Abstract: An image bearing structure includes an image drum including at least one slot, a plurality of ring electrodes formed on an outer circumference of the image drum, and a control board positioned within the slot of the image drum, and connected to the plurality of ring electrodes, to detect a defect of the ring electrodes. As a result, the image bearing structure detects a defect within a short time and without requiring a separate detecting device.

Abstract: An LED package includes a substrate having an electrically conductive portion and an electrically non-conductive portion composed of an oxide of the conductive portion; an LED mounted on the conductive portion and electrically connected to the conductive portion; a first electrode disposed on the non-conductive portion and electrically connected to the LED by a wire; and a second electrode disposed on the substrate and electrically connected to the LED.

Abstract: An LED package includes a substrate having an electrically conductive portion and an electrically non-conductive portion composed of an oxide of the conductive portion; an LED mounted on the conductive portion and electrically connected to the conductive portion; a first electrode disposed on the non-conductive portion and electrically connected to the LED by a wire; and a second electrode disposed on the substrate and electrically connected to the LED.

Abstract: Provided are a toner supply roller and an image forming apparatus using the toner supply roller. The image forming apparatus employs a direct image developing technique, and includes the toner supply roller having a plurality of electrodes formed on an outer surface thereof to selectively supply toner to an image forming unit.

Abstract: A light emitting device package including a transparent cover having an electrode pattern formed on a bottom surface thereof; a light emitting device installed below the transparent cover and electrically connected to an external circuit via the electrode pattern; a fixing resin which fixes the light emitting device onto the bottom surface of the transparent cover; and a metal slug provided under the fixing resin to dissipate heat away from the light emitting device.

Abstract: An electronic device includes a case that is capable of controlling colors. The electronic device includes a case containing thermochromic pigments. The case includes a plurality of thermoelectric elements disposed at an internal surface. The case is coupled to a power source unit that supplies power to the plurality of thermoelectric elements and a temperature sensor that measuring a temperature of the plurality of thermoelectric elements. The electronic device includes an input unit for setting a color of the case and a controller for controlling power supply of the power source unit such that a temperature of the plurality of thermoelectric elements measured by the temperature sensor is included in a temperature range corresponding to a color input from the input unit.

Abstract: A method of fabricating a backlight module in which at least one luminescence element is positioned, including: positioning a luminescence element in at least one cavity formed on a carrier; forming a lower electrode on a substrate; transferring the luminescence element positioned on the carrier to the substrate, connecting the luminescence element to a pattern of the lower electrode formed on the substrate, and removing the carrier; forming an insulating layer on a surface of the substrate to which the luminescence element is transferred, and exposing a top region of the luminescence element; and forming an upper electrode on the exposed top region of the luminescence element. Accordingly, the backlight module including very small luminescence elements being of a micro unit in size is easily fabricated.

Abstract: Provided are a toner supply roller and an image forming apparatus using the toner supply roller. The image forming apparatus employs a direct image developing technique, and includes the toner supply roller having a plurality of electrodes formed on an outer surface thereof to selectively supply toner to an image forming unit.

Abstract: An image bearing structure includes an image drum including at least one slot, a plurality of ring electrodes formed on an outer circumference of the image drum, and a control board positioned within the slot of the image drum, and connected to the plurality of ring electrodes, to detect a defect of the ring electrodes. As a result, the image bearing structure detects a defect within a short time and without requiring a separate detecting device.

Abstract: A method of manufacturing an image forming element which can reduce a manufacturing time and a manufacturing cost with a simplified manufacturing process, an image forming element manufactured by the method, and an image forming apparatus having the same.

Abstract: An image forming element, a fabricating method of the image forming element, and an image forming apparatus having the image forming element is provided. The image forming element includes a drum body, a driving circuit mounted within the drum body, a support plate which penetrates through the drum body longitudinally along the drum body, the support plate being coupled to the driving circuit, an insulating layer formed on at least one portion of an outer circumference of the drum body, a conductive polymer layer formed on the insulating layer, the conductive polymer layer including one or more conductive areas and one or more insulating areas, which are aligned in an alternating pattern, and a protective layer formed on the conductive polymer layer, wherein the conductive areas on the conductive polymer layer are electrically connected to the driving circuit.

Abstract: An image forming element includes a drum body including a plurality of conductive layers and a plurality of insulating layers stacked on one another in an alternate pattern, in which a portion of each of the conductive layers extends towards a cavity defined within the conductive layers to form a plurality of electrodes, and a control unit disposed in the cavity, and including a plurality of electrode pads corresponding to the electrodes to provide an electrical connection to the respective electrodes. Structure and processes to fabricate an image forming element are simplified, and fabricating cost can be reduced.

Abstract: An image forming element and its manufacturing apparatus and method are disclosed, in which manufacturing process steps can be simplified to reduce the cost and improve productivity. The manufacturing method of an image forming element includes respectively providing a mold and an image drum, forming line shaped conductive paste patterns on the mold, and transferring the conductive paste patterns from the mold onto the image drum.

Abstract: An image forming element includes an image drum including a plurality of ring electrodes and a slot. The plurality of ring electrodes are formed to be spaced apart from one another on a circumference of the image drum. The slot is formed in a longitudinal direction on the image drum. A connecting member includes a plurality of connecting electrodes and is disposed inside the image drum so that an end of the connecting member is received in the slot. The connecting electrodes are electrically connected with the ring electrodes one to one on the same line.

Abstract: A method of manufacturing a light emitting device includes: forming a plurality of independent light emitting portions on a growth substrate; separating the light emitting portions from the growth substrate; mounting the light emitting portions onto a receiving substrate; and dicing the receiving substrate, onto which the light emitting portions are mounted, into a light emitting unit. Residual stress, which occurs when the light emitting portions are separated from the substrate, can be reduced, and the light emitting portions can be mounted onto the receiving substrate in a fluid state, whereby the light emitting device can be easily mass produced with excellent quality, and its manufacturing costs can be reduced.

Abstract: A method of fabricating a backlight module in which at least one luminescence element is positioned, including: positioning a luminescence element in at least one cavity formed on a carrier; forming a lower electrode on a substrate; transferring the luminescence element positioned on the carrier to the substrate, connecting the luminescence element to a pattern of the lower electrode formed on the substrate, and removing the carrier; forming an insulating layer on a surface of the substrate to which the luminescence element is transferred, and exposing a top region of the luminescence element; and forming an upper electrode on the exposed top region of the luminescence element. Accordingly, the backlight module including very small luminescence elements being of a micro unit in size is easily fabricated.

Abstract: A light emitting device package including: a heat dissipating substrate including a cavity; a first conductive pattern formed on the cavity; a light emitting device installed on the first conductive pattern; and a second conductive pattern formed on the heat dissipating substrate at a periphery of the first conductive pattern. The second conductive pattern is electrically separated from the first conductive pattern, and the first and second conductive patterns supply power required for operating the light emitting device.

Abstract: A light emitting device package including a transparent cover having an electrode pattern formed on a bottom surface thereof; a light emitting device installed below the transparent cover and electrically connected to an external circuit via the electrode pattern; a fixing resin which fixes the light emitting device onto the bottom surface of the transparent cover; and a metal slug provided under the fixing resin to dissipate heat away from the light emitting device.

Abstract: An LED package and a fabrication method thereof are provided. The LED package includes an upper metal plate having an LED-receiving hole therein; a lower metal plate disposed under the upper metal plate; and an insulator which the upper metal plate and the lower metal plate from each other. A portion of the lower metal plate is exposed via the LED-receiving hole and an LED is mounted on the exposed portion of the lower metal plate and is electrically connected to both of the upper and lower metal plates. A protective cover encloses and protects exposed surfaces of the upper and lower metal plates.

Abstract: An LED package includes a substrate having an electrically conductive portion and an electrically non-conductive portion composed of an oxide of the conductive portion; an LED mounted on the conductive portion and electrically connected to the conductive portion; a first electrode disposed on the non-conductive portion and electrically connected to the LED by a wire; and a second electrode disposed on the substrate and electrically connected to the LED.