Abstract: An electronic device comprises a heat source and a heat distribution structure coupled to the heat source to distribute heat generated by the heat source during operation of the electronic device.

Abstract: An electronic device may include a chassis. The electronic device may include a first electronic component that may include a first substrate and a first interconnect. The electronic device may include a second electronic component that may include a second substrate and a second interconnect. The second substrate may be physically separated from the first substrate. An electrical trace may be coupled to the chassis of the electronic device. The electrical trace may be sized and shaped to interface with the first interconnect of the first electronic component. The electrical trace may be sized and shaped to interface with the second interconnect of the second electronic component. The first electronic component and the second electronic component may be in electrical communication through the electrical trace coupled to the chassis of the electronic device.

Abstract: Electronic devices with moveable display screens are described herein. An example electronic device includes a lid having a first display screen and a base. The lid is moveably coupled to the base. The base includes a housing having a top side and a bottom side, a physical keyboard to be accessed on the top side of the housing, and a second display screen moveable between a first position in which the keyboard is exposed and a second position in which the second display screen covers the keyboard.

Abstract: Techniques for power tunnels on circuit boards are disclosed. A power tunnel may be created in a circuit board by drilling through non-conductive layers to a conductive trace and then filling in the hole with a conductor. A power tunnel can have a high cross-sectional area and can carry a larger amount of current than an equivalent-width trace, reducing the area on a circuit board required to carry that amount of current.

Abstract: Fan module interconnect apparatus are disclosed. An example fan module includes a fan and a fan housing to carry the fan. The fan is to rotate in the fan housing. A flange extends from the fan housing and including signal paths to provide an interconnect to electrically couple at least portions of a first electrical circuit and a second electrical circuit of an electronic device.

Abstract: An electronic device may include a chassis. The electronic device may include a first electronic component that may include a first substrate and a first interconnect. The electronic device may include a second electronic component that may include a second substrate and a second interconnect. The second substrate may be physically separated from the first substrate. An electrical trace may be coupled to the chassis of the electronic device. The electrical trace may be sized and shaped to interface with the first interconnect of the first electronic component. The electrical trace may be sized and shaped to interface with the second interconnect of the second electronic component. The first electronic component and the second electronic component may be in electrical communication through the electrical trace coupled to the chassis of the electronic device.

Abstract: Embodiments are generally directed to an apparatus utilizing computer on package construction. An embodiment of a computer includes a substrate; one or more semiconductor devices, the one or more semiconductor devices being direct chip attached to the substrate, the one or more semiconductor devices including a central processing unit (CPU); and one or more additional components installed on the substrate, wherein the computer excludes I/O components.

Abstract: A universal interconnection scheme enables system architecture modularization with a hot-pluggable external computing module, such as a PC-on-a-card device using USB type-C technology. With the flexibility to interchange the system computing module with an external module, system performance can be augmented to fulfill the essential needs of the user, whether the system is a portable low-power tablet device, a smartphone, a wearable device such as an Internet of Things device, or a high-performance PC.

Abstract: A universal interconnection scheme enables system architecture modularization with a hot-pluggable external computing module, such as a PC-on-a-card device using USB type-C technology. With the flexibility to interchange the system computing module with an external module, system performance can be augmented to fulfill the essential needs of the user, whether the system is a portable low-power tablet device, a smartphone, a wearable device such as an Internet of Things device, or a high-performance PC.

Abstract: Embodiments are generally directed to an apparatus utilizing computer on package construction. An embodiment of a computer includes a substrate; one or more semiconductor devices, the one or more semiconductor devices being direct chip attached to the substrate, the one or more semiconductor devices including a central processing unit (CPU); and one or more additional components installed on the substrate, wherein the computer excludes I/O components.