Patents by Inventor Keyuan Sun

Keyuan Sun has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220250287
    Abstract: Provided is a compression molding die. The die can be used for compression molding an I-shaped part without the need for machining. The molding die comprises: an outer mold with an inner diameter of d; an upper pressing disc, a lower pressing disc and a huff mold with the same outer diameter of d and the same inner diameter of f; an upper mold; a lower mold; and a core mold with a diameter of h. The upper pressing disc, the huff mold and the lower pressing disc, which are movable vertically, are arranged in the outer mold in a vertically spaced manner; the vertically movable upper mold extends into the upper pressing disc, and the vertically movable lower mold extends into the lower pressing disc; the outer mold, the upper mold, the upper pressing disc, the huff mold, the lower pressing disc and the lower mold define a cavity.
    Type: Application
    Filed: September 9, 2020
    Publication date: August 11, 2022
    Inventors: Wenguang Yang, Keyuan Sun, Peimin Chen, Yu Jin, Zhaoxi Chen, Xiaogang Wang, Yan Xia, Feng Lin, Xiaochun Chen