Patents by Inventor Khalid ABDELAZIZ

Khalid ABDELAZIZ has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240304506
    Abstract: Embodiments disclosed herein include socket interconnects with liquid metal. In an embodiment, a board comprises a substrate. A pad may be provided over the substrate. In an embodiment, a confinement layer is over the substrate, where the confinement layer defines a cavity over the pad. In an embodiment, a liquid metal is on the pad within the cavity. In an embodiment, a protective layer is provided over the liquid metal.
    Type: Application
    Filed: March 6, 2023
    Publication date: September 12, 2024
    Inventors: Sangeon LEE, Tingting GAO, Xiao LU, Matthew MAGNAVITA, Khalid ABDELAZIZ