Abstract: Optical circuit switches have gained increased prominence in data centers in recent years given their ability to rapidly forward optical data signals without first converting those signals back into the electrical domain. Certain optical circuit switches are implemented using one or more arrays of single-axis or dual-axis gimballed micro-electro-mechanical system (MEMS) (MEMS) mirrors, whose orientations can be adjusted to direct light from an input port of the switch to a desired output port of the switch. Systems and methods according to the present disclosure relate to a microelectromechanical system (MEMS) mirror assembly with crack protection features such as a plurality of nibbles.

Abstract: An apparatus and a camera system are provided. The apparatus includes an imaging screen configured to diffuse incoming light, and a lens system coupled to the imaging screen and configured to focus light from the imaging screen onto a CMOS image sensor. The imaging screen includes a ceramic diffuser layer fused into a surface of a glass substrate, and a thickness of the ceramic diffuser layer is within a range of about 7-10 ?m.

Abstract: An optical circuit switch includes a fiber hole array, a plurality of internal optical fibers, a collimating lens array, a MEMS mirror array, and a reflective surface. The fiber hole array includes an array of receptacles shaped to accept respective internal optical fibers. The collimating lens array is positioned adjacent to the fiber hole array. Each collimator of the collimating lens array optically couples light into or out of a corresponding one of the internal optical fibers. The fiber hole array, the collimator, the MEMS mirror array and the reflective surface are positioned relative to one another such that light exiting each of the internal optical fibers passes through its corresponding collimator and is redirected by a first mirror within the MEMS array towards the reflective surface, which directs the light back towards a second mirror of the MEMS mirror array, which in turn redirects the light towards a second internal optical fiber.

Abstract: A microelectromechanical system (MEMS) mirror assembly includes a base substrate defining a cavity and a plurality of first features extending upwards from a bottom of the cavity. The MEMS mirror assembly includes a mirror substrate coupled to the base substrate and defining a MEMS actuator and a MEMS mirror platform. Actuation of the MEMS actuator moves the MEMS mirror platform from a first positional state to a second positional state. The MEMS mirror platform defines a plurality of second features on a side of the MEMS mirror platform facing the base substrate that are sized, shaped, and positioned such that the plurality of second features extend into spaces separating the plurality of first features when the mirror platform is in the second positional state. The MEMS mirror assembly includes a reflective material disposed on a side of the MEMS mirror platform facing away from the base substrate.

Abstract: An integrated optical assembly includes an optics mount. The optics mount has disposed thereon a light source for providing a beam of light and a lens configured to focus the beam of light. The integrated optical assembly includes a photonic integrated circuit (PIC) mechanically coupled to the optics mount. The PIC has disposed thereon a grating coupler for receiving the beam of light and coupling the beam of light into a waveguide. The integrated optical assembly includes a microelectromechanical systems (MEMS) mirror configured to receive the beam of light from the lens and redirect it towards the grating coupler. A position of a reflective portion of the MEMS mirror is adjustable to affect an angle of incidence of the beam of light on the grating coupler.

Abstract: An apparatus and a camera system are provided. The apparatus includes an imaging screen configured to diffuse incoming light, and a lens system coupled to the imaging screen and configured to focus light from the imaging screen onto a CMOS image sensor. The imaging screen includes a ceramic diffuser layer fused into a surface of a glass substrate, and a thickness of the ceramic diffuser layer is within a range of about 7-10 ?m.

Abstract: An optical circuit switch includes a fiber hole array, a plurality of internal optical fibers, a collimating lens array, a MEMS mirror array, and a reflective surface. The fiber hole array includes an array of receptacles shaped to accept respective internal optical fibers. The collimating lens array is positioned adjacent to the fiber hole array. Each collimator of the collimating lens array optically couples light into or out of a corresponding one of the internal optical fibers. The fiber hole array, the collimator, the MEMS mirror array and the reflective surface are positioned relative to one another such that light exiting each of the internal optical fibers passes through its corresponding collimator and is redirected by a first mirror within the MEMS array towards the reflective surface, which directs the light back towards a second mirror of the MEMS mirror array, which in turn redirects the light towards a second internal optical fiber.

Abstract: An integrated optical assembly includes an optics mount. The optics mount has disposed thereon a light source for providing a beam of light and a lens configured to focus the beam of light. The integrated optical assembly includes a photonic integrated circuit (PIC) mechanically coupled to the optics mount. The PIC has disposed thereon a grating coupler for receiving the beam of light and coupling the beam of light into a waveguide. The integrated optical assembly includes a microelectromechanical systems (MEMS) mirror configured to receive the beam of light from the lens and redirect it towards the grating coupler. A position of a reflective portion of the MEMS mirror is adjustable to affect an angle of incidence of the beam of light on the grating coupler.

Abstract: An integrated optical assembly includes an optics mount. The optics mount has disposed thereon a light source for providing a beam of light and a lens configured to focus the beam of light. The integrated optical assembly includes a photonic integrated circuit (PIC) mechanically coupled to the optics mount. The PIC has disposed thereon a grating coupler for receiving the beam of light and coupling the beam of light into a waveguide. The integrated optical assembly includes a microelectromechanical systems (MEMS) mirror configured to receive the beam of light from the lens and redirect it towards the grating coupler. A position of a reflective portion of the MEMS mirror is adjustable to affect an angle of incidence of the beam of light on the grating coupler.

Abstract: An apparatus and a camera system are provided. The apparatus includes an imaging screen configured to diffuse incoming light, and a lens system coupled to the imaging screen and configured to focus light from the imaging screen onto a CMOS image sensor. The imaging screen includes a ceramic diffuser layer fused into a surface of a glass substrate, and a thickness of the ceramic diffuser layer is within a range of about 7-10 ?m.

Abstract: A microelectromechanical system (MEMS) mirror assembly includes a base substrate defining a cavity and a plurality of first features extending upwards from a bottom of the cavity. The MEMS mirror assembly includes a mirror substrate coupled to the base substrate and defining a MEMS actuator and a MEMS mirror platform. Actuation of the MEMS actuator moves the MEMS mirror platform from a first positional state to a second positional state. The MEMS mirror platform defines a plurality of second features on a side of the MEMS mirror platform facing the base substrate that are sized, shaped, and positioned such that the plurality of second features extend into spaces separating the plurality of first features when the mirror platform is in the second positional state. The MEMS mirror assembly includes a reflective material disposed on a side of the MEMS mirror platform facing away from the base substrate.

Abstract: Optical circuit switches have gained increased prominence in data centers in recent years given their ability to rapidly forward optical data signals without first converting those signals back into the electrical domain. Certain optical circuit switches are implemented using one or more arrays of single-axis or dual-axis gimballed micro-electro-mechanical system (MEMS) (MEMS) mirrors, whose orientations can be adjusted to direct light from an input port of the switch to a desired output port of the switch. Systems and methods according to the present disclosure relate to a microelectromechanical system (MEMS) mirror assembly with crack protection features such as a plurality of nibbles.

Abstract: An apparatus and a camera system are provided. The apparatus includes an imaging screen configured to diffuse incoming light, and a lens system coupled to the imaging screen and configured to focus light from the imaging screen onto a CMOS image sensor. The imaging screen includes a ceramic diffuser layer fused into a surface of a glass substrate, and a thickness of the ceramic diffuser layer is within a range of about 7-10 ?m.

Abstract: A collimator device and a collimator lens array for an optical circuit switch are provided. The collimator includes a fiber array including multiple optical fibers disposed in a hole array. An optical lens array is aligned and coupled to the fiber array. A spacer is disposed between the fiber array and the optical lens array and provides substantially uniform spacing between lenses in the optical lens array and corresponding fibers in the fiber array. Multiple pads are positioned along edges of a surface of the spacer facing the optical lens array defining a first separation gap between the spacer and the optical lens array. A first epoxy bonds the spacer to the optical lens array, and a second epoxy bonds the spacer to the fiber array. The optical lens array includes a glass substrate having a first surface defining lenses in a two-dimensional array.

Abstract: A probe card assembly can include an electrical interface to a test system for testing electronic devices such as semiconductor dies. The probe card assembly can also include probes located at a first side of the probe card assembly. The probes, which can be electrically connected to the electrical interface, can be configured to contact terminals of the electronic devices in the test system while the probe card assembly is attached to the test system. The probe card assembly can be configured to impede thermal flow from the probe card assembly to the test system at places of physical contact between the probe card assembly and the test system while the probe card assembly is attached to the test system.

Abstract: A probe card assembly can include an electrical interface to a test system for testing electronic devices such as semiconductor dies. The probe card assembly can also include probes located at a first side of the probe card assembly. The probes, which can be electrically connected to the electrical interface, can be configured to contact terminals of the electronic devices in the test system while the probe card assembly is attached to the test system. The probe card assembly can be configured to impede thermal flow from the probe card assembly to the test system at places of physical contact between the probe card assembly and the test system while the probe card assembly is attached to the test system.

Abstract: A damped micromechanical device comprising a substrate, a movable structure overlying the substrate and a flexural member having a first end portion coupled to the substrate and a second end portion coupled to the movable structure. The movable structure is movable at a resonant frequency between first and second positions relative to the substrate. A damping material is adhered to at least a portion of the flexural member for damping the movement of the movable structure at the resonant frequency. A method for making the micromechanical device is provided.

Abstract: A damped micromechanical device useful for adjusting optical components, positioning transducers, and sensing motion. The micromechanical device includes a top cap that helps create an area of restricted fluid flow to increase mechanical damping of the device and minimize the response of the structure to mechanical perturbations. The micromechanical device is constructed to cause piston-like Poiseuille flow through controlled gaps within the actuator. By controlling the gap dimensions, the amount of damping can be adjusted.

Abstract: A damped micromechanical device comprising a substrate, a movable structure overlying the substrate and a flexural member having a first end portion coupled to the substrate and a second end portion coupled to the movable structure. The movable structure is movable at a resonant frequency between first and second positions relative to the substrate. A damping material is adhered to at least a portion of the flexural member for damping the movement of the movable structure at the resonant frequency. A method for making the micromechanical device is provided.