Abstract: A lighting device disclosed in an embodiment of the invention includes a substrate; light sources disposed on the substrate; and a resin layer disposed on the substrate and the light sources. a first reflective layer disposed on the resin layer, wherein the resin layer includes an exit surface facing the light sources, and the exit surface of the resin layer includes convex portions facing each of the light sources and recess portions respectively disposed between the plurality of convex portions, concave surfaces disposed in each of the plurality of recess portions may have a curvature, and a radius of curvature of the concave surfaces may increase in one direction.

Abstract: A substrate-treating apparatus is disclosed. The substrate-treating apparatus may include a vessel configured to provide a treatment space therein, a substrate-supporting unit provided in the vessel to support a substrate, and a spraying member configured to spray treatment solution on the substrate loaded on the substrate-supporting unit. The vessel may have an inner side surface, on which at least one texture pattern is formed.

Abstract: A substrate-treating apparatus is disclosed. The substrate-treating apparatus may include a vessel configured to provide a treatment space therein, a substrate-supporting unit provided in the vessel to support a substrate, and a spraying member configured to spray treatment solution on the substrate loaded on the substrate-supporting unit. The vessel may have an inner side surface, on which at least one texture pattern is formed.

Abstract: Embodiments of the invention provide a semiconductor wafer cleaning apparatus and a related method. In one embodiment, the invention provides a semiconductor wafer cleaning apparatus comprising a wafer stage adapted to support a wafer; a first cleaning unit adapted to spray a first cleaning solution onto the wafer to remove particles from the wafer, wherein the first cleaning solution prevents static electricity from being generated on the surface of the wafer; and a second cleaning unit adapted to provide a second cleaning solution onto the wafer and oscillate a quartz rod to remove particles from the wafer, wherein the second cleaning solution makes a surface of the wafer hydrophilic.

Abstract: A chemical filter unit includes a housing, a first filter for filtering liquid chemicals, a second filter for filtering air, and a window in the housing. The housing has an outlet and an inlet through which chemicals enter and leave the filter, respectively, and an air vent that allows air to be discharged from the filter. The first filter is disposed in a path along which chemicals flow inside the housing to filter out particles contained in the chemicals, and the second filter is disposed in a path along which air leaves the filter through the air vent. The second filter includes a medium that collects particles contained in the air. The window allows the second filter to be seen from outside the housing.

Abstract: A substrate cleaning apparatus includes a bath in the form of a vessel filled with a cleaning liquid, a substrate guide disposed on the bottom of the vessel and configured to support at least one substrate vertically, a first sensing unit for sensing the substrate(s) supported by the guide, and a second sensing unit for sensing substrates or remnants thereof disposed on the bottom of the vessel. The first sensing unit has sensor elements installed on the opposite sides of the vessel as situated across from one another. The second sensing unit has sensor elements installed on both sides and on the bottom of the vessel for detecting substrates or remnants from damaged substrates lying on the bottom of the process chamber.

Abstract: A substrate cleaning apparatus includes a bath in the form of a vessel filled with a cleaning liquid, a substrate guide disposed on the bottom of the vessel and configured to support at least one substrate vertically, a first sensing unit for sensing the substrate(s) supported by the guide, and a second sensing unit for sensing substrates or remnants thereof disposed on the bottom of the vessel. The first sensing unit has sensor elements installed on the opposite sides of the vessel as situated across from one another. The second sensing unit has sensor elements installed on both sides and on the bottom of the vessel for detecting substrates or remnants from damaged substrates lying on the bottom of the process chamber.

Abstract: A battery charging circuit including a power supply circuit for providing a rechargeable battery with a charge voltage. The circuit generates a reference voltage adaptive to a surrounding temperature, which is set corresponding to the full charge voltage of the rechargeable battery. The charge voltage of the rechargeable battery is compared with the reference voltage to generate a control signal. A switching device connects and disconnects the power supply circuit from the rechargeable battery in response to the control signal to adaptively control the full charge voltage according to variations of the surrounding temperature.