Abstract: Disclosed is a probe card providing an upper structure formed to be separatable from a lower structure and a lower structure including a lower substrate electrically connected with a plurality of the needles and a plurality of the lower terminals independently connected with the needles formed above the lower substrate. In particular, the lower structure of the probe card includes a needle fixing structure, a plurality of the needles fixed on the needle fixing structure, a lower substrate provided on the needle fixing structure while electrically connecting with the needles, and a plurality of the lower terminals formed on the upper surface of the lower substrate in order to be independently connected with the each needle. Meanwhile, the upper structure separatable from the lower structure includes a main substrate and a plurality of the upper terminals formed on the lower surface corresponding to the lower terminals.

Abstract: A probe card having a simple structure and an easy manufacturing process disclosed. The probe card includes a main substrate having a probe circuit pattern formed thereon; a needle fixing block provided with a connection plate located on a lower surface of the main substrate and a tip plate apart from and parallel to the connection plate; and a needle provided with an elastic bending portion located between the connection plate and the tip plate, a tip portion extending from a lower end of the elastic bending portion and being projected from a lower surface of the tip plate, and a connection portion extending from an upper end of the elastic bending portion and being electrically connected to the prove circuit pattern.

Abstract: A probe card having a simple structure and an easy manufacturing process is disclosed. The probe card includes an upper structure having a probe circuit pattern, and a needle having an elastic bending portion, a tip portion extending from a lower end of the elastic bending portion, and a connection portion extending from an upper end of the elastic bending portion and connected electrically to the probe circuit pattern. Here, a portion of the elastic bending portion is received in the upper structure.