Abstract: Disclosed are a light emitting device and a lighting system having the same. The light emitting device includes a body including first and second lateral side parts, third and fourth lateral side parts, and a cavity, a first lead frame extending in a direction of the first lateral side part of the body, a second lead frame extending in a direction of the second lateral side part of the body, a light emitting chip disposed on the first lead frame in the cavity, and a gap part between the first and second lead frames. The first lead frame includes a first recess part having a first depth, and a second recess part recessed at a second depth, and the first recess part and the second recess part have a step structure with a curved surface.

Abstract: Disclosed are a light emitting device and a lighting system having the same. The light emitting device includes a body including first and second lateral side parts, third and fourth lateral side parts, and a cavity, a first lead frame extending in a direction of the first lateral side part of the body, a second lead frame extending in a direction of the second lateral side part of the body, a light emitting chip disposed on the first lead frame in the cavity, and a gap part between the first and second lead frames. The first lead frame includes a first recess part having a first depth, and a second recess part recessed at a second depth, and the first recess part and the second recess part have a step structure with a curved surface.

Abstract: Disclosed are a light emitting device and a lighting system having the same. The light emitting device includes a body including first and second lateral side parts, third and fourth lateral side parts, and a cavity, a first lead frame extending in a direction of the first lateral side part of the body, a second lead frame extending in a direction of the second lateral side part of the body, a gap part between the first and second lead frames, and a molding member in the cavity. The first lead frame includes a first recess part having a first depth, and a second recess part recessed at a second depth in a region adjacent to the first lateral side part of the body, and the first depth of the first recess part is different from the second depth of the second recess part.

Abstract: Disclosed is a light emitting device. The light emitting device includes: a body including a cavity having first and second inner sides opposite to each other and third and fourth inner sides connected to first and second inner sides and opposite to each other; a first lead frame extending from a bottom of cavity under a first inner side of cavity; a second lead frame extending from the bottom of cavity under a second inner side of cavity; a gap part in the bottom of cavity between first and second lead frames; a light emitting chip on first lead frame; a protective chip on the second lead frame; a recess region recessed outward of body from at least one of third and fourth inner sides of cavity; and a first wire connected to the second frame disposed between light emitting chip and a sidewall of the recess region.

Abstract: Disclosed is a light emitting device. The light emitting device includes: a body including a cavity having first and second inner sides opposite to each other and third and fourth inner sides connected to first and second inner sides and opposite to each other; a first lead frame extending from a bottom of cavity under a first inner side of cavity; a second lead frame extending from the bottom of cavity under a second inner side of cavity; a gap part in the bottom of cavity between first and second lead frames; a light emitting chip on first lead frame; a protective chip on the second lead frame; a recess region recessed outward of body from at least one of third and fourth inner sides of cavity; and a first wire connected to the second frame disposed between light emitting chip and a sidewall of the recess region.

Abstract: Disclosed are a light emitting device and a lighting system having the same. The light emitting device includes a body including first and second lateral side parts, third and fourth lateral side parts, and a cavity, a first lead frame extending in a direction of the first lateral side part of the body, a second lead frame extending in a direction of the second lateral side part of the body, a gap part between the first and second lead frames, and a molding member in the cavity. The first lead frame includes a first recess part having a first depth, and a second recess part recessed at a second depth in a region adjacent to the first lateral side part of the body, and the first depth of the first recess part is different from the second depth of the second recess part.

Abstract: A stacked semiconductor package including: a first chip; a plurality of first leads of which one side of each of the first leads is attached to the first chip by an insulating adhesive member and electrically connected to the first chip; a first molding compound for sealing the first chip and the first leads, including holes for exposing a predetermined portion of each of the plurality of the first leads, and the first molding compound does not cover a side of the first leads opposite the holes; a first conductive portion formed within the holes included in the first molding compound; an external terminal electrically connected to the first conductive portion; a second chip; a plurality of second leads attached on the second chip by the insulating adhesive member, and being electrically connected to the second chip; a second molding compound for sealing the second chip and the second leads, and exposing a predetermined portion of the second leads; a plurality of conductive connection units for electrically co

Abstract: A stacked semiconductor package including: a first chip; a plurality of first leads of which one side of each of the first leads is attached to the first chip by an insulating adhesive member and electrically connected to the first chip; a first molding compound for sealing the first chip and the first leads, including holes for exposing a predetermined portion of each of the plurality of the first leads, and the first molding compound does not cover a side of the first leads opposite the holes; a first conductive portion formed within the holes included in the first molding compound; an external terminal electrically connected to the first conductive portion; a second chip; a plurality of second leads attached on the second chip by the insulating adhesive member, and being electrically connected to the second chip; a second molding compound for sealing the second chip and the second leads, and exposing a predetermined portion of the second leads; a plurality of conductive connection units for electrically co

Abstract: A stacked semiconductor package including: a first chip; a plurality of first leads of which one side of each of the first leads is attached to the first chip by an insulating adhesive member and electrically connected to the first chip; a first molding compound for sealing the first chip and the first leads, including holes for exposing a predetermined portion of each of the plurality of the first leads, and the first molding compound does not cover a side of the first leads opposite the holes; a first conductive portion formed within the holes included in the first molding compound; an external terminal electrically connected to the first conductive portion; a second chip; a plurality of second leads attached on the second chip by the insulating adhesive member, and being electrically connected to the second chip; a second molding compound for sealing the second chip and the second leads, and exposing a predetermined portion of the second leads; a plurality of conductive connection units for electrically co

Abstract: A stacked semiconductor package including: a first chip; a plurality of first leads of which one side of each of the first leads is attached to the first chip by an insulating adhesive member and electrically connected to the first chip; a first molding compound for sealing the first chip and the first leads, including holes for exposing a predetermined portion of each of the plurality of the first leads, and the first molding compound does not cover a side of the first leads opposite the holes; a first conductive portion formed within the holes included in the first molding compound; an external terminal electrically connected to the first conductive portion; a second chip; a plurality of second leads attached on the second chip by the insulating adhesive member, and being electrically connected to the second chip; a second molding compound for sealing the second chip and the second leads, and exposing a predetermined portion of the second leads; a plurality of conductive connection units for electrically co

Abstract: A chip size semiconductor package (CSP) and method of manufacturing same is provided that increases solder joint reliability and increases an amount of radiated heat. The chip size semiconductor package includes a semiconductor chip having a plurality of bonding pads on a first surface, a plurality of first leads connected to the bond pads on the first surface of the semiconductor chip and a plurality of connection members couple the bonding pads and the first leads. A plurality of second leads are formed on the upper surfaces of the first leads. The second leads have first portions formed on upper outer portions of the first leads and second portions extended from the first portions and upwardly bent. A molding portion molds the connection members formed on the semiconductor chip and the first leads and the first portions of the second leads whereby the second portions of the second leads are exposed.

Abstract: A method for fabricating a semiconductor package having a semiconductor chip and leads attached to the chip includes the steps of placing a tape over the leads attached to the semiconductor chip, forming a mold to encapsulate the semiconductor chip and the leads while exposing a portion of the leads contacting the tape, and removing the tape over the leads after the mold forming step.

Abstract: A package such as for an image sensing device includes the device, which preferably is a solid state image sensing device converting an optical image to an electric signal, metal bumpers formed on the bonding pads of the image sensing device, leads electrically connected to the bumpers, a dielectric wall hermetically sealing the connection areas of the leads and the bumpers, and surrounding the circumference of a light-receiving region of the image sensing device, a glass lid attached onto the dielectric wall and thereby sealing the light-receiving region, and a package body enclosing the structure except the top surface of the glass lid and an exterior portion of the leads.