Abstract: A method for measuring critical dimensions of a pattern using an overlay measuring apparatus is provided. The method includes setting a first scan range, inputting a step pitch for the overlay measuring apparatus, inputting X and Y coordinates of a point on a reticle, and inputting a size of the reference pattern. The method further includes inputting a position of the reference pattern, inputting a second scan range, measuring the size of the reference pattern, and inputting an ideal pattern size. The method still further includes measuring a size and a first Z-axial focus position of a top region of the reference pattern, storing the first Z-axial focus position, measuring a size of the selected pattern of the first wafer using stored reference information, and determining whether the size of the selected pattern is suitable relative to the ideal pattern size.

Abstract: A chemical solution dispensing device adapted for use with photo spinner equipment is disclosed. The device includes a nozzle adapted to spray chemical solution onto a wafer, a pressure sensor associated with the nozzle and adapted to sense a spraying pressure and generate a pressure value corresponding to the sensed spraying pressure, and a controller adapted to receive the pressure value, compare the received pressure value to a predetermined threshold pressure value, and generate an interlock signal when the received pressure value exceeds the predetermined threshold pressure value.

Abstract: A method for measuring critical dimensions of a pattern using an overlay measuring apparatus is provided. The method includes setting a first scan range, inputting a step pitch for the overlay measuring apparatus, inputting X and Y coordinates of a point on a reticle, and inputting a size of the reference pattern. The method further includes inputting a position of the reference pattern, inputting a second scan range, measuring the size of the reference pattern, and inputting an ideal pattern size. The method still further includes measuring a size and a first Z-axial focus position of a top region of the reference pattern, storing the first Z-axial focus position, measuring a size of the selected pattern of the first wafer using stored reference information, and determining whether the size of the selected pattern is suitable relative to the ideal pattern size.

Abstract: A chemical solution dispensing device adapted for use with photo spinner equipment is disclosed. The device includes a nozzle adapted to spray chemical solution onto a wafer, a pressure sensor associated with the nozzle and adapted to sense a spraying pressure and generate a pressure value corresponding to the sensed spraying pressure, and a controller adapted to receive the pressure value, compare the received pressure value to a predetermined threshold pressure value, and generate an interlock signal when the received pressure value exceeds the predetermined threshold pressure value.

Abstract: A semiconductor manufacturing apparatus includes a wafer guide, and a wafer detecting system to determine whether a wafer is properly seated on a hot plate, by detecting temperature variations for the hot plate when the wafer is positioned onto the hot plate.

Abstract: A semiconductor manufacturing apparatus using a suctorial device for handling wafers includes a main vacuum line, a manufacturing apparatus for performing predetermined manufacturing processes with respect to the wafers, and a vacuum line for connecting the main vacuum line to the suctorial device. The vacuum line has a first vacuum line directly connected to the main vacuum line, and a second vacuum line having one end connected to the first vacuum line, the other end connected to the suctorial device through a connector installed in the manufacturing apparatus and a body installed in the manufacturing apparatus. The manufacturing apparatus may also contain a plurality of suctorial devices with a corresponding plurality of second vacuum lines and connectors.