Patents by Inventor Ki Jun Kim

Ki Jun Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10897339
    Abstract: A method for generating a channel quality indicator (CQI) in a mobile communication system is presented. The method includes grouping a number of subcarriers to form at least one channel quality indicator subband for generating a channel quality indicator, and generating a channel quality indicator in each channel quality indicator subband, wherein a size of each channel quality indicator subband is dependent on a system bandwidth value and is an integer multiple of a downlink frequency resource unit size, wherein the downlink frequency resource unit size is prescribed according to the system bandwidth value.
    Type: Grant
    Filed: April 25, 2018
    Date of Patent: January 19, 2021
    Assignee: LG ELECTRONICS INC.
    Inventors: Dong Wook Roh, Bong Hoe Kim, Joon Kui Ahn, Yu Jin Noh, Dong Youn Seo, Ki Jun Kim
  • Publication number: 20210001783
    Abstract: A system for displaying vehicle driving information may include: first and second image acquisition devices configured to capture an image of a first side on which a driver seat is located and an image of a second side which is the opposite side of the first side, respectively; first and second display devices configured to display the captured images of the first and second image acquisition devices, respectively; first and second BSD devices and configured to sense side-rear vehicle information; and a control device configured to recognize the location and vehicle distance of the side-rear vehicle by analyzing the side-rear vehicle information detected by the first and second BSD devices, determine whether to issue a BSD warning, and control BSD warning icons of the ego vehicle and the side-rear vehicle to be displayed as an OSD of the images displayed on the first and second display devices.
    Type: Application
    Filed: July 6, 2020
    Publication date: January 7, 2021
    Inventors: Woo Sung LEE, Geon Pyo KIM, Hyun Ho PARK, Kwang Ho JUNG, Yong Jun SEO, Ki Hun BANG
  • Patent number: 10879861
    Abstract: A bias circuit of an amplifying device including amplifying circuits and a bypass circuit responding to a first control signal, includes a first bias circuit, a second bias circuit, and a compensating circuit. The first bias circuit is configured to supply a first base bias voltage to a first amplifying circuit of the amplifying circuits in response to a second control signal. The second bias circuit is configured to supply a second base bias voltage to a second amplifying circuit of the amplifying circuits in response to a third control signal. The compensating circuit is connected to either one or both of the first bias circuit and the second bias circuit, and configured to vary an impedance in response to a fourth control signal, and compensate for either one or both of the first base bias voltage and the second base bias voltage based on the varied impedance.
    Type: Grant
    Filed: June 28, 2019
    Date of Patent: December 29, 2020
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Sang Wook Park, Dae Hee No, Hyun Jun Kim, Bo Hyun Hwang, Jun Goo Won, Da Hye Park, Sung Hwan Park, Ki Joong Kim, Yoshiyuki Tonami
  • Publication number: 20200396688
    Abstract: The present disclosure relates to a wireless battery management system which ensures stability when obtaining battery data through wireless communication. The battery management system includes a manager node operating a primary channel and a secondary channel based on wireless communication and obtaining battery data from a monitor node by using the primary channel or the secondary channel and a monitor node connected to a battery module to collect battery data including one or more of a current, a voltage, a temperature, and self-diagnosis data of the battery module, transmit the collected battery data to the manager node through the primary channel, and when the transmission of the battery data through the primary channel fails, transmit the battery data to the manager node through the secondary channel.
    Type: Application
    Filed: June 11, 2020
    Publication date: December 17, 2020
    Inventors: Ju Pyo HONG, Ki Suk CHO, Heung Lyeol LEE, Kyu Ho KIM, Seung Jun CHOI, Deog Soo KIM, Yong Ju SEON, Hee Jin LEE, Young Ho SEO, Jong Chan KIM
  • Publication number: 20200369084
    Abstract: An axle assembly for drive wheels of vehicles includes a steering knuckle, an axle housing coupled to an inside of the steering knuckle, a wheel disc that is fixed to the axle housing to be rotatable integrally with the axle housing, and a drive shaft that is coupled to the axle housing to be rotatable integrally with the axle housing. A hub bearing is disposed between the steering knuckle and the axle housing. A forming part is formed at an end of the axle housing in a state in which a bearing inner race of the hub bearing is coupled to an outer circumferential surface of the axle housing, and the bearing inner race is engaged with a side part of the axle housing by the forming part in a state in which the forming part is pressed against a side end of the bearing inner race.
    Type: Application
    Filed: April 29, 2020
    Publication date: November 26, 2020
    Inventors: Sung Su Yoo, Won Jun Choi, Hee Il Kim, Bum Jae Lee, Chang Hee Jeong, Ki Dong Park
  • Patent number: 10846695
    Abstract: An electronic device and a payment method are provided. The electronic device includes a first communication circuitry configured to support a first payment function, a second communication circuitry configured to support a second payment function, and a processor configured to operatively connect with each of the first communication circuitry and the second communication circuitry, to output a first user interface (UI) corresponding to a payment request, to obtain payment related information using at least one of the first communication circuitry, the second communication circuitry, or a sensor circuitry operatively connected with the processor, and to output a second UI based on the payment related information.
    Type: Grant
    Filed: July 14, 2016
    Date of Patent: November 24, 2020
    Assignee: Samsung Electronics Co., Ltd
    Inventors: Ki Bong Kim, June Yeob Kim, Seon Sook Lee, Young Jun Jung
  • Publication number: 20200356290
    Abstract: A method and memory device of controlling a plurality of low power states are provided. The method includes: entering a low power mode state, in which memory cell rows of the memory device are refreshed and power consumption is lower than in a self-refresh mode state, in response to a low power state entry command; and exiting the low power mode state based on a low power mode exit latency time that is set in a mode register of the memory device or at least one of an alarm signal and a low power mode exit command.
    Type: Application
    Filed: July 27, 2020
    Publication date: November 12, 2020
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Yeon-kyu CHOI, Ki-seok OH, Seung-jun SHIN, Hye-ran KIM
  • Patent number: 10814903
    Abstract: A steering column assembly for a vehicle may include a buffer structure provided between a steering housing and a steering shaft inserted into the steering housing to distribute vibration applied thereto and to compensate for the distortion of the steering shaft and a clearance of the steering shaft with the steering housing, wherein a support structure is also provided to secure the support performance of the steering housing with respect to a mounting bracket in the event of a tilt and a longitudinal motion of the steering housing, ensuring the horizontal rigidity of the steering housing and reducing vibration applied thereto.
    Type: Grant
    Filed: November 28, 2018
    Date of Patent: October 27, 2020
    Assignees: Hyundai Motor Company, Kia Motors Corporation, MANDO Corporation
    Inventors: Hyoung Jun Ahn, Joon Mo Park, Beom Soo Kim, Byung Woo Noh, Ji Yong Yim, Sung Hun Park, Dong Hun Shin, Ki Hong Kim
  • Publication number: 20200336245
    Abstract: A method for channel-coding information bits using a code generation matrix including 32 rows and A columns corresponding to length of the information bits includes, channel-coding the information bits having “A” length using basis sequences having 32-bit length corresponding to columns of the code generation matrix, and outputting the channel-coded result as an output sequence. If “A” is higher than 10, the code generation matrix is generated when (A-10) additional basis sequences were added as column-directional sequences to a first or second matrix. The first matrix is a TFCI code generation matrix composed of 32 rows and 10 columns used for TFCI coding. The second matrix is made when at least one of an inter-row location or an inter-column location of the first matrix was changed. The additional basis sequences satisfy a value 10 of a minimum Hamming distance.
    Type: Application
    Filed: July 2, 2020
    Publication date: October 22, 2020
    Applicant: LG ELECTRONICS INC.
    Inventors: Dong Wook ROH, Joon Kui AHN, Nam Yul YU, Jung Hyun CHO, Yu Jin NOH, Ki Jun KIM, Dae Won LEE
  • Publication number: 20200335673
    Abstract: A light emitting device package disclosed in an embodiment of the invention includes a substrate including first and second frames; a light emitting device including a first bonding portion facing the first frame and a second bonding portion facing the second frame; a phosphor layer on the light emitting device; a first resin disposed around the upper surface of the substrate and the light emitting device; a second resin between the first resin and side surfaces of the light emitting device; and an adhesive layer between the phosphor layer and the light emitting device, wherein the adhesive layer includes a thickness thinner than a thickness of the phosphor layer, and the first resin comprises a reflective resin material and is disposed on the side surface of the phosphor layer. The second resin may include a transparent resin material, and the second resin may include a curved surface with an outer surface facing the first resin.
    Type: Application
    Filed: October 31, 2018
    Publication date: October 22, 2020
    Inventors: Ki Seok KIM, Jung Hwa JUNG, Na Young KIM, Won Jung KIM, Suk Kyung PARK, Sang Jun LEE, Nak Hun KIM, Chang Man LIM
  • Publication number: 20200332478
    Abstract: This invention relates to an artificial turf. The artificial turf comprises a base layer, a buffer layer positioned under the base layer and formed of single-fiber nonwoven fabrics, a pile unit penetrating the base layer and the buffer layer to be turfed, wherein the one end of the pile unit is projected to the upper direction of the base layer and the other end of the pile unit is positioned undersurface of the buffer layer, and a backing layer in contact with the undersurface of the buffer layer and the other end of the pile unit and formed of long-fiber non-woven fabrics. In this case, at least a portion of the buffer layer penetrates the base layer and is positioned on upper surface of the base layer to form pores.
    Type: Application
    Filed: July 23, 2018
    Publication date: October 22, 2020
    Inventors: Se Jun HWANG, Jong Pil KIM, Yeoung Hoon KWON, Ki Tae BAE
  • Publication number: 20200329315
    Abstract: An electronic device according to an embodiment may comprise: a speaker, an amplifier connected to the speaker through a first electrical path; and at least one processor electrically connected to the amplifier, wherein the at least one processor is configured to: provide a first audio signal set to a first volume level to the speaker via the amplifier; when the first volume level is less than a predetermined first value, output the first audio signal at the first volume level through the speaker; and when the first volume level is equal to or greater than the first value, control a volume level of the first audio signal on the basis of a temperature value of the speaker, which is estimated from the first audio signal.
    Type: Application
    Filed: October 30, 2018
    Publication date: October 15, 2020
    Inventors: Hee Jun RYU, Ki Won KIM, Sang Hoon KIM, Sang Woo BAE, Yeo Jin KIM, Chang Tae KIM, Sung Bin HONG
  • Patent number: 10797160
    Abstract: A method of fabricating a semiconductor device may include forming a fin structure on a substrate; forming an interface film having a first thickness on the fin structure using a first process; forming a gate dielectric film having a second thickness on the interface film using a second process different from the first process; and densifying the gate dielectric film using a third process different from the first and second processes. The second thickness may be greater than the first thickness, and the first thickness of the interface film may be unchanged after the densifying of the gate dielectric film.
    Type: Grant
    Filed: October 2, 2018
    Date of Patent: October 6, 2020
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Hyun-Jun Sim, Won-Oh Seo, Sun-Jung Kim, Ki-Yeon Park
  • Publication number: 20200310008
    Abstract: According to various examples of the present invention, an electronic device can comprise: a housing including a first surface facing a first direction, a second surface facing a second direction opposite to the first direction, and a side surface surrounding at least a part of a space between the first surface and the second surface; a display device formed on at least one of the first surface and the second surface; an opening formed on at least one of the first surface, the second surface, and the side surface; a module mounted inside the housing not to be exposed; and a guide member disposed inside the housing between the module and configured to provide output of the module to outside through the opening. Additionally, the electronic device can be variously implemented according to examples.
    Type: Application
    Filed: March 29, 2017
    Publication date: October 1, 2020
    Inventors: Min-Sik KIM, Min-Sung LEE, Song-Hee JUNG, Seung-Jun HYUN, Moo-Young KIM, Ki-Huk LEE
  • Publication number: 20200314433
    Abstract: Disclosed are a method and apparatus for improving the accuracy of intra-prediction in order to improve encoding and decoding efficiency. The video decoding method may improve the prediction efficiency for the current pixel to be predicted by referring to the degree of variation in surrounding pixels, to thereby effectively decode the bit stream with improved encoding efficiency. In addition, an additional prediction candidate is used to achieve improved accuracy of intra-prediction, and the thus-improved accuracy of intra-prediction may reduce residual components and improve encoding efficiency. Further, an improved planar mode is utilized to achieve improved intra-prediction.
    Type: Application
    Filed: June 12, 2020
    Publication date: October 1, 2020
    Inventors: Je Chang JEONG, Ki Baek KIM, Won Jin LEE, Hye Jin SHIN, Jong Sang YOO, Jang Hyeok YUN, Kyung Jun LEE, Jae Hun KIM, Sang Gu LEE
  • Publication number: 20200295028
    Abstract: A method for fabricating semiconductor device includes forming an alternating stack that includes a lower multi-layered stack and an upper multi-layered stack by alternately stacking a dielectric layer and a sacrificial layer over a substrate, forming a vertical trench that divides the upper multi-layered stack into dummy stacks, and forming an asymmetric stepped trench that is extended downward from the vertical trench to divide the lower multi-layered stack into a pad stack and a dummy pad stack, wherein forming the asymmetric stepped trench includes forming a first stepped sidewall that is defined at an edge of the pad stack, and forming a second stepped sidewall that is defined at an edge of the dummy pad stack and occupies less area than the first stepped sidewall.
    Type: Application
    Filed: September 13, 2019
    Publication date: September 17, 2020
    Inventors: Eun-Ho KIM, Eun-Joo JUNG, Jong-Hyun YOO, Ki-Jun YUN, Sung-Hoon LEE
  • Publication number: 20200287510
    Abstract: A bias circuit of an amplifying device including amplifying circuits and a bypass circuit responding to a first control signal, includes a first bias circuit, a second bias circuit, and a compensating circuit. The first bias circuit is configured to supply a first base bias voltage to a first amplifying circuit of the amplifying circuits in response to a second control signal. The second bias circuit is configured to supply a second base bias voltage to a second amplifying circuit of the amplifying circuits in response to a third control signal. The compensating circuit is connected to either one or both of the first bias circuit and the second bias circuit, and configured to vary an impedance in response to a fourth control signal, and compensate for either one or both of the first base bias voltage and the second base bias voltage based on the varied impedance.
    Type: Application
    Filed: June 28, 2019
    Publication date: September 10, 2020
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Sang Wook PARK, Dae Hee NO, Hyun Jun KIM, Bo Hyun HWANG, Jun Goo WON, Da Hye PARK, Sung Hwan PARK, Ki Joong KIM, Yoshiyuki TONAMI
  • Publication number: 20200273800
    Abstract: A system-in-package includes a redistributed line (RDL) structure, a first semiconductor chip, a second semiconductor chip, and a bridge die. The RDL structure includes a first RDL pattern to which a first chip pad of the first semiconductor chip is electrically connected. The second semiconductor chip is stacked on the first semiconductor chip such that the second semiconductor chip protrudes past a side surface of the first semiconductor chip, wherein a second chip pad disposed on the protrusion is electrically connected to the first RDL pattern through the bridge die.
    Type: Application
    Filed: October 28, 2019
    Publication date: August 27, 2020
    Applicant: SK hynix Inc.
    Inventors: Jong Hoon KIM, Ki Jun SUNG, Ki Bum KIM
  • Publication number: 20200273799
    Abstract: A system-in-package includes a redistributed line (RDL) structure, a first semiconductor chip, a second semiconductor chip, a second sub-package, a first bridge die, and a second bridge die. The RDL structure includes a first RDL pattern to which a first chip pad of the first semiconductor chip is electrically connected. The second semiconductor is stacked on the first semiconductor chip such that the second semiconductor chip protrudes past a side surface of the first semiconductor chip, wherein a second chip pad disposed on the protrusion of the second semiconductor chip is electrically connected to the first RDL pattern through the first bridge die. The second bridge die is disposed to electrically connect the second sub-package to the first semiconductor chip.
    Type: Application
    Filed: October 28, 2019
    Publication date: August 27, 2020
    Applicant: SK hynix Inc.
    Inventors: Ki Jun SUNG, Jong Hoon KIM, Jae Min KIM
  • Patent number: RE48277
    Abstract: A method of transmitting uplink signals is disclosed. The method includes transmitting, by a user equipment, periodic control information on a Physical Uplink Control Channel (PUCCH) at a predetermined period, dropping the periodic control information and multiplexing uplink signals except the periodic control information when the user equipment is operating in subframe bundling transmission mode where the uplink signals are transmitted in a plurality of consecutive subframes, and transmitting the multiplexed uplink signals on a Physical Uplink Shared Channel (PUSCH).
    Type: Grant
    Filed: February 21, 2017
    Date of Patent: October 20, 2020
    Assignee: LG Electronics Inc.
    Inventors: Dae Won Lee, Ki Jun Kim, Joon Kui Ahn