Patents by Inventor Ki Ran PARK

Ki Ran PARK has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Printed circuit board
    Patent number: 11856701
    Abstract: A printed circuit board includes: a first insulating layer including a first cavity and a second cavity; a first electronic component disposed in the first cavity and including a first pad disposed in a first surface direction of the first insulating layer; a second electronic component disposed in the second cavity and including a second pad disposed in a second surface direction, facing the first surface direction, of the first insulating layer; a second insulating layer disposed on each of first and second surfaces of the first insulating layer and in the first cavity to cover the first electronic component; and a third insulating layer disposed on the first surface of the first insulating layer and in the second cavity to cover the second electronic component.
    Type: Grant
    Filed: February 16, 2022
    Date of Patent: December 26, 2023
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Hyun Woo Kwon, Ki Ran Park, Kyeong Yub Jung, Jin Uk Lee, Jae Heun Lee
  • PRINTED CIRCUIT BOARD
    Publication number: 20230156922
    Abstract: A printed circuit board includes: a first insulating layer including a first cavity and a second cavity; a first electronic component disposed in the first cavity and including a first pad disposed in a first surface direction of the first insulating layer; a second electronic component disposed in the second cavity and including a second pad disposed in a second surface direction, facing the first surface direction, of the first insulating layer; a second insulating layer disposed on each of first and second surfaces of the first insulating layer and in the first cavity to cover the first electronic component; and a third insulating layer disposed on the first surface of the first insulating layer and in the second cavity to cover the second electronic component.
    Type: Application
    Filed: February 16, 2022
    Publication date: May 18, 2023
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Hyun Woo KWON, Ki Ran PARK, Kyeong Yub JUNG, Jin Uk LEE, Jae Heun LEE