Patents by Inventor Khin Hoong Lim

Khin Hoong Lim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8847347
    Abstract: Disclosed is an integrated circuit die comprising an active substrate including a plurality of components laterally separated from each other by respective isolation structures, at least some of the isolation structures carrying a further component, wherein the respective portions of the active substrate underneath the isolation structures carrying said further components are electrically insulated from said components. A method of manufacturing such an IC die is also disclosed.
    Type: Grant
    Filed: November 28, 2012
    Date of Patent: September 30, 2014
    Assignee: NXP B.V.
    Inventors: Piet Wessels, Nico Berckmans, Khin Hoong Lim, Michael John Ben Bolt, Jerome Guillaume Anna Dubois, Naveen Agrawal, Gaurav Singh Bisht, Jayaraj Thillaigovindan, Jie Liao