Patents by Inventor Khurshid S. Alam

Khurshid S. Alam has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Light-based sealing and device packaging
    Patent number: 8379392
    Abstract: Systems and methods for manufacturing and packaging electronic devices with light absorptive thin film stacks are provided. In one embodiment, a light is applied to a light absorptive thin film stack disposed between a substrate and a backplate to seal the substrate to the backplate. In another embodiment, the light absorptive thin film stack includes a plurality of thin film layers. In yet another embodiment, the light absorptive thin film stack includes a spacer layer over a reflective layer and an absorber layer over the spacer layer. In still another embodiment, the light absorptive thin film stack is less than 200 nanometers thick. In yet a further embodiment, a light absorptive thin film stack is used to seal a substrate having glass, plastic, metal, or silicon to a backplate having glass, plastic, metal, or silicon. Thus, the light absorptive thin film stack is used to seal similar or dissimilar materials through a bonding process.
    Type: Grant
    Filed: October 23, 2009
    Date of Patent: February 19, 2013
    Assignee: QUALCOMM MEMS Technologies, Inc.
    Inventors: Ion Bita, John H. Hong, Khurshid S. Alam
  • LIGHT-BASED SEALING AND DEVICE PACKAGING
    Publication number: 20110096508
    Abstract: Systems and methods for manufacturing and packaging electronic devices with light absorptive thin film stacks are provided. In one embodiment, a light is applied to a light absorptive thin film stack disposed between a substrate and a backplate to seal the substrate to the backplate. In another embodiment, the light absorptive thin film stack includes a plurality of thin film layers. In yet another embodiment, the light absorptive thin film stack includes a spacer layer over a reflective layer and an absorber layer over the spacer layer. In still another embodiment, the light absorptive thin film stack is less than 200 nanometers thick. In yet a further embodiment, a light absorptive thin film stack is used to seal a substrate having glass, plastic, metal, or silicon to a backplate having glass, plastic, metal, or silicon. Thus, the light absorptive thin film stack is used to seal similar or dissimilar materials through a bonding process.
    Type: Application
    Filed: October 23, 2009
    Publication date: April 28, 2011
    Applicant: QUALCOMM MEMS Technologies, Inc.
    Inventors: Ion Bita, John H. Hong, Khurshid S. Alam