Abstract: The present invention relates to a light-emitting diode package comprising a high-strength molding part. The light-emitting diode package, according to the present invention, comprises: a housing; at least one light-emitting diode chip disposed in the housing; a molding part which covers the at least one light-emitting diode chip; a first phosphor excited by the at least one light-emitting diode chip so as to emit green light; and a second phosphor excited by the at least one light-emitting diode chip so as to emit red light, wherein the molding part has an oxygen gas permeability of 140 cc/m2/day or less, and the second phosphor can emit red light having a full width at half maximum of 20 nm or less.