Abstract: A plasma assisted cryogenic cleaner for and a method of performing cleaning of a surface that must be substantially free of contaminants has a resiliently mounted nozzle for spraying a cryogenic cleaning medium on the surface. The cleaning is conducted by applying to the substrate surface a mixture of gases selected from the group consisting of oxygen, nitrogen, hydrogen, fluorine, hydrofluorocarbon or a mixture of such gases to both remove the photoresist layer and alter the composition of the residues such that the residues are soluble in water and/or have a weakened bonds that they can be removed with a stream of cryogenic medium. The cryogenic and plasma processes can be performed sequentially or simultaneously.

Abstract: A cryogenic cleaner for and a method of performing cleaning of a surface that must be substantially free of contaminants utilizing a multi-stage, multi-mode filtered carbon dioxide-containing cleaning medium. Multiple stages and multiple types of filtration/purification are provided to remove contaminants such as hydrocarbons from the medium. In accordance with preferred embodiments, a filtering/purification process is provided that desirably utilizes one or more of: condensation of the hydrocarbon; particulate filtration; chemical filtration using activated filters; and catalytic oxidation. In certain embodiments, a resiliently mounted nozzle is provided for spraying a cryogenic cleaning medium on the surface. The nozzle may be driven in an oscillatory manner at a predetermined amplitude and frequency so the nozzle spray is delivered in a manner to provide pulsing of the spray and to provide as “snow plow” effect on contaminants as the spray delivers the cleaning medium against the surface.

Abstract: A plasma assisted cryogenic cleaner for and a method of performing cleaning of a surface that must be substantially free of contaminants has a resiliently mounted nozzle for spraying a cryogenic cleaning medium on the surface. The cleaning is conducted by applying to the substrate surface a mixture of gases selected from the group consisting of oxygen, nitrogen, hydrogen, fluorine, hydrofluorocarbon or a mixture of such gases to both remove the photoresist layer and alter the composition of the residues such that the residues are soluble in water and/or have a weakened bonds that they can be removed with a stream of cryogenic medium. The cryogenic and plasma processes can be performed sequentially or simultaneously.

Abstract: A cryogenic cleaner for and a method of performing cleaning of a surface that must be substantially free of contaminants utilizing a multi-stage, multi-mode filtered carbon dioxide-containing cleaning medium. Multiple stages and multiple types of filtration/purification are provided to remove contaminants such as hydrocarbons from the medium. In accordance with preferred embodiments, a filtering/purification process is provided that desirably utilizes one or more of: condensation of the hydrocarbon; particulate filtration; chemical filtration using activated filters; and catalytic oxidation. In certain embodiments, a resiliently mounted nozzle is provided for spraying a cryogenic cleaning medium on the surface. The nozzle may be driven in an oscillatory manner at a predetermined amplitude and frequency so the nozzle spray is delivered in a manner to provide pulsing of the spray and to provide as “snow plow” effect on contaminants as the spray delivers the cleaning medium against the surface.

Abstract: A cryogenic cleaner for and a method of performing cleaning of a surface that must be substantially free of contaminants has a resiliently mounted nozzle for spraying a cryogenic cleaning medium on the surface. The nozzle is driven in an oscillatory manner at a predetermined amplitude and frequency so the nozzle spray is delivered in a manner to provide pulsing of the spray and to provide as “snow plow” effect on contaminants as the spray delivers the cleaning medium against the surface. The surface is transported past the nozzle, and the cleaning occurs in an enclosed controlled environment.

Abstract: A cryogenic cleaner for and a method of performing cleaning of a surface that must be substantially free of contaminants has a resiliently mounted nozzle for spraying a cryogenic cleaning medium on the surface. The nozzle is driven in an oscillatory manner at a predetermined amplitude and frequency so the nozzle spray is delivered in a manner to provide pulsing of the spray and to provide as “snow plow” effect on contaminants as the spray delivers the cleaning medium against the surface. The surface is transported past the nozzle, and the cleaning occurs in an enclosed controlled environment.

Abstract: A method and apparatus for automated interfacing with a processing tool in a manufacturing environment having a tilt mechanism and a rotation mechanism. In one embodiment, semiconductor wafers in a cassette are presented to a processing tool by tilting the cassette during movement towards the tool. The tilt mechanism provides a means for seating the wafers in the cassette. The rotation mechanism allows the cassette to be adjusted to meet a robotic arm which extracts wafers from the cassette. Where the cassette is part of a Standard Mechanical InterFace (SMIF) system, the pod is placed onto the interface apparatus, where the pod cover is removed to allow processing of the wafers. A bellows is provided to cover the exposed cassette, thus creating an extended mini-environment including the interface apparatus, tool, and pod cover. In one embodiment, the interface apparatus includes robotic arms and a lift mechanism.

Abstract: In one embodiment, a cart (5) having a first vessel (10) which fits within a second vessel (90) is used to transport and store an integrated circuit substrate. The integrated circuit substrate is placed within the first vessel (10) and the door (18) of the first vessel (10) is closed and sealed against a door seal (24). The first vessel (10) is then purged with nitrogen to expel moisture and reactive gases from the interior of the first vessel (10). After purging, the first vessel (10) is then placed within the second vessel (90). The door (102) of the second vessel (90) is then closed and sealed against a door seal (104). The second vessel (90) is then purged with nitrogen to expel moisture and reactive gases from the interior of the second vessel (90). The cart (5) containing the integrated circuit substrate is then transported to the next manufacturing area. Integrated circuits and other articles may be manufacturing using the cart system of the present invention.

Abstract: In one embodiment, a cart (5) having a first vessel (10) which fits within a second vessel (90) is used to transport and store an integrated circuit substrate. The integrated circuit substrate is placed within the first vessel (10) and the door (18) of the first vessel (10) is closed and sealed against a door seal (24). The first vessel (10) is then purged with nitrogen to expel moisture and reactive gases from the interior of the first vessel (10). After purging, the first vessel (10) is then placed within the second vessel (90). The door (102) of the second vessel (90) is then closed and sealed against a door seal (104). The second vessel (90) is then purged with nitrogen to expel moisture and reactive gases from the interior of the second vessel (90). The cart (5) containing the integrated circuit substrate is then transported to the next manufacturing area. Integrated circuits and other articles may be manufacturing using the cart system of the present invention.