Patents by Inventor Khai Seen Yong

Khai Seen Yong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device including an encapsulation material defining notches
    Patent number: 10483178
    Abstract: A semiconductor device includes a first contact element, a second contact element, a semiconductor chip, and an encapsulation material. The first contact element is on a first side of the semiconductor device. The second contact element is on a second side of the semiconductor device opposite to the first side. The semiconductor chip is electrically coupled to the first contact element and the second contact element. The encapsulation material encapsulates the semiconductor chip and portions of the first contact element and the second contact element. The encapsulation material defines at least two notches on a third side of the semiconductor device extending between the first side and the second side.
    Type: Grant
    Filed: January 3, 2017
    Date of Patent: November 19, 2019
    Assignee: Infineon Technologies AG
    Inventors: Upendra Balehithlu Manjappaiah, Kok Kiat Koo, Khai Seen Yong
  • SEMICONDUCTOR DEVICE INCLUDING AN ENCAPSULATION MATERIAL DEFINING NOTCHES
    Publication number: 20180190557
    Abstract: A semiconductor device includes a first contact element, a second contact element, a semiconductor chip, and an encapsulation material. The first contact element is on a first side of the semiconductor device. The second contact element is on a second side of the semiconductor device opposite to the first side. The semiconductor chip is electrically coupled to the first contact element and the second contact element. The encapsulation material encapsulates the semiconductor chip and portions of the first contact element and the second contact element. The encapsulation material defines at least two notches on a third side of the semiconductor device extending between the first side and the second side.
    Type: Application
    Filed: January 3, 2017
    Publication date: July 5, 2018
    Applicant: Infineon Technologies AG
    Inventors: Upendra Balehithlu Manjappaiah, Kok Kiat Koo, Khai Seen Yong