Patents by Inventor Keyuan Sun

Keyuan Sun has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20260166790
    Abstract: The patent discloses a method for forming a PFA coated butterfly plate without flow marks, comprising a mold and a plate core; the mold comprises a push mold, a hopper, an upper mold, and a lower mold; the bottom of the upper mold is equipped with an upper cavity, the top of the lower mold is equipped with a lower cavity, and the upper mold has an injection port. There are two symmetrical protruding structures on the board core, both of which are connected to shafts. Both the board core and the shaft have interconnected channels that run through the center of the board core. The forming method of PFA coated butterfly board is to cover a layer of PFA on the outer surface of the board core, which can ensure that the prepared product has no texture.
    Type: Application
    Filed: May 4, 2023
    Publication date: June 18, 2026
    Applicant: NANJING COMPTECH COMPOSITES CORP.
    Inventors: Keyuan SUN, Wenguang YANG, Yan XIA, Haifei WANG, Ye YANG, Xiaogang WANG, Zhaoxi CHEN, Kai LIU, Yisu XIAO
  • Patent number: 12479745
    Abstract: A method for treating polluted acidic wastewater from smelting with an activated pyrite concentrate includes: drying and grinding a pyrite concentrate, and washing twice to produce a washed pyrite concentrate powder; mixing the washed pyrite concentrate powder with a Na2S powder to produce a mixed powder, and adding purified water; allowing a reaction for 3.5 h to 4.5 h; filtering to produce an activated pyrite concentrate; subjecting the activated pyrite concentrate to aeration and standing, drying, and grinding to produce an activated pyrite concentrate powder; adding a lime slurry to the wastewater to adjust a pH; adding the activated pyrite concentrate powder, and allowing an ultrasonic treatment, continuous stirring is conducted; allowing a settlement to produce a first supernatant; adding a lime slurry to the first supernatant to adjust a pH; further allowing a settlement to produce a second supernatant; and separating the second supernatant.
    Type: Grant
    Filed: June 13, 2025
    Date of Patent: November 25, 2025
    Assignee: KUNMING METALLURGICAL RESEARCH INSTITUTE CO., LTD.
    Inventors: Yong Yang, Keyuan Sun, Weiwei Liu, Xingyong Qin, Huajun Chen, Guohuan Xiong, Yanbing Liu, Wei Zou, Hongxu Zhu, Anlei Yue, Sen Yan, Weizhi Diao
  • Publication number: 20250304476
    Abstract: A method for treating polluted acidic wastewater from smelting with an activated pyrite concentrate includes: drying and grinding a pyrite concentrate, and washing twice to produce a washed pyrite concentrate powder; mixing the washed pyrite concentrate powder with a Na2S powder to produce a mixed powder, and adding purified water; allowing a reaction for 3.5 h to 4.5 h; filtering to produce an activated pyrite concentrate; subjecting the activated pyrite concentrate to aeration and standing, drying, and grinding to produce an activated pyrite concentrate powder; adding a lime slurry to the wastewater to adjust a pH; adding the activated pyrite concentrate powder, and allowing an ultrasonic treatment, continuous stirring is conducted; allowing a settlement to produce a first supernatant; adding a lime slurry to the first supernatant to adjust a pH; further allowing a settlement to produce a second supernatant; and separating the second supernatant.
    Type: Application
    Filed: June 13, 2025
    Publication date: October 2, 2025
    Applicant: KUNMING METALLURGICAL RESEARCH INSTITUTE CO., LTD.
    Inventors: Yong YANG, Keyuan SUN, Weiwei LIU, Xingyong QIN, Huajun CHEN, Guohuan XIONG, Yanbing LIU, Wei ZOU, Hongxu ZHU, Anlei YUE, Sen YAN, Weizhi DIAO
  • Patent number: 12172348
    Abstract: Provided is a compression molding die. The die can be used for compression molding an I-shaped part without the need for machining. The molding die comprises: an outer mold with an inner diameter of d; an upper pressing disc, a lower pressing disc and a huff mold with the same outer diameter of d and the same inner diameter of f; an upper mold; a lower mold; and a core mold with a diameter of h. The upper pressing disc, the huff mold and the lower pressing disc, which are movable vertically, are arranged in the outer mold in a vertically spaced manner; the vertically movable upper mold extends into the upper pressing disc, and the vertically movable lower mold extends into the lower pressing disc; the outer mold, the upper mold, the upper pressing disc, the huff mold, the lower pressing disc and the lower mold define a cavity.
    Type: Grant
    Filed: September 9, 2020
    Date of Patent: December 24, 2024
    Assignee: Nanjing Comptech Composites Corp.
    Inventors: Wenguang Yang, Keyuan Sun, Peimin Chen, Yu Jin, Zhaoxi Chen, Xiaogang Wang, Yan Xia, Feng Lin, Xiaochun Chen
  • Publication number: 20220250287
    Abstract: Provided is a compression molding die. The die can be used for compression molding an I-shaped part without the need for machining. The molding die comprises: an outer mold with an inner diameter of d; an upper pressing disc, a lower pressing disc and a huff mold with the same outer diameter of d and the same inner diameter of f; an upper mold; a lower mold; and a core mold with a diameter of h. The upper pressing disc, the huff mold and the lower pressing disc, which are movable vertically, are arranged in the outer mold in a vertically spaced manner; the vertically movable upper mold extends into the upper pressing disc, and the vertically movable lower mold extends into the lower pressing disc; the outer mold, the upper mold, the upper pressing disc, the huff mold, the lower pressing disc and the lower mold define a cavity.
    Type: Application
    Filed: September 9, 2020
    Publication date: August 11, 2022
    Inventors: Wenguang Yang, Keyuan Sun, Peimin Chen, Yu Jin, Zhaoxi Chen, Xiaogang Wang, Yan Xia, Feng Lin, Xiaochun Chen