Abstract: In a method and apparatus for converting optical wavelength division multiplexed channels to wireless channels, the information carrying optical carriers are first de-multiplexed and each optical carrier is then extracted from the data using an optical channelizing technique. The optical frequency of each of the extracted optical carriers is then shifted by an amount equal to the desired wireless carrier frequencies in the broadband wireless channels. Optical heterodyning of the frequency-shifted extracted lightwave carriers with the original data-containing optical signals, which are mutually in phase coherence, in a photodetector results in a set of wireless carriers each modulated with the data carried by the corresponding optical channel.

Abstract: In a method and apparatus for converting optical wavelength division multiplexed channels to wireless channels, the information carrying optical carriers are first de-multiplexed and each optical carrier is then extracted from the data using an optical channelizing technique. The optical frequency of each of the extracted optical carriers is then shifted by an amount equal to the desired wireless carrier frequencies in the broadband wireless channels. Optical heterodyning of the frequency-shifted extracted lightwave carriers with the original data-containing optical signals, which are mutually in phase coherence, in a photodetector results in a set of wireless carriers each modulated with the data carried by the corresponding optical channel.

Abstract: A method for transferring of individual devices or circuit elements, fabricated on a semiconducting substrate, to a new substrate and placing said devices and elements in predetermined locations on the new substrate. The method comprises shaping the devices and circuits as truncated cones, lifting them off the original semiconducting substrates and depositing them en masse onto the new substrate, followed by their placing into receptors on the new substrate. The new substrate has preliminarily made receptors in a form of a truncated cone and the devices and circuits fill these receptors. Both the receptors and the devices and circuits have metallization contacts enabling to establish electrical contact between them. A method for real-time monitoring and verification of correctness of placement of the devices and circuits into the receptors by applying voltage pulse waveforms and measuring the resulting current pulse.

Abstract: A conformal retro-modulator optical apparatus. The apparatus includes an array of multiple quantum well devices disposed in a thin array. A plastic support element is bonded to the thin array, the plastic support element having a thickness greater that of the thin array. The plastic support element is preferably plastic at elevated temperatures above room temperature, thereby allowing the plastic support element and the thin array of multiple well device disposed therein to conform to a predetermined shape, yet being rigid at room temperature.

Abstract: An optical MEMS retro-reflective apparatus with modulation capability having a retro-reflecting structure including a pair of reflective surfaces; and a MEMS device for moving at least one of the reflective surfaces of said pair of reflective surfaces relative to another one of the reflective surfaces of said pair of reflective surfaces a distance which causes the pair of reflective surfaces to switch between a reflective mode of operation and a transmissive mode of operation. A substrate and a moveable grating stricture may be substituted for the reflective surfaces.

Abstract: A method for transferring of individual devices or circuit elements, fabricated on a semiconducting substrate, to a new substrate and placing said devices and elements in predetermined locations on the new substrate. The method comprises shaping the devices and circuits as truncated cones, lifting them off the original semiconducting substrates and depositing them en masse onto the new substrate, followed by their placing into receptors on the new substrate. The new substrate has preliminarily made receptors in a form of a truncated cone and the devices and circuits fill these receptors. Both the receptors and the devices and circuits have metallization contacts enabling to establish electrical contact between them. A method for real-time monitoring and verification of correctness of placement of the devices and circuits into the receptors by applying voltage pulse waveforms and measuring the resulting current pulse.

Abstract: A method and apparatus for generating an arbitrary UWB waveform are presented. An optical comb generator generates a serial stream of optical tones and an optical beating tone. A serial-to-parallel converter receives the serial tones and converts them into parallel optical tones. A spatial light modulator receives the parallel optical tones, and independently adjusts at least one of the phase and amplitude of each to generate the components of an arbitrary waveform. Next, each one of a plurality of optical-to-electrical converters receives a parallel optical tone and the selected optical beating tone, which are beat with the optical beating tone, producing electrical notes, representing differences between each parallel optical tones and the optical beating tone. Each antenna element is connected to receive an electrical note and to launch a signal based thereon, such that the launched signals are superimposed to the arbitrary waveform signal.

Abstract: A method for transferring layers containing semiconductor devices and/or circuits to substrates other than those on which these semiconductor devices and/or circuits have been originally fabricated. The method comprises fabricating the semiconductor devices and/or circuits, coating them with a protective layer of photoresist followed by coating with a layer of wax. A special perforated structure is then also wax coated and the waxed surface of the structure is brought into a contact with the waxed surface of photoresist. The original seed substrate is removed and the exposed surface is then coated with adhesive followed by dissolving wax through the openings in the perforated structure and attaching the layer with semiconductor devices and/or circuits to another permanent substrate. As an alternative, a disk-shaped water-soluble structure can be used instead of the perforated structure.

Abstract: A multi-tone photonic oscillator comprises a laser; an optical modulator coupled to the laser; and a delay line and a photodetector coupled to the optical modulator for generating a delayed electrical signal representation of the output of the optical modulator; wherein the optical modulator being responsible for the delayed electrical signal for generating multiple tones where the frequency intervals of the tones is a function of the amount of delay imposed by the delay line.

Abstract: An agile spread spectrum waveform generator comprises a photonic oscillator and an optical heterodyne synthesizer. The photonic oscillator comprises a multi-tone optical comb generator for generating a series of RF comb lines on an optical carrier. The optical heterodyne synthesizer includes first and second phase-locked lasers; the first laser feeding the multi-tone optical comb generator and the second laser comprising a rapidly wavelength-tunable single tone laser whose output light provides a frequency translation reference. A photodetector is provided for heterodyning the frequency translation reference with the optical output of the photonic oscillator to generate an agile spread spectrum waveform.

Abstract: A waveform synthesizer comprising for synthesizing RF lightwave waveforms in the optical domain. These waveforms are constructed by generating their constituent Fourier frequency components or tones and then adjusting the amplitudes of those frequency components or tones. The apparatus includes: a RF-lightwave frequency-comb generator; and a multi-tone, frequency selective amplitude modulator coupled to the RF-lightwave frequency-comb generator for generating a continuous-wave comb comprising a set of RF tones amplitude modulated onto a lightwave carrier.

Abstract: A phase shifter comprises a coarse phase tuning arrangement and a fine phase tuning arrangement. The coarse phase tuning arrangement provides a discrete number of phase shifts. The fine phase tuning arrangement includes a RLC network, having a resistor, an inductor and a capacitor. The fine phase tuning arrangement also comprises an optical arrangement for varying the resistance value of the resistor. This phase shifter is able to obtain broadband, continuous 360° phase shifting also at Gigahertz frequencies. It also allows close to linear phase shift versus frequency resulting in true time delay capability, very low insertion loss and high value of maximum phase adjust.

Abstract: A phase shifter comprises a coarse phase tuning arrangement and a fine phase tuning arrangement. The coarse phase tuning arrangement provides a discrete number of phase shifts. The fine phase tuning arrangement includes a RLC network, having a resistor, an inductor and a capacitor. The fine phase tuning arrangement also comprises an optical arrangement for varying the resistance value of the resistor. This phase shifter is able to obtain broadband, continuous 360° phase shifting also at Gigahertz frequencies. It also allows close to linear phase shift versus frequency resulting in true time delay capability, very low insertion loss and high value of maximum phase adjust.

Abstract: A method for transferring of individual devices or circuit elements, fabricated on a semiconducting substrate, to a new substrate and placing said devices and elements in predetermined locations on the new substrate. The method comprises shaping the devices and circuits as truncated cones, lifting them off the original semiconducting substrates and depositing them en masse onto the new substrate, followed by their placing into receptors on the new substrate. The new substrate has preliminarily made receptors in a form of a truncated cone and the devices and circuits fill these receptors. Both the receptors and the devices and circuits have metallization contacts enabling to establish electrical contact between them. A method for real-time monitoring and verification of correctness of placement of the devices and circuits into the receptors by applying voltage pulse waveforms and measuring the resulting current pulse.

Abstract: A method for transferring layers containing semiconductor devices and/or circuits to substrates other than those on which these semiconductor devices and/or circuits have been originally fabricated. The method comprises fabricating the semiconductor devices and/or circuits, coating them with a protective layer of photoresist followed by coating with a layer of wax. A special perforated structure is then also wax coated and the waxed surface of the structure is brought into a contact with the waxed surface of photoresist. The original seed substrate is removed and the exposed surface is then coated with adhesive followed by dissolving wax through the openings in the perforated structure and attaching the layer with semiconductor devices and/or circuits to another permanent substrate. As an alternative, a disk-shaped water-soluble structure can be used instead of the perforated structure.

Abstract: A method for transferring of individual devices or circuit elements, fabricated on a semiconducting substrate, to a new substrate and placing said devices and elements in predetermined locations on the new substrate. The method comprises shaping the devices and circuits as truncated cones, lifting them off the original semiconducting substrates and depositing them en masse onto the new substrate, followed by their placing into receptors on the new substrate. The new substrate has preliminarily made receptors in a form of a truncated cone and the devices and circuits fill these receptors. Both the receptors and the devices and circuits have metallization contacts enabling to establish electrical contact between them. A method for real-time monitoring and verification of correctness of placement of the devices and circuits into the receptors by applying voltage pulse waveforms and measuring the resulting current pulse.

Abstract: A method for transferring layers containing semiconductor devices and/or circuits to substrates other than those on which these semiconductor devices and/or circuits have been originally fabricated. The method comprises fabricating the semiconductor devices and/or circuits, coating them with a protective layer of photoresist followed by coating with a layer of wax. A special perforated structure is then also wax coated and the waxed surface of the structure is brought into a contact with the waxed surface of photoresist. The original seed substrate is removed and the exposed surface is then coated with adhesive followed by dissolving wax through the openings in the perforated structure and attaching the layer with semiconductor devices and/or circuits to another permanent substrate. As an alternative, a disk-shaped water-soluble structure can be used instead of the perforated structure.

Abstract: A photoconductive substrate is provided to voltage modulate a liquid crystal layer in response to input light. The substrate is partitioned into electrically isolated pixels to eliminate lateral spread of charge carriers therein, and increase the dynamic range of the liquid crystal light valve while preserving resolution. The substrate is partitioned by forming an interconnecting network of deep trenches in a surface thereof, and filling the trenches with an insulating material such as silicon dioxide. The opposite surface of the substrate is etched away to expose the silicon dioxide in the trenches, thereby providing the substrate with partitions which extend completely therethrough between the opposite surfaces.

Abstract: A light valve (10) includes a layer of a liquid crystal (16), a MOS substrate structure (18) with a dielectric layer (24) and a semiconductor layer (26), and an optically isolating mirror (14) between the liquid crystal layer (16) and the substrate structure (18). An external AC biasing voltage is applied across the MOS substrate (18) and the liquid crystal layer (16). The liquid crystal layer (16) is sufficiently thick that it operates in the surface birefringent mode with a high contrast ratio and a short response time to changes in the write-in light beam, when a sufficiently high biasing voltage V.sub.p is applied.

Abstract: A photoconductive substrate is provided to voltage modulate a liquid crystal layer in response to input light. The substrate is partitioned into electrically isolated pixels to eliminate lateral spread of charge carriers therein, and increase the dynamic range of the liquid crystal light valve while preserving resolution. The substrate is partitioned by forming an interconnecting network of deep trenches in a surface thereof, and filling the trenches with an insulating material such as silicon dioxide. The opposite surface of the substrate is etched away to expose the silicon dioxide in the trenches, thereby providing the substrate with partitions which extend completely therethrough between the opposite surfaces.