Patents by Inventor Khandker Nazrul Quader
Khandker Nazrul Quader has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11923341Abstract: An electronic device with embedded access to a high-bandwidth, high-capacity fast-access memory includes (a) a memory circuit fabricated on a first semiconductor die, wherein the memory circuit includes numerous modular memory units, each modular memory unit having (i) a three-dimensional array of storage transistors, and (ii) a group of conductors exposed to a surface of the first semiconductor die, the group of conductors being configured for communicating control, address and data signals associated the memory unit; and (b) a logic circuit fabricated on a second semiconductor die, wherein the logic circuit also includes conductors each exposed at a surface of the second semiconductor die, wherein the first and second semiconductor dies are wafer-bonded, such that the conductors exposed at the surface of the first semiconductor die are each electrically connected to a corresponding one of the conductors exposed to the surface of the second semiconductor die.Type: GrantFiled: September 3, 2021Date of Patent: March 5, 2024Assignee: SUNRISE MEMORY CORPORATIONInventors: Khandker Nazrul Quader, Robert Norman, Frank Sai-keung Lee, Christopher J. Petti, Scott Brad Herner, Siu Lung Chan, Sayeef Salahuddin, Mehrdad Mofidi, Eli Harari
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Publication number: 20230260969Abstract: An electronic device with embedded access to a high-bandwidth, high-capacity fast-access memory includes (a) a memory circuit fabricated on a first semiconductor die, wherein the memory circuit includes numerous modular memory units, each modular memory unit having (i) a three-dimensional array of storage transistors, and (ii) a group of conductors exposed to a surface of the first semiconductor die, the group of conductors being configured for communicating control, address and data signals associated the memory unit; and (b) a logic circuit fabricated on a second semiconductor die, wherein the logic circuit also includes conductors each exposed at a surface of the second semiconductor die, wherein the first and second semiconductor dies are wafer-bonded, such that the conductors exposed at the surface of the first semiconductor die are each electrically connected to a corresponding one of the conductors exposed to the surface of the second semiconductor die.Type: ApplicationFiled: April 24, 2023Publication date: August 17, 2023Inventors: Khandker Nazrul Quader, Robert Norman, Frank Sai-keung Lee, Christopher J. Petti, Scott Brad Herner, Siu Lung Chan, Sayeef Salahuddin, Mehrdad Mofidi, Eli Harari
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Publication number: 20230259283Abstract: A first circuit formed on a first semiconductor substrate is wafer-bonded to a second circuit formed on a second memory circuit, wherein the first circuit includes quasi-volatile or non-volatile memory circuits and wherein the second memory circuit includes fast memory circuits that have lower read latencies than the quasi-volatile or non-volatile memory circuits, as well as logic circuits. The volatile and non-volatile memory circuits may include static random-access memory (SRAM) circuits, dynamic random-access memory (DRAM) circuits, embedded DRAM (eDRAM) circuits, magnetic random-access memory (MRAM) circuits, embedded MRAM (eMRAM), or any suitable combination of these circuits.Type: ApplicationFiled: April 24, 2023Publication date: August 17, 2023Inventors: Youn Cheul Kim, Richard S. Chernicoff, Khandker Nazrul Quader, Robert D. Norman, Tianhong Yan, Sayeef Salahuddin, Eli Harari
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Patent number: 11675500Abstract: A first circuit formed on a first semiconductor substrate is wafer-bonded to a second circuit formed on a second memory circuit, wherein the first circuit includes quasi-volatile or non-volatile memory circuits and wherein the second memory circuit includes fast memory circuits that have lower read latencies than the quasi-volatile or non-volatile memory circuits, as well as logic circuits. The volatile and non-volatile memory circuits may include static random-access memory (SRAM) circuits, dynamic random-access memory (DRAM) circuits, embedded DRAM (eDRAM) circuits, magnetic random-access memory (MRAM) circuits, embedded MRAM (eMRAM), or any suitable combination of these circuits.Type: GrantFiled: February 5, 2021Date of Patent: June 13, 2023Assignee: SUNRISE MEMORY CORPORATIONInventors: Youn Cheul Kim, Richard S. Chernicoff, Khandker Nazrul Quader, Robert D. Norman, Tianhong Yan, Sayeef Salahuddin, Eli Harari
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Patent number: 11670620Abstract: An electronic device with embedded access to a high-bandwidth, high-capacity fast-access memory includes (a) a memory circuit fabricated on a first semiconductor die, wherein the memory circuit includes numerous modular memory units, each modular memory unit having (i) a three-dimensional array of storage transistors, and (ii) a group of conductors exposed to a surface of the first semiconductor die, the group of conductors being configured for communicating control, address and data signals associated the memory unit; and (b) a logic circuit fabricated on a second semiconductor die, wherein the logic circuit also includes conductors each exposed at a surface of the second semiconductor die, wherein the first and second semiconductor dies are wafer-bonded, such that the conductors exposed at the surface of the first semiconductor die are each electrically connected to a corresponding one of the conductors exposed to the surface of the second semiconductor die.Type: GrantFiled: January 29, 2020Date of Patent: June 6, 2023Assignee: SUNRISE MEMORY CORPORATIONInventors: Khandker Nazrul Quader, Robert Norman, Frank Sai-keung Lee, Christopher J. Petti, Scott Brad Herner, Siu Lung Chan, Sayeef Salahuddin, Mehrdad Mofidi, Eli Harari
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Publication number: 20230131169Abstract: A high-capacity system memory may be built from both quasi-volatile (QV) memory circuits, logic circuits, and static random-access memory (SRAM) circuits. Using the SRAM circuits as buffers or cache for the QV memory circuits, the system memory may achieve access latency performance of the SRAM circuits and may be used as code memory. The system memory is also capable of direct memory access (DMA) operations and includes an arithmetic logic unit for performing computational memory tasks. The system memory may include one or more embedded processor. In addition, the system memory may be configured for multi-channel memory accesses by multiple host processors over multiple host ports. The system memory may be provided in the dual-in-line memory module (DIMM) format.Type: ApplicationFiled: December 22, 2022Publication date: April 27, 2023Inventors: Robert D. Norman, Eli Harari, Khandker Nazrul Quader, Frank Sai-keung Lee, Richard S. Chernicoff, Youn Cheul Kim, Mehrdad Mofidi
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Patent number: 11580038Abstract: A high-capacity system memory may be built from both quasi-volatile (QV) memory circuits, logic circuits, and static random-access memory (SRAM) circuits. Using the SRAM circuits as buffers or cache for the QV memory circuits, the system memory may achieve access latency performance of the SRAM circuits and may be used as code memory. The system memory is also capable of direct memory access (DMA) operations and includes an arithmetic logic unit for performing computational memory tasks. The system memory may include one or more embedded processor. In addition, the system memory may be configured for multi-channel memory accesses by multiple host processors over multiple host ports. The system memory may be provided in the dual-in-line memory module (DIMM) format.Type: GrantFiled: February 5, 2021Date of Patent: February 14, 2023Assignee: SUNRISE MEMORY CORPORATIONInventors: Robert D. Norman, Eli Harari, Khandker Nazrul Quader, Frank Sai-keung Lee, Richard S. Chernicoff, Youn Cheul Kim, Mehrdad Mofidi
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Publication number: 20210398949Abstract: An electronic device with embedded access to a high-bandwidth, high-capacity fast-access memory includes (a) a memory circuit fabricated on a first semiconductor die, wherein the memory circuit includes numerous modular memory units, each modular memory unit having (i) a three-dimensional array of storage transistors, and (ii) a group of conductors exposed to a surface of the first semiconductor die, the group of conductors being configured for communicating control, address and data signals associated the memory unit; and (b) a logic circuit fabricated on a second semiconductor die, wherein the logic circuit also includes conductors each exposed at a surface of the second semiconductor die, wherein the first and second semiconductor dies are wafer-bonded, such that the conductors exposed at the surface of the first semiconductor die are each electrically connected to a corresponding one of the conductors exposed to the surface of the second semiconductor die.Type: ApplicationFiled: September 3, 2021Publication date: December 23, 2021Inventors: Khandker Nazrul Quader, Robert Norman, Frank Sai-keung Lee, Christopher J. Petti, Scott Brad Herner, Siu Lung Chan, Sayeef Salahuddin, Mehrdad Mofidi, Eli Harari
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Publication number: 20210247910Abstract: A first circuit formed on a first semiconductor substrate is wafer-bonded to a second circuit formed on a second memory circuit, wherein the first circuit includes quasi-volatile or non-volatile memory circuits and wherein the second memory circuit includes fast memory circuits that have lower read latencies than the quasi-volatile or non-volatile memory circuits, as well as logic circuits. The volatile and non-volatile memory circuits may include static random-access memory (SRAM) circuits, dynamic random-access memory (DRAM) circuits, embedded DRAM (eDRAM) circuits, magnetic random-access memory (MRAM) circuits, embedded MRAM (eMRAM), or any suitable combination of these circuits.Type: ApplicationFiled: February 5, 2021Publication date: August 12, 2021Inventors: Youn Cheul Kim, Richard S. Chernicoff, Khandker Nazrul Quader, Robert D. Norman, Tianhong Yan, Sayeef Salahuddin, Eli Harari
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Publication number: 20210248094Abstract: A high-capacity system memory may be built from both quasi-volatile (QV) memory circuits, logic circuits, and static random-access memory (SRAM) circuits. Using the SRAM circuits as buffers or cache for the QV memory circuits, the system memory may achieve access latency performance of the SRAM circuits and may be used as code memory. The system memory is also capable of direct memory access (DMA) operations and includes an arithmetic logic unit for performing computational memory tasks. The system memory may include one or more embedded processor. In addition, the system memory may be configured for multi-channel memory accesses by multiple host processors over multiple host ports. The system memory may be provided in the dual-in-line memory module (DIMM) format.Type: ApplicationFiled: February 5, 2021Publication date: August 12, 2021Inventors: Robert D. Norman, Eli Harari, Khandker Nazrul Quader, Frank Sai-keung Lee, Richard S. Chernicoff, Youn Cheul Kim, Mehrdad Mofidi
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Publication number: 20200243486Abstract: An electronic device with embedded access to a high-bandwidth, high-capacity fast-access memory includes (a) a memory circuit fabricated on a first semiconductor die, wherein the memory circuit includes numerous modular memory units, each modular memory unit having (i) a three-dimensional array of storage transistors, and (ii) a group of conductors exposed to a surface of the first semiconductor die, the group of conductors being configured for communicating control, address and data signals associated the memory unit; and (b) a logic circuit fabricated on a second semiconductor die, wherein the logic circuit also includes conductors each exposed at a surface of the second semiconductor die, wherein the first and second semiconductor dies are wafer-bonded, such that the conductors exposed at the surface of the first semiconductor die are each electrically connected to a corresponding one of the conductors exposed to the surface of the second semiconductor die.Type: ApplicationFiled: January 29, 2020Publication date: July 30, 2020Applicant: Sunrise Memory CorporationInventors: Khandker Nazrul Quader, Robert Norman, Frank Sai-keung Lee, Christopher J. Petti, Scott Brad Herner, Siu Lung Chan, Sayeef Salahuddin, Mehrdad Mofidi, Eli Harari
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Patent number: 5994937Abstract: According to the preferred embodiment of the present invention, an ATD pulse generating mechanism is provided that overcomes the limitations of the prior art by compensating for process and power supply voltage variations that would normally effect the pulse width. In particular, the delays used to create the pulse width are adjusted to compensate for the effects of process and environmental variations, thereby providing a pulse width that is relatively constant over these variations.Type: GrantFiled: November 6, 1996Date of Patent: November 30, 1999Assignees: International Business Machines Corporation, Kabushiki Kaisha ToshibaInventors: Takahiko Hara, Khandker Nazrul Quader, Yohji Watanabe