Abstract: Methods of bonding components for fabricating electronic assemblies and electronic assemblies including bonded components are provided herein. In one example, a method of bonding components for fabricating an electronic assembly comprises the steps of disposing a first layer of a first high temperature metal-containing paste adjacent to a first component. A second layer of a second high temperature metal-containing paste is disposed adjacent to a second component. A nanostructured multilayer reactive foil is disposed between the first and second layers. The nanostructured multilayer reactive foil is activated to sinter the first and second layers and bond the first and second components.

Abstract: A power module system for a vehicle includes a circuit board, a power transistor mounted to the circuit board, and a temperature sensor mounted to the circuit board in a sensing location remote from the power transistor. The temperature sensor is configured to measure a real-time temperature at the sensing location. The system also includes a processor coupled to the temperature sensor to generate a predicted real-time silicon temperature for the power transistor from the measured real-time temperature at the sensing location. The predicted real-time silicon temperature is generated using a selected calibration curve that corresponds to a current operating state of the vehicle.

Abstract: Methods of bonding components for fabricating electronic assemblies and electronic assemblies including bonded components are provided herein. In one example, a method of bonding components for fabricating an electronic assembly comprises the steps of disposing a first layer of a first high temperature metal-containing paste adjacent to a first component. A second layer of a second high temperature metal-containing paste is disposed adjacent to a second component. A nanostructured multilayer reactive foil is disposed between the first and second layers. The nanostructured multilayer reactive foil is activated to sinter the first and second layers and bond the first and second components.

Abstract: A power module system for a vehicle includes a circuit board, a power transistor mounted to the circuit board, and a temperature sensor mounted to the circuit board in a sensing location remote from the power transistor. The temperature sensor is configured to measure a real-time temperature at the sensing location. The system also includes a processor coupled to the temperature sensor to generate a predicted real-time silicon temperature for the power transistor from the measured real-time temperature at the sensing location. The predicted real-time silicon temperature is generated using a selected calibration curve that corresponds to a current operating state of the vehicle.

Abstract: A permanent magnetic machine includes a stator body having a first end, a second end, and a plurality of generally radial slots formed therein for accepting a set of windings having a first set of end-turns at the first end and a second set of end-turns at the second end. The stator body has a plurality of channels adjacent to the slots and extending from the first end of the stator body to the second end of the stator body, wherein the channels are configured to allow the flow of a cooling fluid therethrough. A plurality of nozzles in fluid communication with the plurality of channels are configured to spray the cooling fluid onto the first and second set of end turns.

Abstract: Systems and methods are disclosed for a dual voltage-source inverter system. The systems and methods selectively couple a first voltage source and a second voltage source to an inverter via a controllable switch.

Abstract: Systems and apparatus are provided for power electronics substrates adapted for direct substrate cooling. A power electronics substrate comprises a first surface configured to have electrical circuitry disposed thereon, a second surface, and a plurality of physical features on the second surface. The physical features are configured to promote a turbulent boundary layer in a coolant impinged upon the second surface.

Abstract: An attachment arrangement for a heat sink includes, but is not limited to, an attachment surface defined on the heat sink. A thermally conductive adhesive is disposed on the attachment surface. A substrate is attached to the attachment surface via the thermally conductive adhesive. The thermally conductive adhesive defines a discontinuity that is disposed in a delamination path of the thermally conductive adhesive.

Abstract: Damping mechanisms and motor assemblies are provided. In an embodiment, by way of example only, a damping mechanism includes an end cap, a bearing retainer plate, a bearing damper ring, a bearing assembly, and first and second lateral dampers. The bearing damper ring is disposed in an annular cavity inwardly from an inner diameter surface of the end cap and has a radially inwardly-extending flange. The bearing assembly is disposed in the annular cavity radially inwardly relative to the bearing damper ring. The first lateral damper is disposed between a radially inwardly-extending wall of the end cap and the bearing damper ring. The second lateral damper is disposed between the bearing damper ring and the bearing retainer plate.

Abstract: Systems and apparatus are provided for power electronics substrates adapted for direct substrate cooling. A power electronics substrate comprises a first surface configured to have electrical circuitry disposed thereon, a second surface, and a plurality of physical features on the second surface. The physical features are configured to promote a turbulent boundary layer in a coolant impinged upon the second surface.

Abstract: Systems and methods are disclosed for a dual voltage-source inverter system. The systems and methods selectively couple a first voltage source and a second voltage source to an inverter via a controllable switch.

Abstract: Damping mechanisms and motor assemblies are provided. In an embodiment, by way of example only, a damping mechanism includes an end cap, a bearing retainer plate, a bearing damper ring, a bearing assembly, and first and second lateral dampers. The bearing damper ring is disposed in an annular cavity inwardly from an inner diameter surface of the end cap and has a radially inwardly-extending flange. The bearing assembly is disposed in the annular cavity radially inwardly relative to the bearing damper ring. The first lateral damper is disposed between a radially inwardly-extending wall of the end cap and the bearing damper ring. The second lateral damper is disposed between the bearing damper ring and the bearing retainer plate.

Abstract: An internal permanent magnet machine (“IPM machine”) of the type used, for example, with traction motors and hybrid electric vehicles, includes a rotor having a plurality of equal-sized (e.g., rectilinear) segmented ferrite magnets arranged in one or more layers. The magnets are inserted within rotor slots that are larger than the magnets themselves, such that one or more air gaps are formed adjacent to the magnets in each layer.

Abstract: A permanent magnetic machine includes a stator body having a first end, a second end, and a plurality of generally radial slots formed therein for accepting a set of windings having a first set of end-turns at the first end and a second set of end-turns at the second end. The stator body has a plurality of channels adjacent to the slots and extending from the first end of the stator body to the second end of the stator body, wherein the channels are configured to allow the flow of a cooling fluid therethrough. A plurality of nozzles in fluid communication with the plurality of channels are configured to spray the cooling fluid onto the first and second set of end turns.

Abstract: An internal permanent magnet machine (“IPM machine”) of the type used, for example, with traction motors and hybrid electric vehicles, includes a rotor having a plurality of equal-sized (e.g., rectilinear) segmented ferrite magnets arranged in one or more layers. The magnets are inserted within rotor slots that are larger than the magnets themselves, such that one or more air gaps are formed adjacent to the magnets in each layer.

Abstract: A method for cooling an inverter of a vehicle system includes the steps of providing a flow of cooling fluid to the inverter, determining a value of a variable that is influenced at least in part by the flow of cooling fluid to the inverter, and regulating the flow of cooling fluid to the inverter based at least in part on the value of the variable.