Patents by Inventor Kexue WEI

Kexue WEI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240086320
    Abstract: A method for modifying engine files, the method performed by at least one processor in one or more servers at a cloud based location, the method comprising receiving, by the one or more servers at the cloud based location from at least one host device, a derived data cache (DDC) generated by the at least one host device; distributing the DDC from the one or more servers at the cloud based location to one or more client locations, the one or more client locations performing at least one modification to the DDC; and receiving the modified DDC, by the one or more servers at the cloud based location from the one or more client locations.
    Type: Application
    Filed: September 8, 2022
    Publication date: March 14, 2024
    Applicant: TENCENT AMERICA LLC
    Inventors: Haitao WU, Xin Wang, Zhong WANG, Kexue WEI
  • Patent number: 11929446
    Abstract: Provided is a preparation method of a detector material. The present disclosure epitaxially grows a buffer layer on a surface of a gallium arsenide substrate, deposits a silicon dioxide layer on the buffer layer, and etches the silicon dioxide layer on the buffer layer according to a strip pattern by photolithography and etching to form strip growth regions with continuous changes in width. Finally, a molecular beam epitaxy (MBE) technology is used to epitaxially grow the detector material in the strip growth regions under set epitaxy growth conditions. Because of the same mobility of atoms arriving at the surface of the substrate, numbers of atoms migrating to the strip growth regions are different due to different widths of the strip growth regions, such that compositions of the material change with the widths of the strip growth regions or a layer thickness changes with the widths of the strip growth regions.
    Type: Grant
    Filed: November 8, 2022
    Date of Patent: March 12, 2024
    Assignee: CHANGCHUN UNIVERSITY OF SCIENCE AND TECHNOLOGY
    Inventors: Qun Hao, Zhipeng Wei, Jilong Tang, Huimin Jia, Lei Liao, Kexue Li, Fengyuan Lin, Rui Chen, Shichen Su, Shuangpeng Wang