Patents by Inventor Ki Hyon Chyun

Ki Hyon Chyun has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20040194920
    Abstract: An apparatus for and a method of heat-treating a wafer for use in producing a semiconductor device ensures a desired distribution of surface temperatures across the wafer. Spacers are used to space the wafer above a heat transfer plate. The spacers can be used to adjust the spacing and inclination of the wafer relative to the heat transfer plate by predetermined amounts determined in advance to produce the desired distribution of surface temperatures across the wafer during heat-treatment. With the present invention, wafers can be heat-treated during production using a plurality of bake units disposed in parallel because each of the bake units can be precisely adjusted using the spacers to produce surface temperature distributions similar to a standard surface temperature distribution. Accordingly, the productivity of the semiconductor manufacturing process can be markedly enhanced.
    Type: Application
    Filed: April 13, 2004
    Publication date: October 7, 2004
    Inventors: Choung Hyep Kim, Sung Il Jang, Kyung Seo Park, Ki Hyon Chyun, Hee Sun Chae
  • Patent number: 6746972
    Abstract: An apparatus for and a method of heat-treating a wafer for use in producing a semiconductor device ensures a desired distribution of surface temperatures across the wafer. Spacers are used to space the wafer above a heat transfer plate. The spacers can be used to adjust the spacing and inclination of the wafer relative to the heat transfer plate by predetermined amounts determined in advance to produce the desired distribution of surface temperatures across the wafer during heat-treatment. With the present invention, wafers can be heat-treated during production using a plurality of bake units disposed in parallel because each of the bake units can be precisely adjusted using the spacers to produce surface temperature distributions similar to a standard surface temperature distribution. Accordingly, the productivity of the semiconductor manufacturing process can be markedly enhanced.
    Type: Grant
    Filed: June 28, 2000
    Date of Patent: June 8, 2004
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Choung Hyep Kim, Sung Il Jang, Kyung Seo Park, Ki Hyon Chyun, Hee Sun Chab