Patents by Inventor Khang Duy Tran

Khang Duy Tran has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Structures for z-axis interconnection of multilayer electronic substrates
    Patent number: 9545017
    Abstract: Invention z-axis interconnection structures provide a means to mechanically and electrically interconnect layers of metallization in electronic substrates reliably and in any configuration. Invention z-axis interconnection structures comprise a novel bonding film and conductive paste and one- and two-piece building block structures formed therefrom.
    Type: Grant
    Filed: February 18, 2014
    Date of Patent: January 10, 2017
    Assignees: Ormet Circuits, Inc., Integral Technology, Inc.
    Inventors: Christopher A Hunrath, Khang Duy Tran, Catherine A Shearer, Kenneth C Holcomb, G Delbert Friesen
  • STRUCTURES FOR Z-AXIS INTERCONNECTION OF MULTILAYER ELECTRONIC SUBSTRATES
    Publication number: 20140231126
    Abstract: Invention z-axis interconnection structures provide a means to mechanically and electrically interconnect layers of metallization in electronic substrates reliably and in any configuration. Invention z-axis interconnection structures comprise a novel bonding film and conductive paste and one- and two-piece building block structures formed therefrom.
    Type: Application
    Filed: February 18, 2014
    Publication date: August 21, 2014
    Applicants: INTEGRAL TECHNOLOGY, INC., ORMET CIRCUITS, INC.
    Inventors: Christopher A Hunrath, Khang Duy Tran, Catherine A Shearer, Kenneth C Holcomb, G Delbert Friesen