Patents by Inventor Ki Pyo Lee

Ki Pyo Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240170215
    Abstract: A multilayer ceramic capacitor includes a ceramic body having a dielectric layer, a plurality of internal electrodes disposed in the ceramic body, and a first side margin portion and a second side margin portion arranged on end portions of the internal electrodes exposed through respective opposing surfaces of the ceramic body. The ceramic body includes an active portion having the plurality of internal electrodes arranged to overlap each other with the dielectric layer interposed therebetween to form capacitance, and cover portions disposed above an uppermost and below a lowermost internal electrode of the active portion. The first and second side margin portions include tin (Sn), and a content of Sn included in the first and second side margin portions is greater than a content of Sn included in the dielectric layer of the active portion.
    Type: Application
    Filed: January 31, 2024
    Publication date: May 23, 2024
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Eun Jung Lee, Jong Ho Lee, Sim Chung Kang, Ki Pyo Hong
  • Patent number: 11964805
    Abstract: The present disclosure relates to a container for retort food and, more specifically, to a container for retort food including: a container body in which food may be input and stored; and an inner cap covering the container body. The inner cap covering the container body has a predetermined depth, and thus, effective sterilization may be performed during a retort processing process, overflow of the food in the container body may be prevented, and there is an advantage in satisfying regulations regarding a packing space ratio.
    Type: Grant
    Filed: January 23, 2020
    Date of Patent: April 23, 2024
    Assignee: CJ CHEILJEDANG CORPORATION
    Inventors: Ki Pyo Kim, Yong Hwan Kim, Kyoung Sik Cho, Kwang Soo Park, Byung Kook Lee
  • Patent number: 11923149
    Abstract: A multilayer ceramic capacitor includes a ceramic body including dielectric layers, a plurality of internal electrodes disposed in the ceramic body, and a first side margin portion and a second side margin portion respectively arranged on end portions of the internal electrodes exposed to first and second surfaces. The first and second side margin portions each include a first region adjacent to an outward facing side surface of the respective side margin portion, and a second region adjacent to the internal electrodes exposed to the first and second surfaces of the ceramic body, and an average size of dielectric grains included in the second region is larger than an average size of dielectric grains included in the first region.
    Type: Grant
    Filed: January 31, 2023
    Date of Patent: March 5, 2024
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jong Ho Lee, Yong Park, Ki Pyo Hong, Sim Chung Kang
  • Patent number: 11923146
    Abstract: A multilayer ceramic capacitor includes a ceramic body having a dielectric layer, a plurality of internal electrodes disposed in the ceramic body, and a first side margin portion and a second side margin portion arranged on end portions of the internal electrodes exposed through respective opposing surfaces of the ceramic body. The ceramic body includes an active portion having the plurality of internal electrodes arranged to overlap each other with the dielectric layer interposed therebetween to form capacitance, and cover portions disposed above an uppermost and below a lowermost internal electrode of the active portion. The first and second side margin portions include tin (Sn), and a content of Sn included in the first and second side margin portions is greater than a content of Sn included in the dielectric layer of the active portion.
    Type: Grant
    Filed: April 25, 2023
    Date of Patent: March 5, 2024
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Eun Jung Lee, Jong Ho Lee, Sim Chung Kang, Ki Pyo Hong
  • Publication number: 20190270127
    Abstract: Embodiments include a method for manufacturing a hot-rolled coil and a method for correcting the shape of a hot-rolled coil. In one embodiment, the method for manufacturing the hot-rolled coil includes the steps of: reheating a steel slab comprising 0.18 to 0.56 wt % carbon (C), 0.1 to 0.5 wt % silicon (Si), 0.7 to 6.5 wt % manganese (Mn), more than 0 wt % but not more than 0.02 wt % phosphorus (P), more than 0 wt % but not more than 0.02 wt % sulfur (S), more than 0 wt % but not more than 0.3 wt % chromium (Cr), more than 0 wt % but not more than 0.004 wt % boron (B), 0.01 to 0.04 wt % titanium (Ti), and the remainder being iron (Fe) and other inevitable impurities; hot-rolling the steel slab at a finishing mill delivery temperature of 850° C. to 950° C., thereby forming a hot-rolled sheet; and cooling the hot-rolled sheet, followed by coiling at a coiling temperature of 700° C. or higher.
    Type: Application
    Filed: July 21, 2017
    Publication date: September 5, 2019
    Inventors: Seung Han Cho, Ji Seong Hwang, Tae Kyung Kim, Hyun Soo Kim, Hyeong Jin Kim, Myung Soo Park, Young Soo Park, Ki Pyo Lee, Seung Ha Lee, Jong Hyob Lim, Jun Seok Lim, Hee Joong Lim