Abstract: A camera module with no PCB that instead has a lens actuator/housing that has circuitry on a bottom surface thereof for direct electrical connection to a mobile electronic device. The housing further has a recess formed in the bottom surface thereof to receive an image sensor. The circuitry is three-dimensional in that it includes a first set of contact pads on one planar surface for connection to the mobile electronic device, a second set of contact pads on a planar surface within the recess for connection to the image sensor, and conductive traces that connect each of the contact pads of the first set with an associated one of the contact pads of the second set by having the trace follow a path from the first planar surface, along a intersecting third planar surface to the second planar surface.

Abstract: A camera module including an image sensor and a circuit substrate that are each attached to a bottom surface of a glass substrate. The image sensor is positioned between the circuit substrate and the glass substrate. This arrangement allows passive components normally associated with the image sensor to be mounted to a top surface of the glass substrate rather than to the image sensor, thus reducing the necessary size of the top surface of the image sensor, which in turn can reduce the overall size of the image sensor. A lens assembly, including a housing and a lens, is attached to the circuit substrate to position the image sensor and the glass substrate within a cavity provided in the housing.

Abstract: A camera module having a flash that is provided therein. The flash may be an LED light source. The LED may come in a package that is generally rectangular, with the exception that one corner is flattened. The camera module includes a housing that receives the light source, an image sensor, and a lens. The housing includes mating features that receive the LED package, those features including a flattened corner so that the LED package can only be received within the housing when it is properly oriented. The housing also includes electrical terminals for connection to the LED that include springs. When the LED package is properly oriented and received within the housing, contact pads on the LED package and the electrical terminals on the housing are pressed together against the resilient force of the spring.

Abstract: A camera module having a liquid crystal shutter that controls the time period during which the image sensor is exposed to light directed into the camera module. The shutter is located within the camera module housing, which may include EMI shielding and may include a lens actuator for moving a movable lens group. The shutter may be located before or after the movable lens group and before or after a fixed lens group that may also be included. The camera module may also include an IR filter for reducing the amount of IR light that reaches the image sensor.

Abstract: A camera module including an image sensor and a circuit substrate that are each attached to a bottom surface of a glass substrate. The image sensor is positioned between the circuit substrate and the glass substrate. This arrangement allows passive components normally associated with the image sensor to be mounted to a top surface of the glass substrate rather than to the image sensor, thus reducing the necessary size of the top surface of the image sensor, which in turn can reduce the overall size of the image sensor. A lens assembly, including a housing and a lens, is attached to the circuit substrate to position the image sensor and the glass substrate within a cavity provided in the housing.

Abstract: A camera module having a liquid crystal shutter that controls the time period during which the image sensor is exposed to light directed into the camera module. The shutter is located within the camera module housing, which may include EMI shielding and may include a lens actuator for moving a movable lens group. The shutter may be located before or after the movable lens group and before or after a fixed lens group that may also be included. The camera module may also include an IR filter for reducing the amount of IR light that reaches the image sensor.

Abstract: A camera module with no PCB that instead has a lens actuator/housing that has circuitry on a bottom surface thereof for direct electrical connection to a mobile electronic device. The housing further has a recess formed in the bottom surface thereof to receive an image sensor. The circuitry is three-dimensional in that it includes a first set of contact pads on one planar surface for connection to the mobile electronic device, a second set of contact pads on a planar surface within the recess for connection to the image sensor, and conductive traces that connect each of the contact pads of the first set with an associated one of the contact pads of the second set by having the trace follow a path from the first planar surface, along a intersecting third planar surface to the second planar surface.

Abstract: A camera module having a flash that is provided therein. The flash may be an LED light source. The LED may come in a package that is generally rectangular, with the exception that one corner is flattened. The camera module includes a housing that receives the light source, an image sensor, and a lens. The housing includes mating features that receive the LED package, those features including a flattened corner so that the LED package can only be received within the housing when it is properly oriented. The housing also includes electrical terminals for connection to the LED that include springs. When the LED package is properly oriented and received within the housing, contact pads on the LED package and the electrical terminals on the housing are pressed together against the resilient force of the spring.