Abstract: Systems and methods for depositing materials on a substrate via OVJP are provided. A float table and grippers are used to move and position the substrate relative to one or more OVJP print bars to reduce the chance of damaging or compromising the substrate or prior depositions.

Abstract: The invention relates to a method of calculating gating scores in the pulse-Doppler radar using a combination of position, power, size of detection and ambiguous Doppler measurement data to effectively overcome the phenomenon of wrongly assigning detections to the target trajectory and creating false targets in noise regions. The method intelligently merges position, power, detection size and ambiguous Doppler measurement data information of the detections in the algorithm of calculating gating score to solve the problem of selection and disputation detections. The method is carried out through two steps, step 1: determine statistical quantities from the standard data set; step 2: gating selection algorithm.

Abstract: Systems and methods for depositing materials on a substrate via OVJP are provided. A float table and grippers are used to move and position the substrate relative to one or more OVJP print bars to reduce the chance of damaging or compromising the substrate or prior depositions.

Abstract: Systems and methods for depositing materials on a substrate via OVJP are provided. A float table and grippers are used to move and position the substrate relative to one or more OVJP print bars to reduce the chance of damaging or compromising the substrate or prior depositions.

Abstract: An organic vapor jet printing (OVJP) device is provided that includes an OVJP print die having one or more delivery channels to deliver organic material and carrier gas to a region below the print die and one or more exhaust channels to remove material from below the print die. A directly-heated delivery line connected to the one or more delivery channels and a source of the organic material external to the OVJP print die includes a resistive material and a plurality of electrical connections to the resistive material. When a current is applied to the resistive material via the plurality of electrical connections, the resistive material heats the interior of the directly-heated delivery line.

Abstract: Methods, systems, and devices are provided for organic vapor jet deposition (OVJP), which require significantly fewer print heads than conventional OVJP deposition systems. The disclosed OVJP systems include half the number of OVJP print heads than a conventional system, or less, and provide for relative movement of the substrate and print heads to allow for rapid and comprehensive material deposition over the full surface of the substrate.

Abstract: A cup holder attachment for propping up a cell phone at a viewable angle. The attachment may comprise a cup filled with a weighted material and configured to fit into a cup holder. The attachment may further comprise a lid comprising a rod hole and an indentation for holding the cell phone. The attachment may further comprise a rod disposed through the rod hole, such that a first end of the rod is buried in the weighted material and a second end of the rod protrudes from the lid. The attachment may further comprise a supporter attached to the second end of the rod. The supporter may be capable of supporting the cell phone.

Abstract: A chuck for holding a workpiece in a deposition system is provided, which includes a base having a base surface with a flatness tolerance of not greater than 30 µm and a clamp having a surface configured to be attached to a substrate, which has a flatness tolerance of not greater than 30 µm. The clamp also includes a substrate holder configured to hold a substrate above the second clamp surface.

Abstract: An organic vapor jet printing (OVJP) device is provided that includes an OVJP print head having a nozzle configured to eject an organic material entrained in a carrier gas, one or more heaters to heat the nozzle, and one or more heat sinks to remove heat from the region of the nozzle. OVJP deposition devices and techniques are also provided in which heat sinks are arranged in the region of one or more OVJP nozzle, which maintain an ambient temperature of not more than 40 C. when the print head is operated at an operating temperature of 450 C.

Abstract: Embodiments of the disclosed subject matter provide a system having at least one carrier gas source, at least one heated container that includes organic material, and a jet array print head that includes a plurality of apertures to print lines on a substrate, and that is connected to a vacuum source. The system includes a pair of gas bearing plates, with a top gas bearing plate and a bottom gas bearing plate, each having a plurality of pressure apertures and vacuum apertures. The top gas bearing plate applies a uniform force to a top surface of the substrate, and the bottom gas bearing plate applies a uniform force to a bottom surface of the substrate. The top gas bearing plate includes a slot configured for the print head to fit within. The vacuum apertures are arranged perpendicular to a direction of travel of the substrate.

Abstract: Systems and methods for depositing materials on a substrate via OVJP are provided. A float table and grippers are used to move and position the substrate relative to one or more OVJP print bars to reduce the chance of damaging or compromising the substrate or prior depositions.

Abstract: The present invention is directed to a cup holder attachment for propping up a cell phone at a viewable angle. The present invention features a cup holder attachment for propping up a cell phone at a viewable angle. The attachment may comprise a cup filled with a weighted material and configured to fit into a cup holder. The attachment may further comprise a lid comprising a rod hole and an indentation for holding the cell phone. The attachment may further comprise a rod disposed through the rod hole, such that a first end of the rod is buried in the weighted material and a second end of the rod protrudes from the lid. The attachment may further comprise a supporter attached to the second end of the rod. The supporter may be capable of supporting the cell phone.

Abstract: Disclosed herein are electroplating apparatuses for electroplating metal onto a semiconductor wafer which may include an electroplating cell, an electrolyte circulation system connected to the cell for circulating electrolyte to and from the cell, first and second sampling ports for taking first and second sample of electrolyte at first and second locations in the apparatus, and one or more liquid particle counter modules, connected to the first and second sampling ports, for measuring particle concentration in the electrolyte. Also disclosed herein are methods for reducing particle concentration in an electrolyte present in an electroplating apparatus which may include determining an approximate particle concentration using a liquid particle counter module and modifying the operation of the electroplating apparatus to reduce particle concentration in the electrolyte.