Abstract: A hinge assembly for interconnecting and stably supporting the parts of an electronic device while enhancing the three-dimensional adjustability of the position of the device's parts. The hinge assembly provides for lineal adjustment of each device part using a shaft secured to the part, a sleeve slidably attached to the shaft and a clamp controlling the resistance of the sleeve. The hinge assembly further provides joints for rotational adjustment of each device part about an axis parallel to the part's horizontal axis and about a rotational axis parallel to the part's latitudinal axis. Each axis is formed using a first element having a substantially cylindrical aperture and a second element having a substantially cylindrical end such that the cylindrical end is rotatably mounted in the cylindrical aperture. An electrical connector is included in each joint to pass electrical signals regardless of rotational position.