Patents by Inventor Ki-Deuk KIM

Ki-Deuk KIM has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10462917
    Abstract: An electronic device is provided. The electronic device includes a support member including at least a portion formed of a conductive material, an enclosure member configured to receive the support member and including at least a portion of which is formed of a conductive material. The conductive material portion of the enclosure member and the conductive material portion of the support member are insulated from each other.
    Type: Grant
    Filed: December 26, 2018
    Date of Patent: October 29, 2019
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Yong-Seok Lee, Tae-Hwan Kang, Hyun-Jun Kwon, Ki-Deuk Kim, Sang-Hyeon Kim, Jin-A Mock, Sung-Young Lee, Min-Su Jung, Hong-Moon Chun, Jung Woong Hyun
  • Publication number: 20190132973
    Abstract: An electronic device is provided. The electronic device includes a support member including at least a portion formed of a conductive material, an enclosure member configured to receive the support member and including at least a portion of which is formed of a conductive material. The conductive material portion of the enclosure member and the conductive material portion of the support member are insulated from each other.
    Type: Application
    Filed: December 26, 2018
    Publication date: May 2, 2019
    Inventors: Yong-Seok LEE, Tae-Hwan KANG, Hyun-Jun KWON, Ki-Deuk KIM, Sang-Hyeon KIM, Jin-A MOCK, Sung-Young LEE, Min-Su JUNG, Hong-Moon CHUN, Jung Woong HYUN
  • Patent number: 10201102
    Abstract: An electronic device is provided. The electronic device includes a support member including at least a portion formed of a conductive material, an enclosure member configured to receive the support member and including at least a portion of which is formed of a conductive material. The conductive material portion of the enclosure member and the conductive material portion of the support member are insulated from each other.
    Type: Grant
    Filed: March 13, 2017
    Date of Patent: February 5, 2019
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Yong-Seok Lee, Tae-Hwan Kang, Hyun-Jun Kwon, Ki-Deuk Kim, Sang-Hyeon Kim, Jin-A Mock, Sung-Young Lee, Min-Su Jung, Hong-Moon Chun, Jung Woong Hyun
  • Publication number: 20170188475
    Abstract: An electronic device is provided. The electronic device includes a support member including at least a portion formed of a conductive material, an enclosure member configured to receive the support member and including at least a portion of which is formed of a conductive material. The conductive material portion of the enclosure member and the conductive material portion of the support member are insulated from each other.
    Type: Application
    Filed: March 13, 2017
    Publication date: June 29, 2017
    Inventors: Yong-Seok LEE, Tae-Hwan KANG, Hyun-Jun KWON, Ki-Deuk KIM, Sang-Hyeon KIM, Jin-A MOCK, Sung-Young LEE, Min-Su JUNG, Hong-Moon CHUN, Jung Woong HYUN
  • Patent number: 9625949
    Abstract: An electronic device is provided. The electronic device includes a support member including at least a portion formed of a conductive material, an enclosure member configured to receive the support member and including at least a portion of which is formed of a conductive material. The conductive material portion of the enclosure member and the conductive material portion of the support member are insulated from each other.
    Type: Grant
    Filed: July 10, 2015
    Date of Patent: April 18, 2017
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Yong-Seok Lee, Tae-Hwan Kang, Hyun-Jun Kwon, Ki-Deuk Kim, Sang-Hyeon Kim, Jin-A Mock, Sung-Young Lee, Min-Su Jung, Hong-Moon Chun, Jung-Woong Hyun
  • Publication number: 20160044801
    Abstract: An electronic device is provided. The electronic device includes a support member including at least a portion formed of a conductive material, an enclosure member configured to receive the support member and including at least a portion of which is formed of a conductive material. The conductive material portion of the enclosure member and the conductive material portion of the support member are insulated from each other.
    Type: Application
    Filed: July 10, 2015
    Publication date: February 11, 2016
    Inventors: Yong-Seok LEE, Tae-Hwan KANG, Hyun-Jun KWON, Ki-Deuk KIM, Sang-Hyeon KIM, Jin-A MOCK, Sung-Young LEE, Min-Su JUNG, Hong-Moon CHUN, Jung-Woong HYUN
  • Patent number: 9152181
    Abstract: An apparatus for mounting in a secure manner a stylus pen in an information device, in which there are a casing and the stylus pen. A guide unit having an inlet and an outlet is configured to have an opened top at the inlet and a closed bottom at the outlet, extended along a length direction of the casing, for accommodating the stylus pen.
    Type: Grant
    Filed: July 30, 2012
    Date of Patent: October 6, 2015
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Sung-Young Lee, Ki-Deuk Kim, Jung-Woong Hyun
  • Publication number: 20130050922
    Abstract: An apparatus for mounting in a secure manner a stylus pen in an information device, in which there are a casing and the stylus pen. A guide unit having an inlet and an outlet is configured to have an opened top at the inlet and a closed bottom at the outlet, extended along a length direction of the casing, for accommodating the stylus pen.
    Type: Application
    Filed: July 30, 2012
    Publication date: February 28, 2013
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Sung-Young LEE, Ki-Deuk KIM, Jung-Woong HYUN