Abstract: A semiconductor chip package with a flash memory portion and a method and system for testing the same are provided. After an internal cycling test is automatically and independently initiated on the flash memory chip, a test on other memory portions in the semiconductor chip package is performed. The semiconductor chip package includes a first flash memory portion, at least one second memory portions, and an internal cycling tester repetitively performing a batch programming operation and a batch erase operation on the first flash memory portion.

Abstract: A signature identification circuit of a semiconductor chip can include a resistor connected to a power supply voltage, a first fuse connected in series with the resistor, first, second, and third transistors connected in series with one another and with the first fuse, second, third, and fourth fuses connected in parallel with the first, second, and third transistors, respectively, a fourth transistor connected in series with the third transistor, and a fifth transistor having a first terminal connected to the fourth transistor, a second terminal connected to an address signal, and a third terminal connected to an external control signal, separate from the address signal.