Patents by Inventor Khosro Khakzadi

Khosro Khakzadi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7269803
    Abstract: A system and method for mapping Intellectual Property (IP) components onto a pre-fabricated chip slice allows a user to select a target location for placement of an IP component onto a slice. A slice definition of the pre-fabricated chip slice is searched for a legal location for the IP component that is near to the target location. The IP component is mapped to the legal location.
    Type: Grant
    Filed: December 18, 2003
    Date of Patent: September 11, 2007
    Assignee: LSI Corporation
    Inventors: Khosro Khakzadi, Chris J. Tremel, Michael N. Dillon
  • Publication number: 20050138595
    Abstract: A system and method for mapping IP components onto a pre-fabricated chip slice allows a user to select a target location for placement of an IP component onto a slice. A slice definition of the pre-fabricated chip slice is searched for a legal location for the IP component that is near to the target location. The IP component is mapped to the legal location.
    Type: Application
    Filed: December 18, 2003
    Publication date: June 23, 2005
    Applicant: LSI Logic Corporation
    Inventors: Khosro Khakzadi, Chris Tremel, Michael Dillon
  • Publication number: 20050114818
    Abstract: A command processor of an integrated circuit design suite has a graphical user interface and a command interpreter for interpreting user commands. The graphical user interface is specified entirely by a user at run time. One or more design tools corresponding to processes within an integrated circuit design process operate under the control of the command processor and within the graphical user interface.
    Type: Application
    Filed: November 21, 2003
    Publication date: May 26, 2005
    Applicant: LSI Logic Corporation
    Inventors: Khosro Khakzadi, Michael Dillon, Donald Amundson
  • Patent number: 6748579
    Abstract: A method is provided for fabricating an integrated circuit having a logical function. The method includes fabricating first and second routing layer masks and a first via mask. The first routing layer mask includes power supply segments and signal segments. The second routing layer mask includes signal segments and filler segments, wherein the filler segments are located in unused areas of the second routing layer mask. The first via mask defines vias that electrically couple the filler segments to the power supply segments. If the logical function is changed after the masks have been fabricated, a second via mask is fabricated. The second via mask decouples a filler segment from the power supply segments and couples the filler segment to a signal segment defined by the first routing layer mask to implement the logical function change. The integrated circuit is then fabricated with the first and second routing layer masks and the second via mask.
    Type: Grant
    Filed: August 30, 2002
    Date of Patent: June 8, 2004
    Assignee: LSI Logic Corporation
    Inventors: Michael N. Dillon, Khosro Khakzadi, Scott A. Peterson
  • Publication number: 20040044983
    Abstract: A method is provided for fabricating an integrated circuit having a logical function. The method includes fabricating first and second routing layer masks and a first via mask. The first routing layer mask includes power supply segments and signal segments. The second routing layer mask includes signal segments and filler segments, wherein the filler segments are located in unused areas of the second routing layer mask. The first via mask defines vias that electrically couple the filler segments to the power supply segments. If the logical function is changed after the masks have been fabricated, a second via mask is fabricated. The second via mask decouples a filler segment from the power supply segments and couples the filler segment to a signal segment defined by the first routing layer mask to implement the logical function change. The integrated circuit is then fabricated with the first and second routing layer masks and the second via mask.
    Type: Application
    Filed: August 30, 2002
    Publication date: March 4, 2004
    Inventors: Michael N. Dillon, Khosro Khakzadi, Scott A. Peterson