Patents by Inventor Kevin Von Essen
Kevin Von Essen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240042755Abstract: A fluid ejection apparatus includes a plurality of fluid ejectors. Each fluid ejector includes a pumping chamber, and an actuator configured to cause fluid to be ejected from the pumping chamber. The fluid ejection apparatus includes a feed channel fluidically connected to each pumping chamber; and at least one compliant structure formed in a surface of the feed channel. The at least one compliant structure has a lower compliance than the surface of the feed channel.Type: ApplicationFiled: October 12, 2023Publication date: February 8, 2024Inventors: Christoph Menzel, Kevin von Essen, Steven H. Barss, Mats G. Ottosson, Darren T. Imai
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Patent number: 11865837Abstract: A fluid ejection apparatus includes a plurality of fluid ejectors. Each fluid ejector includes a pumping chamber, and an actuator configured to cause fluid to be ejected from the pumping chamber. The fluid ejection apparatus includes a feed channel fluidically connected to each pumping chamber; and at least one compliant structure formed in a surface of the feed channel. The at least one compliant structure has a lower compliance than the surface of the feed channel.Type: GrantFiled: October 13, 2022Date of Patent: January 9, 2024Assignee: FUJIFILM Dimatix, Inc.Inventors: Christoph Menzel, Kevin von Essen, Steven H. Barss, Mats G. Ottosson, Darren T. Imai
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Publication number: 20230036902Abstract: A fluid ejection apparatus includes a plurality of fluid ejectors. Each fluid ejector includes a pumping chamber, and an actuator configured to cause fluid to be ejected from the pumping chamber. The fluid ejection apparatus includes a feed channel fluidically connected to each pumping chamber; and at least one compliant structure formed in a surface of the feed channel. The at least one compliant structure has a lower compliance than the surface of the feed channel.Type: ApplicationFiled: October 13, 2022Publication date: February 2, 2023Inventors: Christoph Menzel, Kevin von Essen, Steven H. Barss, Mats G. Ottosson, Darren T. Imai
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Patent number: 11498330Abstract: A fluid ejection apparatus includes a plurality of fluid ejectors. Each fluid ejector includes a pumping chamber, and an actuator configured to cause fluid to be ejected from the pumping chamber. The fluid ejection apparatus includes a feed channel fluidically connected to each pumping chamber; and at least one compliant structure formed in a surface of the feed channel. The at least one compliant structure has a lower compliance than the surface of the feed channel.Type: GrantFiled: February 8, 2021Date of Patent: November 15, 2022Assignee: FUJIFILM Dimatix, Inc.Inventors: Christoph Menzel, Kevin von Essen, Steven H. Barss, Mats G. Ottosson, Darren T. Imai
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Patent number: 11413869Abstract: A fluid ejector includes a fluid ejection module having a substrate and a layer separate from the substrate. The substrate includes a plurality of fluid ejection elements arranged in a matrix, each fluid ejection element configured to cause a fluid to be ejected from a nozzle. The layer separate from the substrate includes a plurality of electrical connections, each electrical connection adjacent to a corresponding fluid ejection element.Type: GrantFiled: May 4, 2020Date of Patent: August 16, 2022Assignee: FUJIFILM Dimatix, Inc.Inventors: Andreas Bibl, Kevin von Essen, Paul A. Hoisington
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Publication number: 20210154994Abstract: A fluid ejection apparatus includes a plurality of fluid ejectors. Each fluid ejector includes a pumping chamber, and an actuator configured to cause fluid to be ejected from the pumping chamber. The fluid ejection apparatus includes a feed channel fluidically connected to each pumping chamber; and at least one compliant structure formed in a surface of the feed channel. The at least one compliant structure has a lower compliance than the surface of the feed channel.Type: ApplicationFiled: February 8, 2021Publication date: May 27, 2021Applicant: FUJIFILM Dimatix, Inc.Inventors: Christoph Menzel, Kevin von Essen, Steven H. Barss, Mats G. Ottosson, Darren T. Imai
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Patent number: 10913264Abstract: A fluid ejection apparatus includes a plurality of fluid ejectors. Each fluid ejector includes a pumping chamber, and an actuator configured to cause fluid to be ejected from the pumping chamber. The fluid ejection apparatus includes a feed channel fluidically connected to each pumping chamber; and at least one compliant structure formed in a surface of the feed channel. The at least one compliant structure has a lower compliance than the surface of the feed channel.Type: GrantFiled: June 20, 2018Date of Patent: February 9, 2021Assignee: FUJIFILM Dimatix, Inc.Inventors: Christoph Menzel, Kevin von Essen, Steven H. Barss, Mats G. Ottosson, Darren T. Imai
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Publication number: 20200316940Abstract: A fluid ejector includes a fluid ejection module having a substrate and a layer separate from the substrate. The substrate includes a plurality of fluid ejection elements arranged in a matrix, each fluid ejection element configured to cause a fluid to be ejected from a nozzle. The layer separate from the substrate includes a plurality of electrical connections, each electrical connection adjacent to a corresponding fluid ejection element.Type: ApplicationFiled: May 4, 2020Publication date: October 8, 2020Inventors: Andreas Bibl, Kevin von Essen, Paul A. Hoisington
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Patent number: 10696047Abstract: A fluid ejector includes a fluid ejection module having a substrate and a layer separate from the substrate. The substrate includes a plurality of fluid ejection elements arranged in a matrix, each fluid ejection element configured to cause a fluid to be ejected from a nozzle. The layer separate from the substrate includes a plurality of electrical connections, each electrical connection adjacent to a corresponding fluid ejection element.Type: GrantFiled: October 2, 2017Date of Patent: June 30, 2020Assignee: FUJIFILM Dimatix, Inc.Inventors: Andreas Bibl, Kevin von Essen, Paul A. Hoisington
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Patent number: 10478857Abstract: An ultrasonic piezoelectric transducer device includes a transducer array consisting of an array of vibrating elements, and a base to which the array of vibrating elements in the transducer array are attached. The base include integrated electrical interconnects for carrying driving signals and sensed signals between the vibrating elements and an external control circuit. The base can be an ASIC wafer that includes integrated circuitry for controlling the driving and processing the sensed signals. The interconnects and control circuits in the base fit substantially within an area below the array of multiple vibrating elements.Type: GrantFiled: June 20, 2018Date of Patent: November 19, 2019Assignee: FUJIFILM Dimatix, Inc.Inventors: Andreas Bibl, Hung-fai Stephen Law, Kevin von Essen, Mats G. Ottosson
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Patent number: 10308054Abstract: A fluid ejection module mounting apparatus, including a module mount having a horizontal portion and a vertical portion, a fluid ejection module mounted to the module mount, and a clamp assembly including a recessed portion, a clamp along a wall of the recessed portion, and a lever coupled to the clamp and configured to move the clamp from an open position to a closed position. The horizontal portion has an opening configured to receive a fluid ejection module and the vertical portion has a protruding portion. The protruding portion of the module mount is configured to mate with the recessed portion of the clamp assembly.Type: GrantFiled: February 13, 2017Date of Patent: June 4, 2019Assignee: FUJIFILM Dimatix, Inc.Inventors: Kevin Von Essen, Paul A. Hoisington, Michael Rocchio
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Publication number: 20180297080Abstract: An ultrasonic piezoelectric transducer device includes a transducer array consisting of an array of vibrating elements, and a base to which the array of vibrating elements in the transducer array are attached. The base include integrated electrical interconnects for carrying driving signals and sensed signals between the vibrating elements and an external control circuit. The base can be an ASIC wafer that includes integrated circuitry for controlling the driving and processing the sensed signals. The interconnects and control circuits in the base fit substantially within an area below the array of multiple vibrating elements.Type: ApplicationFiled: June 20, 2018Publication date: October 18, 2018Applicant: FUJIFILM Dimatix, Inc.Inventors: Andreas Bibl, Hung-fai Stephen Law, Kevin von Essen, Mats G. Ottosson
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Publication number: 20180297357Abstract: A fluid ejection apparatus includes a plurality of fluid ejectors. Each fluid ejector includes a pumping chamber, and an actuator configured to cause fluid to be ejected from the pumping chamber. The fluid ejection apparatus includes a feed channel fluidically connected to each pumping chamber; and at least one compliant structure formed in a surface of the feed channel. The at least one compliant structure has a lower compliance than the surface of the feed channel.Type: ApplicationFiled: June 20, 2018Publication date: October 18, 2018Applicant: FUJIFILM Dimatix, Inc.Inventors: Christoph Menzel, Kevin von Essen, Steven H. Barss, Mats G. Ottosson, Darren T. Imai
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Patent number: 10022957Abstract: A fluid ejection apparatus includes a plurality of fluid ejectors. Each fluid ejector includes a pumping chamber, and an actuator configured to cause fluid to be ejected from the pumping chamber. The fluid ejection apparatus includes a feed channel fluidically connected to each pumping chamber; and at least one compliant structure formed in a surface of the feed channel. The at least one compliant structure has a lower compliance than the surface of the feed channel.Type: GrantFiled: April 24, 2015Date of Patent: July 17, 2018Assignee: FUJIFILM Dimatrix, Inc.Inventors: Christoph Menzel, Kevin von Essen, Steven H. Barss, Mats G. Ottosson, Darren T. Imai
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Patent number: 10022750Abstract: An ultrasonic piezoelectric transducer device includes a transducer array consisting of an array of vibrating elements, and a base to which the array of vibrating elements in the transducer array are attached. The base include integrated electrical interconnects for carrying driving signals and sensed signals between the vibrating elements and an external control circuit. The base can be an ASIC wafer that includes integrated circuitry for controlling the driving and processing the sensed signals. The interconnects and control circuits in the base fit substantially within an area below the array of multiple vibrating elements.Type: GrantFiled: June 29, 2015Date of Patent: July 17, 2018Assignee: FUJIFILM Dimatix, Inc.Inventors: Andreas Bibl, Hung-fai Stephen Law, Kevin von Essen, Mats G. Ottosson
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Patent number: 9919342Abstract: An ultrasonic piezoelectric transducer device includes a transducer array consisting of an array of vibrating elements, and a base to which the array of vibrating elements in the transducer array are attached. The base include integrated electrical interconnects for carrying driving signals and sensed signals between the vibrating elements and an external control circuit. The base can be an ASIC wafer that includes integrated circuitry for controlling the driving and processing the sensed signals. The interconnects and control circuits in the base fit substantially within an area below the array of multiple vibrating elements.Type: GrantFiled: June 29, 2015Date of Patent: March 20, 2018Assignee: FUJIFILM Dimatix, Inc.Inventors: Andreas Bibl, Hung-fai Stephen Law, Kevin von Essen, Mats G. Ottosson
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Publication number: 20180022093Abstract: A fluid ejector includes a fluid ejection module having a substrate and a layer separate from the substrate. The substrate includes a plurality of fluid ejection elements arranged in a matrix, each fluid ejection element configured to cause a fluid to be ejected from a nozzle. The layer separate from the substrate includes a plurality of electrical connections, each electrical connection adjacent to a corresponding fluid ejection element.Type: ApplicationFiled: October 2, 2017Publication date: January 25, 2018Inventors: Andreas Bibl, Kevin von Essen, Paul A. Hoisington
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Patent number: 9776408Abstract: A fluid ejector includes a fluid ejection module having a substrate and a layer separate from the substrate. The substrate includes a plurality of fluid ejection elements arranged in a matrix, each fluid ejection element configured to cause a fluid to be ejected from a nozzle. The layer separate from the substrate includes a plurality of electrical connections, each electrical connection adjacent to a corresponding fluid ejection element.Type: GrantFiled: March 7, 2016Date of Patent: October 3, 2017Assignee: FUJIFILM Dimatix, Inc.Inventors: Andreas Bibl, Kevin von Essen, Paul A. Hoisington
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Publication number: 20170217231Abstract: A fluid ejection module mounting apparatus, including a module mount having a horizontal portion and a vertical portion, a fluid ejection module mounted to the module mount, and a clamp assembly including a recessed portion, a clamp along a wall of the recessed portion, and a lever coupled to the clamp and configured to move the clamp from an open position to a closed position. The horizontal portion has an opening configured to receive a fluid ejection module and the vertical portion has a protruding portion. The protruding portion of the module mount is configured to mate with the recessed portion of the clamp assembly.Type: ApplicationFiled: February 13, 2017Publication date: August 3, 2017Inventors: Kevin Von Essen, Paul A. Hoisington, Michael Rocchio
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Patent number: 9566810Abstract: A fluid ejection module mounting apparatus, including a module mount having a horizontal portion and a vertical portion, a fluid ejection module mounted to the module mount, and a clamp assembly including a recessed portion, a clamp along a wall of the recessed portion, and a lever coupled to the clamp and configured to move the clamp from an open position to a closed position. The horizontal portion has an opening configured to receive a fluid ejection module and the vertical portion has a protruding portion. The protruding portion of the module mount is configured to mate with the recessed portion of the clamp assembly.Type: GrantFiled: June 6, 2016Date of Patent: February 14, 2017Assignee: FUJIFILM Dimatix, Inc.Inventors: Kevin Von Essen, Paul A. Hoisington, Michael Rocchio