Abstract: An apparatus including a photonic integrated circuit (PIC) coupled to an optical bench is disclosed. The PIC includes at least one grating coupler disposed thereon and the optical bench includes an optical system disposed thereon. The apparatus also includes an integrated heater at an upper surface of the PIC under the optical bench or at a bottom surface of the optical bench over the PIC. The apparatus also includes a layer of solder disposed between the PIC and the optical bench for coupling the bottom surface of the optical bench to the PIC. In some implementations, the layer of solder is in thermal communication with the integrated heater.

Abstract: An apparatus including a photonic integrated circuit (PIC) coupled to an optical bench is disclosed. The PIC includes at least one grating coupler disposed thereon and the optical bench includes an optical system disposed thereon. The apparatus also includes an integrated heater at an upper surface of the PIC under the optical bench or at a bottom surface of the optical bench over the PIC. The apparatus also includes a layer of solder disposed between the PIC and the optical bench for coupling the bottom surface of the optical bench to the PIC. In some implementations, the layer of solder is in thermal communication with the integrated heater.

Abstract: A micro-electro-mechanical systems (MEMS) mirror array can include pre-tilted mirrors. In some implementations, a MEMS mirror array includes a set of first MEMS mirrors supported by a mounting surface of one or more first substrates, and a set of exterior MEMS mirrors supported by a mounting surface of one or more exterior substrates. The one or more exterior substrates can be disposed along at least one edge of an exterior perimeter of at least one of the first substrates. The mounting surface of the one or more exterior substrates can be arranged to cause a plane of each exterior MEMS mirror to be at a non-zero angle with respect to each first MEMS mirror. The one or more first substrates and the one or more exterior substrates can be supported by a common substrate.

Abstract: A micro-electro-mechanical systems (MEMS) mirror array can be constructed using sub-dies that each includes two or more MEMS mirrors. In some implementations, an optical cross-connect system includes a first MEMS mirror array that includes first mirror units. Each first mirror unit can include a first substrate and two or more first MEMS mirrors supported by the first substrate. Each first substrate can be independent from each other first substrate. The cross-connect system can include a second MEMS mirror array that includes second mirror units. Each second mirror unit can include a second substrate and two or more second MEMS mirrors supported by the second substrate. Each second substrate can be independent from each other second substrate.

Abstract: A micro-electro-mechanical systems (MEMS) mirror array can be constructed using sub-dies that each includes two or more MEMS mirrors. In some implementations, an optical cross-connect system includes a first MEMS mirror array that includes first mirror units. Each first mirror unit can include a first substrate and two or more first MEMS mirrors supported by the first substrate. Each first substrate can be independent from each other first substrate. The cross-connect system can include a second MEMS mirror array that includes second mirror units. Each second mirror unit can include a second substrate and two or more second MEMS mirrors supported by the second substrate. Each second substrate can be independent from each other second substrate.