Abstract: The present invention relates to a method for dipping an adhesive material, and the method for dipping an adhesive material includes dipping an adhesive material onto a first dipping stamp, transferring the adhesive material, which is dipped onto the first dipping stamp, to a target substrate, and transferring a device to the target substrate, to which the adhesive material is transferred.

Abstract: Provided is a method of fabricating a semiconductor package. The method of fabricating the semiconductor package include preparing a lower element including a lower substrate, a lower electrode, an UBM layer, and a reducing agent layer, providing an upper element including an upper substrate, an upper electrode, and a solder bump layer, providing a pressing member on the upper substrate to press the upper substrate to the lower substrate, and providing a laser beam passing through the pressing member to bond the upper element to the lower element.

Abstract: An air interface simulator and simulation method is disclosed.

Abstract: Apparatus and method for measuring air interference of base station is disclosed. The apparatus for measuring air interference of base station includes RF (Radio Frequency) switch setting measurement path to selectively measure each path and sector, which is outputted from the base station. A low noise amplifier (LNA) receives the signal output from the RF switch and amplifies the signal to be within an effective level to be read in a spectrum analyzer. A control computer controls the decoding unit and spectrum analyzer as a core of the air interference measurement set (AIMS). The decoding unit generates a decode-output to control the RF switch by receiving data from parallel port of the control computer, and the spectrum analyzer automatically performs interference-measurement in a remote state by receiving the output signal of the low noise amplifier (LNA) and then transmitting and receiving data with the control computer through general purpose interface bus.