Patents by Inventor Khalid Mohamed

Khalid Mohamed has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Photoresist strip method for low-k dielectrics
    Patent number: 8058178
    Abstract: The present invention pertains to methods for removing unwanted material from a semiconductor wafer during wafer manufacturing. More specifically, the invention pertains to stripping photo-resist material and removing etch-related residues from a semiconductor wafer. Methods involve implementing a plasma operation using hydrogen and a weak oxidizing agent, such as carbon dioxide. The invention is effective at stripping photo-resist and removing residues from low-k dielectric material used in Damascene devices.
    Type: Grant
    Filed: July 31, 2009
    Date of Patent: November 15, 2011
    Assignee: Novellus Systems, Inc.
    Inventors: Haruhiro Harry Goto, Ilia Kalinovski, Khalid Mohamed
  • Photoresist strip method for low-k dielectrics
    Patent number: 7585777
    Abstract: The present invention pertains to methods for removing unwanted material from a semiconductor wafer during wafer manufacturing. More specifically, the invention pertains to stripping photo-resist material and removing etch-related residues from a semiconductor wafer. Methods involve implementing a plasma operation using hydrogen and a weak oxidizing agent, such as carbon dioxide. The invention is effective at stripping photo-resist and removing residues from low-k dielectric material used in Damascene devices.
    Type: Grant
    Filed: September 21, 2007
    Date of Patent: September 8, 2009
    Assignee: Novellus Systems, Inc.
    Inventors: Haruhiro Harry Goto, Ilia Kalinovski, Khalid Mohamed
  • Photoresist strip method for low-k dielectrics
    Patent number: 7288484
    Abstract: The present invention pertains to methods for removing unwanted material from a semiconductor wafer during wafer manufacturing. More specifically, the invention pertains to stripping photo-resist material and removing etch-related residues from a semiconductor wafer. Methods involve implementing a plasma operation using hydrogen and a weak oxidizing agent, such as carbon dioxide. The invention is effective at stripping photo-resist and removing residues from low-k dielectric material used in Damascene devices.
    Type: Grant
    Filed: July 13, 2004
    Date of Patent: October 30, 2007
    Assignee: Novellus Systems, Inc.
    Inventors: Haruhiro Harry Goto, Ilia Kalinovski, Khalid Mohamed