Abstract: A method is provided for fabricating micro-electromechanical devices. Generally, the method includes: (i) forming a device layer over a sacrificial layer on a surface of a substrate; (ii) patterning the device layer to form a number of ribbons each including a long axis parallel to the surface of the substrate and a middle section between support structures at both ends of the ribbon; (iii) partially removing the sacrificial layer to undercut the number of ribbons; (iv) forming a reflective coating of a reflective material on the number of ribbons; and (v) releasing the middle section of at least one of the number of ribbons by removing the sacrificial layer. Undercutting the ribbons prior to forming the reflective coating reduces build-up of material on sidewalls of the sacrificial layer facilitating release of the ribbons. Other embodiments are also disclosed.