Abstract: Disclosed is an electrolytic copper foil obtained by heat treating a copper foil manufactured through electrolysis, the electrolytic copper foil having specific resistivity of 1.68 to 1.72 ??·cm and a grain mean diameter of a crystallite of 1.0 to 1.5 ?m.

Abstract: Disclosed is an electrodeposited copper foil, in which a center line roughness average Ra (?m), a maximum height Rmax (?m), and a ten-point height average Rz (?m) of a matte side satisfy an Equation below, 1.5?(Rmax?Rz)/Ra?6.5. The electrodeposited copper foil according to the present invention maintains low roughness and high strength, and exhibits a high elongation rate, and particularly, has excellent glossiness, so that the electrodeposited copper foil may be used in a current collector of a medium and large lithigum ion secondary battery and a semiconductor packaging substrate for Tape Automated Bonding (TAB) used in a Tape Carrier Package (TCP).

Abstract: Disclosed herein is an electrolytic copper foil in which an average diameter of a pore which is a region between surface elements protruding from a matte side is 1 mm to 100 nm. The electrolytic copper foil has high elongation while maintaining low roughness and high strength and thus may be used in a current collector of a medium-large size lithium ion secondary battery and a semiconductor packaging substrate, and the like, for tape automated bonding (TAB) which is used in a tape carrier package (TCP).