Patents by Inventor Ki Jae Jang

Ki Jae Jang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240136187
    Abstract: One embodiment of the present invention provides a method of manufacturing an electronic device using a cyclic doping process including i) an operation of forming a unit transfer thin film including a two-dimensional material on a transfer substrate, ii) an operation of doping the unit transfer thin film in a low-damage doping process, iii) an operation of transferring the unit transfer thin film doped according to the operation ii) on a transfer target substrate, and iv) an operation of repeatedly performing the operations i) to iii) several times to reach a target thickness.
    Type: Application
    Filed: October 19, 2023
    Publication date: April 25, 2024
    Applicant: Research & Business Foundation SUNGKYUNKWAN UNIVERSITY
    Inventors: Geun Young YEOM, Ki Hyun KIM, Ji Eun KANG, Seong Jae YU, You Jin JI, Doo San KIM, Hyun Woo TAK, Yun Jong JANG, Hee Ju KIM, Ki Seok KIM
  • Publication number: 20140213132
    Abstract: Disclosed is a inlaid type floor sheet having polyvinyl chloride chip and a method of manufacturing thereof. The in-laid type floor sheet having polyvinyl chloride (PVC) chip, includes an inlaid chip layer in which polyvinyl chloride is formed into chips; a UV paint layer which is coated on the inlaid chip layer; and a dimensionally reinforcing layer which is formed of a fabric and pressed on a lower surface of the inlaid chip layer at high temperature. According to the present invention, since the plain weave type dimensionally reinforcing layer is provided at the lower side of the inlaid type floor sheet having polyvinyl chloride chip, it is possible to improve the durability, realize the dimensional stability and balance of the product and increase the adhesive force with the construction floor.
    Type: Application
    Filed: September 5, 2012
    Publication date: July 31, 2014
    Applicant: LG HAUSYS, LTD.
    Inventors: Sung Ha Park, Jae Wan Sung, Dae Jin Kim, Ki Jae Jang