Abstract: A wafer via solder filling device includes a solder bath comprising an accommodation space for accommodating a molten solder, with an open top, and an air outlet for exhausting air from the accommodation space; a fixing unit for fixing the wafer having a via formed in one surface in the accommodation space to seal the accommodation space airtight; and a pressing unit for pressing a bottom of the molten solder arranged in the solder bath and moving the molten solder upward, to fill the molten solder in the via.

Abstract: A wafer via solder filling device includes a solder bath comprising an accommodation space for accommodating a molten solder, with an open top, and an air outlet for exhausting air from the accommodation space; a fixing unit for fixing the wafer having a via formed in one surface in the accommodation space to seal the accommodation space airtight; and a pressing unit for pressing a bottom of the molten solder arranged in the solder bath and moving the molten solder upward, to fill the molten solder in the via.

Abstract: An optical cable and an optical cable assembly having the same are provided. The optical cable includes a plurality of optical fibers each of which includes a core, a clad arranged on an outside of the core, and a coating layer arranged on an outside of the clad; a substantially transparent sheath in which the plurality of optical fibers are arranged; and a substantially transparent filler configured to fill a space between the sheath and the plurality of optical fibers.

Abstract: A soldering jig for double-faced cooling power modules is provided. The soldering jig prevents thermal deformation of a substrate during a soldering process. The soldering jig is used to fix the position of an upper substrate and a lower substrate when a semiconductor chip is disposed and soldered between the upper and lower substrates. The soldering jig includes a lower jig plate that is disposed under the lower substrate and fixes the position of lower substrate, an upper jig plate that is disposed over the upper substrate and compresses the upper substrate toward the lower substrate. Additionally, a connector which couples the lower jig plate and the upper jig plate, and an insert is installed on the connector and is disposed between the upper substrate and the lower substrate to maintain a constant distance between the upper substrate and the lower substrate during a soldering process.

Abstract: A wafer via solder filling device includes a solder bath comprising an accommodation space for accommodating a molten solder, with an open top, and an air outlet for exhausting air from the accommodation space; a fixing unit for fixing the wafer having a via formed in one surface in the accommodation space to seal the accommodation space airtight; and a pressing unit for pressing a bottom of the molten solder arranged in the solder bath and moving the molten solder upward, to fill the molten solder in the via.

Abstract: A wafer via solder filling device includes a solder bath comprising an accommodation space for accommodating a molten solder, with an open top, and an air outlet for exhausting air from the accommodation space; a fixing unit for fixing the wafer having a via formed in one surface in the accommodation space to seal the accommodation space airtight; and a pressing unit for pressing a bottom of the molten solder arranged in the solder bath and moving the molten solder upward, to fill the molten solder in the via.

Abstract: An apparatus for generating injection current for a fuel cell stack includes a first converter configured to convert direct current of a voltage corresponding to a high voltage battery, into direct current of a predetermined voltage; a second converter configured to convert the converted direct current into alternating current; a filter configured to filter a signal of a predetermined frequency band from the converted alternating current; and a control unit configured to perform a feedback control to allow the filtered alternating current to be injected without being distorted when injecting the filtered alternating current into the fuel cell stack.

Abstract: An apparatus for generating injection current for a fuel cell stack includes a switch configured to retain any one state of an on state and an off state; an inductor configured to output accumulated energy according to a state of the switch; and a converter configured to provide an output of the inductor to a load or convert the output into a predetermined voltage and provide the predetermined voltage to a load.

Abstract: A wafer via solder filling device includes a solder bath comprising an accommodation space for accommodating a molten solder, with an open top, and an air outlet for exhausting air from the accommodation space; a fixing unit for fixing the wafer having a via formed in one surface in the accommodation space to seal the accommodation space airtight; and a pressing unit for pressing a bottom of the molten solder arranged in the solder bath and moving the molten solder upward, to fill the molten solder in the via.

Abstract: A device of filling metal in a through-via-hole formed in a semiconductor wafer and a method of filling metal in a through-via-hole using the same are disclosed. A device of filling metal in a through-via-hole formed in a semiconductor wafer includes a jig base comprising a jig configured to fix the wafer having the through-via-hole formed therein; a upper chamber 120 installed on the jig base; a lower chamber installed under the jig base; a heater installed in the upper chamber, the heater configured to apply heat to filling metal placed on the wafer to melt the filling metal; and a vacuum pump configured to generate pressure difference between the upper chamber and the lower chamber by the pressure of the lower chamber reduced by discharging air of the lower chamber 130 outside, only to fill the melted filling metal in the through-via-hole.

Abstract: A device of filling metal in a through-via-hole formed in a semiconductor wafer and a method of filling metal in a through-via-hole using the same are disclosed. A device of filling metal in a through-via-hole formed in a semiconductor wafer includes a jig base comprising a jig configured to fix the wafer having the through-via-hole formed therein; a upper chamber 120 installed on the jig base; a lower chamber installed under the jig base; a heater installed in the upper chamber, the heater configured to apply heat to filling metal placed on the wafer to melt the filling metal; and a vacuum pump configured to generate pressure difference between the upper chamber and the lower chamber by the pressure of the lower chamber reduced by discharging air of the lower chamber 130 outside, only to fill the melted filling metal in the through-via-hole.

Abstract: The present invention provides stockings of no wearing mark wherein a wearing portion is provided on an upper portion of the stockings and formed in the shape of lace, and spandex is selectively blended with the lace, thereby leaving no wearing mark in case of taking off the stockings; and a silicon member having a regular pattern is attachable d on an inner side of the wearing portion or an inner side below the wearing portion, thereby leaving no wearing mark after wearing and preventing the upper portion from curling and slipping down by a strong frictional force.

Abstract: A cooling structure for a portable computer includes a cooling fan creating an air stream to release heat generated in a main body of the computer to the outside through at least one vent. First and second heat pipes transfer heat generated in first and second heat sources on a main board of the computer to a path of the air stream. A portion of the air stream is also directed to the interior of the main body.