Patents by Inventor Khristopher Alvarez

Khristopher Alvarez has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10435585
    Abstract: A curable composition comprises a cationic polymerizable material. The curable composition further comprises a diluent component comprising a silane compound having a single silicon-bonded cationic polymerizable group. A method of forming a cured article with the curable composition is also disclosed. The method comprises applying the curable composition on a substrate to form a film. The method further comprises curing the film on the substrate to form the cured article. The present invention also provides the cured article formed in accordance with the method.
    Type: Grant
    Filed: May 15, 2014
    Date of Patent: October 8, 2019
    Assignee: Dow Corning Corporation
    Inventors: Khristopher Alvarez, Chad Amb, Sarah Breed, Brandon Swatowski
  • Publication number: 20160102226
    Abstract: A curable composition comprises a cationic polymerizable material. The curable composition further comprises a diluent component comprising a silane compound having a single silicon-bonded cationic polymerizable group. A method of forming a cured article with the curable composition is also disclosed. The method comprises applying the curable composition on a substrate to form a film. The method further comprises curing the film on the substrate to form the cured article. The present invention also provides the cured article formed in accordance with the method.
    Type: Application
    Filed: May 15, 2014
    Publication date: April 14, 2016
    Inventors: Khristopher Alvarez, Chad Amb, Sarah Breed, Brandon Swatowski
  • Patent number: 8618233
    Abstract: A polymer cures by either radiation or moisture curing mechanisms, or both. The polymer is prepared by hydrosilylation. The polymer includes units of formula: (R22Si02/2)b, (R2Si03/2)c, (SiO4/2)d, (R1?)f, and (R23Si01/2)g, where each R1 is independently an oxygen atom or a divalent hydrocarbon group; each R1? is independently divalent hydrocarbon group; each R2 is independently a monovalent organic group that is free of terminal aliphatic unsaturation each X is independently a monovalent hydrolyzable group; each J is independently a monovalent epoxy functional organic group; subscript a has a value of 1 or more; subscript b has a value of 0 or more; subscript c has a value of 0 or more; subscript d has a value of 0 or more; subscript e has a value of 1 or more; subscript f has a value of 0 or more; subscript g has a value of 0 or more; subscript s is 1, 2, or 3; and subscript t is 1, 2, or 3.
    Type: Grant
    Filed: November 7, 2007
    Date of Patent: December 31, 2013
    Assignee: Dow Corning Corporation
    Inventors: Khristopher Alvarez, Nick Shephard, James Tonge
  • Publication number: 20100092690
    Abstract: A polymer cures by either radiation or moisture curing mechanisms, or both. The polymer is prepared by hydrosilylation. The polymer includes units of formula: (R22Si02/2)b, (R2Si03/2)c, (SiO4/2)d, (R1?)f, and (R23Si01/2)g, where each R1 is independently an oxygen atom or a divalent hydrocarbon group; each R1? is independently divalent hydrocarbon group; each R2 is independently a monovalent organic group that is free of terminal aliphatic unsaturation each X is independently a monovalent hydrolyzable group; each J is independently a monovalent epoxy functional organic group; subscript a has a value of 1 or more; subscript b has a value of 0 or more; subscript c has a value of 0 or more; subscript d has a value of 0 or more; subscript e has a value of 1 or more; subscript f has a value of 0 or more; subscript g has a value of 0 or more; subscript s is 1, 2, or 3; and subscript t is 1, 2, or 3.
    Type: Application
    Filed: November 7, 2007
    Publication date: April 15, 2010
    Applicant: DOW CORNING CORPORATION
    Inventors: Khristopher Alvarez, Nick Shephard, James Tonge
  • Publication number: 20080054806
    Abstract: A process for reducing Ag electromigration in electronic circuitry includes the step of treating the electronic circuitry with an electromigration resistant composition. This process is useful in fabricating electronic devices having electronic circuitry that is close together, such as resistors, capacitors, and displays, e.g., a plasma display panel (PDP) or a liquid crystal display (LCD).
    Type: Application
    Filed: May 9, 2006
    Publication date: March 6, 2008
    Inventors: Khristopher Alvarez, Nick Shephard, James Tonge