Patents by Inventor Kihwan Yoon

Kihwan Yoon has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240146780
    Abstract: A processor-implemented method of interlinking a first video conference system and a second video conference system for combining and transmitting voice signals of a plurality of users in a video conference system interlinking apparatus including a plurality of video sharing units including receiving second video conference data of a plurality of users from the second video conference system and transmitting voice data including combined voices of two or more users, among the transmitted second video conference data, through a single one of the plurality of video sharing units.
    Type: Application
    Filed: October 26, 2023
    Publication date: May 2, 2024
    Applicant: SAMSUNG SDS CO., LTD.
    Inventors: Youngkwang KIM, Myounghee PARK, Soohwan PARK, Hyesu LEE, Kihwan KWON, Dohyung IM, Junho KANG, Heetae YOON
  • Patent number: 6440282
    Abstract: In a sputtering device which has a small rotatable magnetron (30) arranged opposite a target 16, the magnetron (30) has a first magnet band (44) and a second magnet opposite a target 16, the magnetron (30) has a first magnet band (44) and a second magnet a greater total magnetic flux. Some of the lines of magnetic flux from the second magnet band (42) pass through the first magnet band (44) and terminate at the second magnet band (42). The remaining lines of magnetic flux from the second magnet band (42) form a magnetic flux loop that encloses the first magnet band (44) and that terminates at the second magnet band (42). The outer band is preferably in an oval shape having a minor axis no smaller than 0.8 of the major axis, and more preferably in a circular shape.
    Type: Grant
    Filed: June 30, 2000
    Date of Patent: August 27, 2002
    Assignee: Applied Materials, Inc.
    Inventors: Yuichi Wada, Hisashi Aida, Kihwan Yoon