Patents by Inventor Ki-Chang Hong

Ki-Chang Hong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240160400
    Abstract: In a sound system that uses over-the-air (OTA), a blockchain platform server is configured to support performance of a virtual sound transaction in a virtual environment. An OTA server is configured to manage a virtual sound transmitted from the blockchain platform server. A vehicle communication control device is configured to perform wireless communication with the OTA server. The vehicle communication control device is configured to download the virtual sound from the OTA server, determine whether the virtual sound is similar to a predetermined specific sound, perform an OTA state test of the virtual sound when the virtual sound is not similar to the predetermined specific sound, and control a sound processing device to play the virtual sound when the virtual sound passes the OTA state test.
    Type: Application
    Filed: March 24, 2023
    Publication date: May 16, 2024
    Inventors: Ki Chang Kim, Dong Chul Park, Eun Soo Jo, Sang Jin Hong
  • Patent number: 6512047
    Abstract: A polyoxymethylene resin composition, having enhanced tensile elongation, thermal stability, processibility and impact resistance, comprises: (i) from 45 to less than 97% % by weight of a polyoxymethylene resin (Component A); (ii) from 1 to less than 20% by weight of a thermoplastic polyester elastomer (Component B); (iii) from 2 to 35% by weight of a thermoplastic polyurethane elastomer (Component C); and (iv) from 0.1 to less than 10% by weight of a maleic anhydride-grafted aliphatic polyolefinic rubbery polymer (Component D), based on the total weight of Components A, B, C and D.
    Type: Grant
    Filed: May 15, 2001
    Date of Patent: January 28, 2003
    Assignee: Korea Engineering Plastics Co., Ltd.
    Inventors: Tak-Kyu Kim, Jong-Taek Lee, Ki-Chang Hong
  • Publication number: 20010049415
    Abstract: A polyoxymethylene resin composition, having enhanced tensile elongation, thermal stability, processibility and impact resistance, comprises: (i) from 45 to less than 97% % by weight of a polyoxymethylene resin (Component A); (ii) from 1 to less than 20% by weight of a thermoplastic polyester elastomer (Component B); (iii) from 2 to 35% by weight of a thermoplastic polyurethane elastomer (Component C); and (iv) from 0.1 to less than 10% by weight of a maleic anhydride-grafted aliphatic polyolefinic rubbery polymer (Component D), based on the total weight of Components A, B, C and D.
    Type: Application
    Filed: May 15, 2001
    Publication date: December 6, 2001
    Applicant: Korea Engineering Plastics Co., Ltd.
    Inventors: Tak-Kyu Kim, Jong-Taek Lee, Ki-Chang Hong