Patents by Inventor Ki Il Hong

Ki Il Hong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11040522
    Abstract: Disclosed is a polyimide cover substrate, which is configured such that a device protection layer is formed of a urethane acrylate compound on at least one side of a polyimide film, thereby exhibiting not only high flexural properties and impact resistance but also superior solvent resistance, optical properties and scratch resistance and low water vapor transmission rate, and thus can be effectively utilized as a cover substrate for a flexible electronic device.
    Type: Grant
    Filed: March 31, 2014
    Date of Patent: June 22, 2021
    Assignee: KOLON INDUSTRIES, INC.
    Inventors: Hak Yong Woo, Hak Gee Jung, Ki Il Hong
  • Patent number: 10538665
    Abstract: This invention relates to a highly heat-resistant polyamic acid solution and a polyimide film having improved thermal dimensional stability, wherein the polyamic acid solution includes a polymer of a diamine compound, containing 1 to 10 mol % of a carboxylic acid functional group-containing diamine compound based on the total amount of diamine, and a dianhydride compound, and the polyimide film includes polyimide, which is an imidized product of the polyamic acid solution and is configured such that main chains thereof are crosslinked through an amide bond (—CONH—).
    Type: Grant
    Filed: June 30, 2015
    Date of Patent: January 21, 2020
    Assignee: KOLON INDUSTRIES, INC.
    Inventors: Woong Ki Min, Hyo Jun Park, Hak Gee Jung, Ki Il Hong
  • Publication number: 20170233575
    Abstract: This invention relates to a highly heat-resistant polyamic acid solution and a polyimide film having improved thermal dimensional stability, wherein the polyamic acid solution includes a polymer of a diamine compound, containing 1 to 10 mol % of a carboxylic acid functional group-containing diamine compound based on the total amount of diamine, and a dianhydride compound, and the polyimide film includes polyimide, which is an imidized product of the polyamic acid solution and is configured such that main chains thereof are crosslinked through an amide bond (—CONH—).
    Type: Application
    Filed: June 30, 2015
    Publication date: August 17, 2017
    Applicant: KOLON INDUSTRIES, INC.
    Inventors: Woong Ki MIN, Hyo Jun PARK, Hak Gee JUNG, Ki Il HONG
  • Publication number: 20150284512
    Abstract: The present invention relates to a polyamic acid solution, an imidization film, and a display device, and discloses a polyamic acid solution which is a reaction product of dianhydrides and aromatic diamines and has a thermal expansion coefficient of 10 ppm/° C. or less in a temperature range of 50 to 540° C., after forming an imidization film, an imidization film thereof, and a display device including the same. The present invention may provide a display having excellent thermal stability, proper flexibility, and mechanical strength by applying the polyamic acid solution.
    Type: Application
    Filed: December 17, 2013
    Publication date: October 8, 2015
    Applicant: KOLON INDUSTRIES, INC.
    Inventors: Woong Ki Min, Hak Gee Jung, Hyo Jun Park, Ki Il Hong
  • Publication number: 20140364564
    Abstract: The present invention relates to a polyamic acid solution and a display device, and more specifically, to a polyamic acid solution which can be used for a base layer or a protective layer of a display device, and a display device including a film formed by the imidization of the polyamic acid solution. The polyamic acid solution has excellent thermal characteristics such as a low coefficient of thermal expansion and a high thermal decomposition temperature, and can thus be applied to a base layer or a protective layer of a display device.
    Type: Application
    Filed: December 26, 2012
    Publication date: December 11, 2014
    Applicant: KOLON INDUSTRIES, INC.
    Inventors: Ki Il Hong, Woong Ki Min
  • Patent number: 7306835
    Abstract: The present invention relates to a thermo-shrinkable polyester film with a superior thermal shrinkage, which has an orientation angle of a molecular chain in a range of from 0° to about ±10° relative to a main shrinkage direction, and a molecular orientation ratio (MOR) in a range of from 1.29 to about 2.5, thereby preventing a label made from the film from curling or waving.
    Type: Grant
    Filed: January 29, 2007
    Date of Patent: December 11, 2007
    Assignee: Kolon Industries, Inc.
    Inventors: Ki Il Hong, Gi Sang Song
  • Publication number: 20070178326
    Abstract: The present invention relates to a thermo-shrinkable polyester film with a superior thermal shrinkage, which has an orientation angle of a molecular chain in a range of from 0° to about ±10° relative to a main shrinkage direction, and a molecular orientation ratio (MOR) in a range of from 1.29 to about 2.5, thereby preventing a label made from the film from curling or waving.
    Type: Application
    Filed: January 29, 2007
    Publication date: August 2, 2007
    Applicant: KOLON IND. INC./KR
    Inventors: Ki Il HONG, Gi Sang SONG