Patents by Inventor Kevin You

Kevin You has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Integrated flex substrate metallurgical bonding
    Publication number: 20040112935
    Abstract: An upgrade site is formed into a flatwire for upgrade or repair of the flatwire. Generally, the upgrade site comprises a substrate, a plurality of conductive elements, a solder element, a heating element, and an adhesive layer. The plurality of conductive elements are positioned on and extend along the substrate. The solder element is positioned on an exposed surface of each conductive element. The heating element is positioned adjacent the substrate and the plurality of conductive elements for heating the solder elements. The adhesive layer is positioned on the substrate for sealing the upgrade site after upgrade or repair of the flatwire.
    Type: Application
    Filed: December 16, 2002
    Publication date: June 17, 2004
    Applicant: VISTEON GLOBAL TECHNOLOGIES, INC.
    Inventors: Peter J. Sinkunas, Myron Lemecha, Andrew Z. Glovatsky, Zhong-You Shi, William Zhang, Kevin You