Abstract: An exterior camera system and a cleaning method thereof are provided. The exterior camera system includes a base unit that is fixed to a vehicle, a housing rotatably coupled with the base unit, and an imaging device including a camera module and having at least a portion inserted into the housing to move in a longitudinal direction of the housing. A wiper is disposed on an inside surface of the housing to face the camera module, and a washer fluid nozzle is disposed adjacent to the wiper. A controller receives a video from the camera module to set a rotation angle of the housing based upon driving conditions of the vehicle and to adjust extension of the imaging device.

Abstract: A degree of freedom of upper and lower widths of an area in which light is emitted is secured such that a slim type head lamp is implemented. Further, a slim type lamp apparatus for a vehicle, in which a low beam and a high beam are implemented at the same lighting portion, and an overall size of an optical system is reduced such that it is advantageous to configure a package of an optical system, is disclosed.

Abstract: Provided is a laminated glass display for a vehicle, in which the wiring harness between a display part and a vehicle body is not exposed. The display part is resistant to environmental factors such as moisture. To this end, the laminated glass display for a vehicle includes a plurality of adhesive films sequentially located between an upper laminated glass and a lower laminated glass having a recess in an end adjacent to a vehicle body panel; a display part located between the adhesive films; a dampener facing the upper laminated glass and located in the recess; and a molding disposed between the dampener and the vehicle body panel.

Abstract: The present disclosure provides an optical sensor having constant sensitivity regardless of changes in temperature. The optical sensor may include a light emitting device configured to emit light; a light receiving device configured to receive the light emitted from the light emitting device, and to output current based on an intensity of the light; a temperature sensor coupled with the light emitting device, and having electrical resistance varying with temperature; and a microcontroller including a first channel for supplying first current directly to the light emitting device, a second channel for supplying second current to the light emitting device via the temperature sensor, and a third channel for receiving the current output from the light receiving device.

Abstract: The heating wire structure for glass includes a sheet of glass in a vehicle having a battery located within the vehicle and configured to apply power to heating wires located on the glass according to a user request, the heating wires located in one direction on the glass and connected to terminals of the battery in series, vertical bars located at both ends of the glass so that the heating wires are connected to the vertical bars, antenna lines connected to the antenna, at least some of the antenna lines including intersection points formed by intersecting the heating wires, and a ceramic layer formed at intersecting areas between the heating wire lines and the antenna lines to be located between the heating wire lines and the antenna lines.

Abstract: A semiconductor device includes: a first stack structure; a second stack structure; a slit insulating layer located between the first stack structure and the second stack structure, the slit insulating layer extending in a first direction; a conductive plug located between the first stack structure and the second stack structure, the conductive plug including a first protrusion part protruding to the inside of the slit insulating layer; and an insulating spacer surrounding a sidewall of the conductive plug.

Abstract: A semiconductor device includes a wiring structure, a stacked structure located over the wiring structure, channel structures passing through the stacked structure, contact plugs passing through the stacked structure and electrically connected to the wiring structure, and insulating spacers each including loop patterns surrounding a sidewall of each of the contact plugs and stacked along the sidewall of each of the contact plugs.

Abstract: A semiconductor device includes a cell structure; n first pad structures formed on one side of the cell structure and each configured to have a step form in which 2n layers form one stage; and n second pad structures formed on the other side of the cell structure each configured to have a step form in which 2n layers form one stage, wherein n is a natural number of 1 or higher, and the first pad structures and the second pad structures have asymmetrical step forms having different heights.

Abstract: A front active spoiler apparatus for a vehicle may include a spoiler housing fixed to a front end module and having a duct protruding forwards and configured to guide air flow; a spoiler lip configured to operate to open or close the duct; an actuator configured to connect the spoiler housing and the spoiler lip to operate the spoiler lip; and a controller configured to control the operation of the actuator using vehicle speed information.

Abstract: A semiconductor device includes a wiring structure, a stacked structure located over the wrong structure, channel structures passing through the stacked structure, contact plugs passing through the stacked structure and electrically connected to the wiring structure, and insulating spacers each including loop patterns surrounding a sidewall of each of the contact plugs and stacked along the side all of each of the contact plugs.

Abstract: A safety device for heating hoses is provided to prevent overheating of a heating wire. The safety device includes a first hose that connects between a reservoir and a connector and a second hose that is fluidly connected to the first hose and allows windshield washer fluid to flow from the connector to a spray nozzle. A housing encloses the connector and a heating wire is disposed in at least one of the first and second hoses. A terminal is disposed inside the housing and is connected to the heating wire to apply electric power from a power supply unit to the heating wire. A circuit breaker is connected to the terminal and the heating wire and cuts off electric power applied to the heating wire based on a temperature condition.

Abstract: A method for fabricating a semiconductor device includes forming a through-hole penetrating through an alternating stack pattern and forming a gap-fill layer, wherein a sacrificial gap-fill layer of the gap-fill layer fills the through-hole. The method also includes forming a mask layer over the alternating stack pattern and over the gap-fill layer, wherein the mask layer includes a self-aligned opening overlapping the filled through-hole and overlapping a portion of an uppermost material layer of the alternating stack pattern adjacent to the filled through-hole. The method further includes forming a first contact hole through the alternating stack pattern by performing a single etch using both the mask layer and the portion of the uppermost material layer as etch barriers to remove, through the self-aligned opening, the sacrificial gap-fill layer filling the through-hole.

Abstract: A wiper system for a vehicle includes: a glass wiper disposed on a window glass of a vehicle; a motor providing driving power to the glass wiper; a camera capturing images of surroundings of the vehicle; and a camera wiper disposed on a camera lens of the camera and connected to the motor by a linkage to operate in association with the glass wiper such that the camera wiper swings back and forth over the camera lens while the glass wiper swings back and forth over the window glass.

Abstract: A method of manufacturing a molded product includes: performing molding for forming a product; performing insulation for coating an insulation material on a plating-unnecessary region of the product, excluding a plating-necessary region of the product, after mounting the product on a masking jig for plating formed to cover the plating-necessary region of the product and to expose the plating-unnecessary region of the product; and performing plating for forming a plating layer on the plating-necessary region, excluding the plating-unnecessary region coated with the insulation material, by electroplating the product coated with the insulation material.

Abstract: In a method of manufacturing a semiconductor device, the method includes: forming a stack structure; forming a channel layer penetrating the stack structure; forming a first dielectric layer in the channel layer; forming a second dielectric layer in the first dielectric layer; forming an opening by selectively etching the first dielectric layer; selectively etching the second dielectric layer exposed through the opening; and forming a pad in the opening.

Abstract: A semiconductor device includes a stacked structure, channel layers passing through the stacked structure, a well plate located under the stacked structure, a source layer located between the stacked structure and the well plate, a connection structure coupling the channel layers to each other and including a first contact contacting the source layer and a second contact contacting the well plate, and an isolation pattern insulating the source layer and the well plate from each other.

Abstract: Disclosed is a method of automatically adjusting the leveling of a pixel light headlamp for a vehicle, which may automatically adjust the leveling of a headlamp that is configured for implementing a pixel light using a DMD optical system.

Abstract: A semiconductor device, and a method of manufacturing the semiconductor device, the method includes forming a first stack structure penetrated by first channel structures, forming electrode patterns surrounding second channel structures and separated from each other by first slits and second slits, the second channel structures coupled to the first channel structures, and the second slits comprising a different width from the first slits, filling each of the first slits and the second slits with an insulating material to cover sidewalls of the electrode patterns, and forming third slits passing through the insulating material in each of the second slits and extending to pass through the first stack structure.

Abstract: A rearview mirror having a tilting structure configured for securing a rear view through a display device by tilting an upper housing may include: a lower housing configured to be fixed to a windshield glass; an upper housing configured to be positioned at an opening portion of the lower housing; a mirror portion configured to be positioned at a rear surface of the upper housing; and a display device configured to be positioned at a rear surface of the mirror portion, in which the mirror portion and the display device are fixed to the upper housing, and the upper housing is tilted based on a first end portion to provide a rear view through the display device.

Abstract: The present invention relates to a walking assistance robot load compensation system which cancels out the load of a walking assistance robot worn by a walking trainee, the walking assistance robot load compensation system comprising a dynamic compensation part compensating for changes to a dynamic load according to the displacement or the inertia of the walking assistance robot, the dynamic compensation part, which may compensate for a changing dynamic load of the walking assistance robot, comprising: a first plate which is movable in association with the displacement or inertia; a second plate which is spaced apart from the first plate and is movable in association with the walking assistance robot; a connection wire which is connected to the first and second plates and movable in association with the first plate and the second plate; and a dynamic compensation unit which applies resistance force to the connection wire to suppress changes to the dynamic load of the walking assistance robot.