Patents by Inventor Khang Duy Tran

Khang Duy Tran has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20190337848
    Abstract: The present invention relates to relates to method for producing construction aggregate, comprising the steps of: (i) preparing materials, which comprises (% by weight): fly ash (80 to 99.75%); alkaline activator (0.25 to 20%); water (6 to 30% of total weight of fly ash and alkaline activator); (ii) mixing the alkaline activator with all the aforementioned water amount to create alkaline activator solution, after which will be mixed with fly ash to create geopolymer mortar; (iii) molding the geopolymer mortar with the compressive force of 2 MPa and more with desired dimension, wherein the molding is carried out with hydraulic pressing, extrusion, rolling or tablet lamination. (iv) solidifying; and (v) optionally, crushing the construction aggregate obtained above to a predefined dimension. Besides, the present invention relates to the construction aggregate from fly ash obtained by the above mentioned method.
    Type: Application
    Filed: April 5, 2019
    Publication date: November 7, 2019
    Inventors: Nghia Trung Tran, Hau Trung Tran, Khang Duy Vu Huynh
  • Patent number: 9545017
    Abstract: Invention z-axis interconnection structures provide a means to mechanically and electrically interconnect layers of metallization in electronic substrates reliably and in any configuration. Invention z-axis interconnection structures comprise a novel bonding film and conductive paste and one- and two-piece building block structures formed therefrom.
    Type: Grant
    Filed: February 18, 2014
    Date of Patent: January 10, 2017
    Assignees: Ormet Circuits, Inc., Integral Technology, Inc.
    Inventors: Christopher A Hunrath, Khang Duy Tran, Catherine A Shearer, Kenneth C Holcomb, G Delbert Friesen
  • Publication number: 20140231126
    Abstract: Invention z-axis interconnection structures provide a means to mechanically and electrically interconnect layers of metallization in electronic substrates reliably and in any configuration. Invention z-axis interconnection structures comprise a novel bonding film and conductive paste and one- and two-piece building block structures formed therefrom.
    Type: Application
    Filed: February 18, 2014
    Publication date: August 21, 2014
    Applicants: INTEGRAL TECHNOLOGY, INC., ORMET CIRCUITS, INC.
    Inventors: Christopher A Hunrath, Khang Duy Tran, Catherine A Shearer, Kenneth C Holcomb, G Delbert Friesen