Abstract: An apparatus for molding a physical body comprising at least two mold materials, wherein the apparatus comprises a first mold tool and a second mold tool configured for defining a mold volume in between in which the physical body is moldable by supplying the at least two mold materials, and a supply unit configured for separately supplying the at least two mold materials to the mold volume, wherein at least part of at least one of the first mold tool and the second mold tool is movable to thereby increase the dimension of the mold volume after having supplied the first mold material to the mold volume and before and/or during supplying the second mold material to the mold volume.

Abstract: A method of fabricating a semiconductor package comprises providing a carrier, fabricating an opening in the carrier, attaching a semiconductor chip to the carrier and fabricating an encapsulation body covering the semiconductor chip.

Abstract: Various embodiments provide a method of forming a semiconductor package. The method includes arranging a semiconductor die and a first substrate, wherein the first substrate includes a first side, wherein the first side includes a first electrical contact. The method may include forming a mold structure to encapsulate the semiconductor die and the first substrate. The method may further include providing a three-dimensional antenna in the mold structure to electrically couple to the first electrical contact. Various embodiments also provide a semiconductor package including a semiconductor die and a first substrate encapsulated by a mold structure. A three-dimensional antenna is provided in the mold and electrically coupled to the first substrate.

Abstract: A method of fabricating a semiconductor package comprises providing a carrier, fabricating an opening in the carrier, attaching a semiconductor chip to the carrier and fabricating an encapsulation body covering the semiconductor chip.

Abstract: An apparatus for molding a physical body comprising at least two mold materials, wherein the apparatus comprises a first mold tool and a second mold tool configured for defining a mold volume in between in which the physical body is moldable by supplying the at least two mold materials, and a supply unit configured for separately supplying the at least two mold materials to the mold volume, wherein at least part of at least one of the first mold tool and the second mold tool is movable to thereby increase the dimension of the mold volume after having supplied the first mold material to the mold volume and before and/or during supplying the second mold material to the mold volume.