Patents by Inventor Ki Hong CHO

Ki Hong CHO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Pharmaceutical composition containing (R)-N-[1-(3,5-difluoro-4-methansulfonylamino-phenyl)-ethyl]-3-(2-propyl-6-trifluoromethyl-pyridin-3-yl)-acrylamide
    Patent number: 11957669
    Abstract: One aspect of the present disclosure is a pharmaceutical composition which includes (R)—N-[1-(3,5-difluoro-4-methansulfonylamino-phenyl)-ethyl]-3-(2-propyl-6-trifluoromethyl-pyridin-3-yl)-acrylamide as a first component and a cellulosic polymer as a second component, wherein the composition of one aspect of the present disclosure has a formulation characteristic in which crystal formation is delayed for a long time.
    Type: Grant
    Filed: August 10, 2018
    Date of Patent: April 16, 2024
    Assignee: AMOREPACIFIC CORPORATION
    Inventors: Joon Ho Choi, Won Kyung Cho, Kwang-Hyun Shin, Byoung Young Woo, Ki-Wha Lee, Min-Soo Kim, Jong Hwa Roh, Mi Young Park, Young-Ho Park, Eun Sil Park, Jae Hong Park
  • Polishing head in chemical mechanical polishing apparatus and chemical mechanical polishing apparatus including the same
    Patent number: 9321144
    Abstract: A polishing head of a chemical mechanical polishing apparatus includes a housing moving up and down, a base assembly connected to a bottom of the housing to support the housing, a membrane on a bottom of the base assembly and a retainer ring surrounding the membrane and connected to the bottom of the base assembly, the membrane including a pressing portion to adsorb and press a substrate, a first partition on the pressing portion and extending from an edge of the pressing portion along a height direction, a first horizontal extending portion extending from an upper end portion of the first partition toward a center of the membrane, and a second horizontal extending portion from the upper end portion of the first partition toward the center of the membrane, the second horizontal extending portion being above the first horizontal extending portion and including a curved portion expanding by pneumatic pressure.
    Type: Grant
    Filed: February 19, 2014
    Date of Patent: April 26, 2016
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Chang Gyu Woo, Sung Ho Shin, Joo Yeop Nam, Ki Hong Cho
  • POLISHING HEAD IN CHEMICAL MECHANICAL POLISHING APPARATUS AND CHEMICAL MECHANICAL POLISHING APPARATUS INCLUDING THE SAME
    Publication number: 20140242886
    Abstract: A polishing head of a chemical mechanical polishing apparatus includes a housing moving up and down, a base assembly connected to a bottom of the housing to support the housing, a membrane on a bottom of the base assembly and a retainer ring surrounding the membrane and connected to the bottom of the base assembly, the membrane including a pressing portion to adsorb and press a substrate, a first partition on the pressing portion and extending from an edge of the pressing portion along a height direction, a first horizontal extending portion extending from an upper end portion of the first partition toward a center of the membrane, and a second horizontal extending portion from the upper end portion of the first partition toward the center of the membrane, the second horizontal extending portion being above the first horizontal extending portion and including a curved portion expanding by pneumatic pressure.
    Type: Application
    Filed: February 19, 2014
    Publication date: August 28, 2014
    Applicant: SAMSUNG ELECTRONICS., LTD.
    Inventors: Chang Gyu WOO, Sung Ho SHIN, Joo Yeop NAM, Ki Hong CHO