Patents by Inventor Ki Hyeok KWON

Ki Hyeok KWON has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Head mount system for providing surgery support image
    Patent number: 11356651
    Abstract: The present invention relates to a head mount system for providing a surgery support image, the system including: a head mount body wearable on a user's head; a near-infrared camera installed on the head mount body and capturing near-infrared light; a near-infrared image projection unit installed on the head mount body and projecting a near-infrared image; a near-infrared image processing unit receiving a captured image taken by the near-infrared camera, generating the near-infrared image, and transmitting the near-infrared image to the near-infrared image projection unit; and a transparent optic system installed on the head mount body to be positioned in front of user's eyes when the head mount body is worn on the user's head, transmitting visible light to enable a user to see a user's front, reflecting the near-infrared light coming from the user's front to the near-infrared camera to allow the near-infrared camera to capture the near-infrared light.
    Type: Grant
    Filed: December 6, 2018
    Date of Patent: June 7, 2022
    Assignee: Korea University Research and Business Foundation
    Inventors: Beop-Min Kim, Yong-Guk Kang, Ki-Hyeok Kwon
  • HEAD MOUNT SYSTEM FOR PROVIDING SURGERY SUPPORT IMAGE
    Publication number: 20210006775
    Abstract: The present invention relates to a head mount system for providing a surgery support image, the system including: a head mount body wearable on a user's head; a near-infrared camera installed on the head mount body and capturing near-infrared light; a near-infrared image projection unit installed on the head mount body and projecting a near-infrared image; a near-infrared image processing unit receiving a captured image taken to by the near-infrared camera, generating the near-infrared image, and transmitting the near-infrared image to the near-infrared image projection unit; and a transparent optic system installed on the head mount body to be positioned in front of user's eyes when the head mount body is worn on the user's head, transmitting visible light to enable a user to see a user's front, reflecting the near-infrared light coming from the user's front to the near-infrared camera to allow the near-infrared camera to capture the near-infrared light.
    Type: Application
    Filed: December 6, 2018
    Publication date: January 7, 2021
    Applicant: Korea University Research and Business Foundation
    Inventors: Beop-Min KIM, Yong-Guk KANG, Ki-Hyeok KWON
  • Phosphonium-based compound, epoxy resin composition containing same, semiconductor device manufactured using same
    Patent number: 10385161
    Abstract: The present invention relates to a phosphonium-based compound represented by chemical formula 1, an epoxy resin composition containing the same, and a semiconductor device manufactured by using the same.
    Type: Grant
    Filed: January 22, 2016
    Date of Patent: August 20, 2019
    Assignee: Samsung SDI Co., Ltd.
    Inventors: Min Gyum Kim, Jin Woo Choi, Ki Hyeok Kwon, Dong Hwan Lee, Joo Young Chung, Jin Min Cheon
  • Phosphonium compound, preparation method thereof, epoxy resin composition including the same, and semiconductor device prepared by using the same
    Patent number: 9896465
    Abstract: A phosphonium compound, a method of preparing the same, an epoxy resin composition including the same, and a semiconductor device encapsulated with the same, the compound being represented by Formula 1:
    Type: Grant
    Filed: June 22, 2016
    Date of Patent: February 20, 2018
    Assignee: SAMSUNG SDI CO., LTD.
    Inventors: Dong Hwan Lee, Min Gyum Kim, So Yoon Kim, Woo Chul Na, Yoon Man Lee, Ji Yoon Cho, Ki Hyeok Kwon, KyoungChul Bae, Eun Jung Lee, Joo Young Chung, Jin Min Cheon, Jin Woo Choi, Seung Han
  • Phosphonium compound, epoxy resin composition including the same and semiconductor device prepared using the same
    Patent number: 9890307
    Abstract: A phosphonium compound, an epoxy resin composition including the same, a semiconductor device encapsulated with the same, and a method of encapsulating a semiconductor device, the phosphonium compound being represented by Formula 1:
    Type: Grant
    Filed: July 14, 2016
    Date of Patent: February 13, 2018
    Assignee: SAMSUNG SDI CO., LTD.
    Inventors: Ki Hyeok Kwon, Min Gyum Kim, Joo Young Chung, Jin Min Cheon, Jin Woo Choi, Seung Han, Dong Hwan Lee
  • Epoxy resin composition for encapsulating a semiconductor device and semiconductor device prepared using the same
    Patent number: 9870971
    Abstract: An epoxy resin composition and a semiconductor device, the composition including an epoxy resin; a curing agent; an inorganic filler; a curing catalyst; and a silicon compound, wherein the curing catalyst includes a phosphonium compound represented by the following Formula 4 and the silicon compound comprises a silicon compound represented by the following Formula 7:
    Type: Grant
    Filed: July 1, 2016
    Date of Patent: January 16, 2018
    Assignee: SAMSUNG SDI CO., LTD.
    Inventors: Joo Young Chung, Ki Hyeok Kwon, Min Gyum Kim, Jin Min Cheon, Jin Woo Choi, Seung Han
  • Phosphonium compound, epoxy resin composition including the same and semiconductor device prepared from the same
    Patent number: 9868751
    Abstract: A phosphonium compound, an epoxy resin composition, a method of preparing a phosphonium compound, and a semiconductor device encapsulated with the epoxy resin composition, the compound being represented by Formula 1:
    Type: Grant
    Filed: October 21, 2015
    Date of Patent: January 16, 2018
    Assignee: SAMSUNG SDI CO., LTD.
    Inventors: Min Gyum Kim, Ki Hyeok Kwon, Dong Hwan Lee, Joo Young Chung, Jin Min Cheon, Jin Woo Choi
  • Epoxy resin composition for encapsulating semiconductor device and semiconductor device prepared using the same
    Patent number: 9850390
    Abstract: An epoxy resin composition for encapsulation of a semiconductor device and a semiconductor device encapsulated with the epoxy resin composition, the composition including an epoxy resin; a curing agent; an inorganic filler; a curing catalyst; and a compound containing at least one hydroxyl group, wherein the curing catalyst includes a phosphonium compound represented by Formula 4:
    Type: Grant
    Filed: June 21, 2016
    Date of Patent: December 26, 2017
    Assignee: SAMSUNG SDI CO., LTD.
    Inventors: Jin Min Cheon, Ki Hyeok Kwon, Min Gyum Kim, Joo Young Chung, Jin Woo Choi, Seung Han
  • PHOSPHONIUM-BASED COMPOUND, EPOXY RESIN COMPOSITION CONTAINING SAME, SEMICONDUCTOR DEVICE MANUFACTURED USING SAME
    Publication number: 20170306079
    Abstract: The present invention relates to a phosphonium-based compound represented by chemical formula 1, an epoxy resin composition containing the same, and a semiconductor device manufactured by using the same.
    Type: Application
    Filed: January 22, 2016
    Publication date: October 26, 2017
    Inventors: Min Gyum KIM, Jin Woo CHOI, Ki Hyeok KWON, Dong Hwan LEE, Joo Young CHUNG, Jin Min CHEON
  • PHOSPHONIUM COMPOUND, EPOXY RESIN COMPOSITION INCLUDING THE SAME AND SEMICONDUCTOR DEVICE PREPARED USING THE SAME
    Publication number: 20170018473
    Abstract: A phosphonium compound, an epoxy resin composition including the same, a semiconductor device encapsulated with the same, and a method of encapsulating a semiconductor device, the phosphonium compound being represented by Formula 1:
    Type: Application
    Filed: July 14, 2016
    Publication date: January 19, 2017
    Inventors: Ki Hyeok KWON, Min Gyum KIM, Joo Young CHUNG, Jin Min CHEON, Jin Woo CHOI, Seung HAN, Dong Hwan LEE
  • EPOXY RESIN COMPOSITION FOR ENCAPSULATING A SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE PREPARED USING THE SAME
    Publication number: 20170002192
    Abstract: An epoxy resin composition and a semiconductor device, the composition including an epoxy resin; a curing agent; an inorganic filler; a curing catalyst; and a silicon compound, wherein the curing catalyst includes a phosphonium compound represented by the following Formula 4 and the silicon compound comprises a silicon compound represented by the following Formula 7:
    Type: Application
    Filed: July 1, 2016
    Publication date: January 5, 2017
    Inventors: Joo Young CHUNG, Ki Hyeok KWON, Min Gyum KIM, Jin Min CHEON, Jin Woo CHOI, Seung HAN
  • EPOXY RESIN COMPOSITION FOR ENCAPSULATING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE PREPARED USING THE SAME
    Publication number: 20160379909
    Abstract: An epoxy resin composition for encapsulation of a semiconductor device and a semiconductor device encapsulated with the epoxy resin composition, the composition including an epoxy resin; a curing agent; an inorganic filler; a curing catalyst; and a compound containing at least one hydroxyl group, wherein the curing catalyst includes a phosphonium compound represented by Formula 4:
    Type: Application
    Filed: June 21, 2016
    Publication date: December 29, 2016
    Inventors: Jin Min CHEON, Ki Hyeok KWON, Min Gyum KIM, Joo Young CHUNG, Jin Woo CHOI, Seung HAN
  • PHOSPHONIUM COMPOUND, PREPARATION METHOD THEREOF, EPOXY RESIN COMPOSITION INCLUDING THE SAME, AND SEMICONDUCTOR DEVICE PREPARED BY USING THE SAME
    Publication number: 20160368937
    Abstract: A phosphonium compound, a method of preparing the same, an epoxy resin composition including the same, and a semiconductor device encapsulated with the same, the compound being represented by Formula 1:
    Type: Application
    Filed: June 22, 2016
    Publication date: December 22, 2016
    Inventors: Dong Hwan LEE, Min Gyum KIM, So Yoon KIM, Woo Chul NA, Yoon Man LEE, Ji Yoon CHO, Ki Hyeok KWON, KyoungChul BAE, Eun Jung LEE, Joo Young CHUNG, Jin Min CHEON, Jin Woo CHOI, Seung HAN
  • PHOSPHONIUM COMPOUND, EPOXY RESIN COMPOSITION INCLUDING THE SAME AND SEMICONDUCTOR DEVICE PREPARED FROM THE SAME
    Publication number: 20160115184
    Abstract: A phosphonium compound, an epoxy resin composition, a method of preparing a phosphonium compound, and a semiconductor device encapsulated with the epoxy resin composition, the compound being represented by Formula 1:
    Type: Application
    Filed: October 21, 2015
    Publication date: April 28, 2016
    Inventors: Min Gyum KIM, Ki Hyeok KWON, Dong Hwan LEE, Joo Young CHUNG, Jin Min CHEON, Jin Woo CHOI