouple the stress to the same extent as in previous designs. Therefore a thinner die bond layer can be used, which in turn allows the whole package to be slightly thinner.