Abstract: A system for detecting a status of a pocket of a tray includes a tray having a plurality of pockets that hold an integrated circuit device, a vision mechanism, a light line generator, a reflective device, and a controller. The vision mechanism images the tray along a first optical axis. The light line generator emits a light line along a second optical axis. The reflective device reflects the light line onto the tray along a third optical axis. The third optical axis has a different angle relative to the first optical axis than an angle between the first optical axis and the second optical axis. The controller receives an image of the tray from the vision mechanism, detects the light line reflected onto the tray along the third optical axis, and determines a status of a pocket based on the detected light line along the third optical axis.

Abstract: A system includes: a bottom contactor assembly; a top contactor assembly; and a contactor vision alignment system located separate from a test site of an integrated circuit device testing system. The contactor vision alignment system includes: a downward-looking camera, an upward-looking camera, an adjustment mechanism configured to move the top contactor assembly, and a controller configured to: determine a first offset between a bottom side integrated circuit device contact array and a bottom contactor contact array, cause the adjustment mechanism to align the bottom side integrated circuit device contact array with the bottom contactor contact array based on the determined first offset, determine a second offset between the top contactor contact array and a top side integrated circuit device contact array, and cause the adjustment mechanism to align the top contactor with respect to the top side device contact array based on the determined second offset.

Abstract: An apparatus includes a device holder including a device placement area configured to hold an electronic device, and a shoulder extending peripherally around the device placement area; a laser line generator configured to generate a laser line that includes (i) a device placement area laser line portion, and (ii) a shoulder area laser line portion; a camera configured to obtain an image of at least the laser line; and a processor configured to: receive the image from the camera, determine (i) an angle of the device placement area laser line portion, and/or (ii) an offset between the location of the device placement area laser line portion and the location of the shoulder area laser line portion, and determine whether an electronic device is positioned in the device placement area or positioned incorrectly in the device holder.

Abstract: An offline vision assisted calibration system includes: a bottom side socket assembly that is mountable in an integrated circuit device handler and comprises: a socket plate that comprises a hole grid array; and a top contactor assembly that is mountable in an integrated circuit device handler and comprises: a guide plate, a plurality of fiducials located on a lower side surface of the guide plate, a contact holder plate comprising a top contactor contact array, and a plurality of adjustment actuators configured to move the contact holder plate with respect to the guide plate; and a calibration jig comprising an array of contacts on a bottom side thereof, wherein the calibration jig is configured to be placed in the socket plate such that the contacts engage with the hole grid array of the socket plate.

Abstract: A system for detecting a status of a pocket of a tray includes a tray having a plurality of pockets that hold an integrated circuit device, a vision mechanism, a light line generator, a reflective device, and a controller. The vision mechanism images the tray along a first optical axis. The light line generator emits a light line along a second optical axis. The reflective device reflects the light line onto the tray along a third optical axis. The third optical axis has a different angle relative to the first optical axis than an angle between the first optical axis and the second optical axis. The controller receives an image of the tray from the vision mechanism, detects the light line reflected onto the tray along the third optical axis, and determines a status of a pocket based on the detected light line along the third optical axis.

Abstract: A vision alignment system for an integrated circuit device testing handler includes a head guiding ring configured to be attached to a pick-and-place device, the head guiding ring having an opening in which a device-under-test having a device contact array is locatable; a socket apparatus including: a fixed mounting frame, a moveable socket guiding ring, and a plurality of actuators configured to move the moveable socket guiding ring relative to the fixed mounting frame; and a visualization device configured to provide data relating to a position of the device contact array relative to the contactor pin array. The socket apparatus is configured to adjust a position of the head guiding ring by moving the moveable socket guiding ring while the head guiding ring is located in an opening of the moveable socket guiding ring to align the device contact array to the contactor pin array.

Abstract: A vision alignment system for a test handler system includes a transfer mechanism that transfers a device from an input side to a test side, a contactor array positioned at the test side, and a pick-and-place device that moves the device from the transfer mechanism to the contactor array. An engagement mechanism on the pick-and-place device engages with alignment devices on the transfer mechanism and contactor array. To avoid positioning the vision alignment system in the test side, a first vision mechanism is positioned away from the test socket and determines the position of the device in a common local coordinate system, a second vision mechanism is positioned at an output side and determines a position of the contactor array in the local coordinate system, and the correction mechanism corrects a position of the device based on an offset between the positions in the coordinate system.

Abstract: A system for three-dimensional inspection of leads mounted on an integrated circuit device includes an integrated circuit device, a first light source having a first color, a second light source having a second color different from the first color, a RGB color camera and a processor. The first light source is disposed at an acute angle to the integrated circuit device, and is configured to illuminate the leads such that lead shadows are created in a first color plane. The second light source is disposed in front of a surface of the integrated circuit device on which the leads are mounted, and is configured to illuminate the leads in a second color plane. The camera is configured to image the illuminated leads and lead shadows. The processor is configured to analyze the first and second color planes of a single image to detect three-dimensional bent leads.

Abstract: An apparatus includes a device holder including a device placement area configured to hold an electronic device, and a shoulder extending peripherally around the device placement area; a laser line generator configured to generate a laser line that includes (i) a device placement area laser line portion, and (ii) a shoulder area laser line portion; a camera configured to obtain an image of at least the laser line; and a processor configured to: receive the image from the camera, determine (i) an angle of the device placement area laser line portion, and/or (ii) an offset between the location of the device placement area laser line portion and the location of the shoulder area laser line portion, and determine whether an electronic device is positioned in the device placement area or positioned incorrectly in the device holder.

Abstract: A system for double sided integrated circuit device testing includes: (i) a picking section including: (a) a plurality of picking-section pockets; (b) a picking-section plate including: one or more picking-section pocket openings, and first and second picking-section plate pins; (ii) a placing section including: (a) a plurality of placing-section contactors; (b) a placing-section member including: one or more placing-section contactor openings, and first and second placing-section member pins; and (iii) a pick-and-place section including: (a) a pick-and-place device including: a plurality of pick-and-place head contactors, and one or more sets of actuators; and (b) a pick-and-place head plate including: one or more pick-and-place head contactor openings, each pick-and-place head contactor opening corresponding to a pick-and-place head contactor, and first and second spring-loaded bushings configured to engage with the first and second picking-section plate pins, and the first and second placing-section member

Abstract: A system for double sided integrated circuit device testing includes: (i) a picking section including: (a) a plurality of picking-section pockets; (b) a picking-section plate including: one or more picking-section pocket openings, and first and second picking-section plate pins; (ii) a placing section including: (a) a plurality of placing-section contactors; (b) a placing-section member including: one or more placing-section contactor openings, and first and second placing-section member pins; and (iii) a pick-and-place section including: (a) a pick-and-place device including: a plurality of pick-and-place head contactors, and one or more sets of actuators; and (b) a pick-and-place head plate including: one or more pick-and-place head contactor openings, each pick-and-place head contactor opening corresponding to a pick-and-place head contactor, and first and second spring-loaded bushings configured to engage with the first and second picking-section plate pins, and the first and second placing-section member

Abstract: A system for detecting characteristics of a surface includes multiple sources of lights, a platform structure configured to support the surface, a lens aligned with the platform structure, a cropping aperture, and an image receiver. The platform structure is configured to receive light from the source of light and the lens is positioned such that the source of light is not in focus, but the detected surface is in focus. The cropping aperture is configured to crop light reflected from the surface, and the image receiver is configured to receive the light conditioned by the cropping aperture.

Abstract: A vision alignment system for an integrated circuit device testing handler includes a head guiding ring configured to be attached to a pick-and-place device, the head guiding ring having an opening in which a device-under-test having a device contact array is locatable; a socket apparatus including: a fixed mounting frame, a moveable socket guiding ring, and a plurality of actuators configured to move the moveable socket guiding ring relative to the fixed mounting frame; and a visualization device configured to provide data relating to a position of the device contact array relative to the contactor pin array. The socket apparatus is configured to adjust a position of the head guiding ring by moving the moveable socket guiding ring while the head guiding ring is located in an opening of the moveable socket guiding ring to align the device contact array to the contactor pin array.

Abstract: A system for three-dimensional inspection of leads mounted on an integrated circuit device includes an integrated circuit device, a first light source having a first color, a second light source having a second color different from the first color, a RGB color camera and a processor. The first light source is disposed at an acute angle to the integrated circuit device, and is configured to illuminate the leads such that lead shadows are created in a first color plane. The second light source is disposed in front of a surface of the integrated circuit device on which the leads are mounted, and is configured to illuminate the leads in a second color plane. The camera is configured to image the illuminated leads and lead shadows. The processor is configured to analyze the first and second color planes of a single image to detect three-dimensional bent leads.

Abstract: A method of pick-and-place alignment comprises (a) determining a pick location of a device from a tray of devices; (b) determining place location of the device using an up-looking camera; and (c) determining offset error for the device by comparing the pick location and the place location. The method may further comprise repeating steps (a)-(c) for additional devices on the tray of devices; and generating an offset map for alignment of devices on the tray. The method further uses the offset map to make pick and place corrections during runtime.

Abstract: A system for detecting characteristics of a surface includes multiple sources of lights, a platform structure configured to support the surface, a lens aligned with the platform structure, a cropping aperture, and an image receiver. The platform structure is configured to receive light from the source of light and the lens is positioned such that the source of light is not in focus, but the detected surface is in focus. The cropping aperture is configured to crop light reflected from the surface, and the image receiver is configured to receive the light conditioned by the cropping aperture.

Abstract: A method and apparatus for aligning a device with a contactor is provided. The apparatus includes a pick and place device, for transporting the device. A first camera acquires an image of the device relative to device holder fiducials of the pick and place device. A second camera detects the location of the contactor relative to fiducials positioned on an alignment frame plate. A third camera to image frame and device holder fiducials to correlate the first and second camera coordinates. Given a processor determines the alignment difference between the device and the contactor. A plurality of actuators align the device with the contactor.

Abstract: A detection method and apparatus is provided. The detection apparatus includes at least two angular mounted lasers, a surface for receiving laser lines emitted by the angular mounted lasers, a camera for detecting a laser pattern formed by the laser lines on the surface, and a processor for analyzing the laser pattern. The lasers emit orthogonal laser lines on a surface of the device. The camera detects a laser pattern on the surface of the device and the processor analyzes the laser pattern to determine whether the position of the device is in pocket based on the analysis and position algorithms.

Abstract: A method of pick-and-place alignment comprises (a) determining a pick location of a device from a tray of devices; (b) determining place location of the device using an up-looking camera; and (c) determining offset error for the device by comparing the pick location and the place location. The method may further comprise repeating steps (a)-(c) for additional devices on the tray of devices; and generating an offset map for alignment of devices on the tray. The method further uses the offset map to make pick and place corrections during runtime.

Abstract: A camera coordinate calibration system and method are provided. The system includes a calibration contactor having at least two fiducials. The system also includes a double sided visible calibration target. A pick and place handler is provided with a device holder having at least two fiducials, where the device holder is configured to pickup the double sided visible calibration target and place the target onto the calibration contactor. The system includes a device view camera configured to image a first side of the double sided visible calibration target inserted into the device holder, and a contactor view camera configured to image a second side of the target inserted into the calibration contactor. A processor is provided that calculates a common coordinate system for the device view camera and the contactor view camera based on the images of the first and second sides of the double sided visible calibration target.