Abstract: Examples discussed herein relate to managing power allocation for devices, such as network devices, with processing chip. In some examples, based on determining that a first temperature measurement of the processing chip does not satisfy an operating temperature threshold, the network device allocates power from a power source to a first heating element of the network device to heat the processing chip & allocates power from the power source to a second heating element of the network device to heat the processing chip. Based on determining that a second temperature measurement satisfies the operating temperature threshold, the network device allocates power from the power source to a set of power over ethernet ports of the network device & the first amount of power from the power source selectively to the first heating element to heat the processing chip.

Abstract: One aspect provides an FPGA chip mounted on a printed circuit board (PCB). The FPGA chip can include a joint test action group (JTAG) interface comprising a number of input/output pins and an enablement pin, and a control logic block coupled to the enablement pin of the JTAG interface. The control logic block can receive a control signal from an off-chip control unit and control a logical value of the enablement pin based on the received control signal, thereby facilitating the off-chip control unit to lock or unlock the JTAG interface. The FPGA chip can further include a detection logic block to detect an unauthorized access to the FPGA chip. An input to the detection logic is coupled to the enablement pin, and a conductive trace coupling the input of the detection logic block and the enablement pin is situated on an inner layer of the PCB.

Abstract: One aspect provides an FPGA chip mounted on a printed circuit board (PCB). The FPGA chip can include a joint test action group (JTAG) interface comprising a number of input/output pins and an enablement pin, and a control logic block coupled to the enablement pin of the JTAG interface. The control logic block can receive a control signal from an off-chip control unit and control a logical value of the enablement pin based on the received control signal, thereby facilitating the off-chip control unit to lock or unlock the JTAG interface. The FPGA chip can further include a detection logic block to detect an unauthorized access to the FPGA chip. An input to the detection logic is coupled to the enablement pin, and a conductive trace coupling the input of the detection logic block and the enablement pin is situated on an inner layer of the PCB.

Abstract: Examples discussed herein relate to managing power allocation for devices, such as network devices, with processing chip. In some examples, based on determining that a first temperature measurement of the processing chip does not satisfy an operating temperature threshold, the network device allocates power from a power source to a first heating element of the network device to heat the processing chip & allocates power from the power source to a second heating element of the network device to heat the processing chip. Based on determining that a second temperature measurement satisfies the operating temperature threshold, the network device allocates power from the power source to a set of power over ethernet ports of the network device & the first amount of power from the power source selectively to the first heating element to heat the processing chip.

Abstract: Systems and methods are provided for 8-channel surge protection for a network utilizing Power Over Ethernet (PoE). Four Bob Smith terminations are arranged such that one Bob Smith termination is coupled to each of four PoE nodes. Each Bob Smith termination includes a capacitor and a resistor pair coupled in series between its respective PoE node and a respective Bob Smith termination node, wherein a first pair of the Bob Smith terminations is connected between their respective PoE nodes and a first Bob Smith node and a second pair of the Bob Smith terminations is connected between their respective PoE nodes and a second Bob Smith node. The first Bob Smith node is capacitively isolated from ground via a first terminating capacitor component and a second Bob Smith node is capacitively isolated from ground via a second terminating capacitor component separate from the first terminating capacitor component.