Abstract: A cap for a vertical furnace includes a first flat plate and a second flat plate separated by a predetermined distance, and a plurality of support rods connecting the first and second flat plates. A plurality of adjacent and horizontally disposed adiabatic plates are vertically stacked between the first and the second flat plates such that edges of the adiabatic plates contact the support rods. The first and second flat plates, adjacent adiabatic plates, and the plurality of support rods are integrally formed in a single structure. Since all the components of the cap are formed in single structure, installation and replacement is simplified and the generation of contamination particles is prevented since no parts need to be repeatedly assembled and disassembled.

Abstract: A furnace used for a semiconductor manufacturing process includes an injector that can be formed as either two or more divided tubes, having a straight-line form with each of the tubes having different lengths and open ends, or by one straight injector having a closed end and a plurality of nozzles spaced along a length of the injector. Accordingly, the furnace can easily be cleaned and handled, and a reaction gas can be uniformly distributed in the processing tube.

Abstract: An apparatus for thermal processing of semiconductor wafers includes a table having in lateral sequence a heating chamber, a holding chamber, and a cassette stage and a boat for holding the wafers being processed. The apparatus further includes a boat transfer part for moving the boat between the holding chamber and the heating chamber, a wafer charging part for transferring the wafers loaded in a cassette on the cassette stage to the boat while it is in the holding chamber, and a wafer discharging part for transferring the wafers loaded in the boat back to the cassette on the cassette stage.